• Title/Summary/Keyword: 기계적 접합

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Effects of Bonding Conditions on Mechanical Strength of Sn-58Bi Lead-Free Solder Joint using Thermo-compression Bonding Method (열압착 접합 조건에 따른 경·연성 인쇄회로기판 간 Sn-58Bi 무연솔더 접합부의 기계적 특성)

  • Choi, Ji-Na;Ko, Min-Kwan;Lee, Sang-Min;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.17-22
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    • 2013

  • We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

  • https://doi.org/10.6117/kmeps.2013.20.2.017 인용 PDF KSCI