• Journal of the Korean Chemical Society
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• v.33 no.1
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• pp.25-30
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• 1989

The nonstoichiometry and electrical conductivities of Tm$_2O_3$ were studied in the oxygen pressure $2\;{\times}\;10^{-1}\;-1\;{\tiems}\;10^{-4}$ atm under the temperature ranges from 700 to 1100$^{\circ}$C. The x values of $TmO_{1.5+X}$ were varied in the ranges of 0.1004∼0.0110. The enthalpies of formation of the nonstoichiometric compounds were found to be 5.40-4.71 kcal/mole, and the average activation energy obtained from the plots of log conductivity vs. 1000/T was 1.65 eV. The Po$_2$ dependencies of the electrical conductivity were found to be linear and closely approaximated to ${\sigma}{\alpha} PO{\frac{1}{2}^{/5.3}$ in the temperature range 700∼1100$^{\circ}$C. The nonstoichiometry and the electrical conductivity are due to trivalent metal vacancies.

• Journal of the Korean Chemical Society
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• v.37 no.4
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• pp.431-441
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• 1993

The structure and reactivity of ${\pi}$-and metallacycle form in the bis(trimethylphosphine) palladium(0) complexes with acrylic acid, methacrylic acid, crotonic acid(A group) and 3-butenoic acid, 4-pentenoic acid(B group) have been investigated by Molecular Mechanics and Extended Huckel Molecular Orbital method. The calculation shows that A groups with large value of frontier electron density of HOMO and LUMO produce $\pi-complexes$ instead of metallacycle. But B groups with small value of frontier electron density of LUMO, especially 3-butenoic acid, form stable metallacycle. Moreover the methyl-substituted five-membered compared with the six-membered metallacycle is energetically stable conformation.

• Journal of the Korean Chemical Society
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• v.39 no.4
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• pp.252-256
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• 1995

A study was carried out for the development of direct determination of antimony in high purity copper metal without preseparation. The large excess of copper seemed to be performed as the matrix modifier to enhance the absorbance of antimony in copper metal. Sensitivity enhancement of Sb was obtained at the condition of the ashing temperature of $600^{\circ}C(20s){\sim}700^{\circ}C(10s)$ rather than $1000^{\circ}C(20s){\sim}1100^{\circ}C(10s)$, and the atomization temperature of $2200^{\circ}C.$ The operating pressure of argon gas was readjusted to the optimum condition at 2.0 kg/$cm^2.$ The linearity of the Sb calibration graph could be obtained in the range of 20 ppb up to 200 ppb Sb in existence of 5,000 ppm Cu with the coefficient of variation of about 5%.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.469-473
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• 2017

In this study, the rheological characteristics of kerosene based gel propellants were investigated. For the gelling agent, Thixatrol$^{(R)}$ has been used with 100 nm nano-sized aluminium particle addition. Three gellant contents of 2.5 wt%, 5 wt% and 7.5 wt% kerosene gels were first investigated where aluminium particles contents of 10 wt% and 20 wt% were added to 7.5 wt% gellant case. The viscosities of each sample measured by rotational rheometer show that the viscosity augments as gellant or aluminium content increases while the 20 wt% aluminum content resulted in failure of measurement due to the agglomerations of aluminum particles.

• Journal of the Society of Naval Architects of Korea
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• v.36 no.4
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• pp.95-104
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• 1999

Use of the ultra thick plate is being continuously increased in large off-shore structures, ships, bridges and skyscraper construction, due to increasingly large-sized steel structures and it seems that this trend will be maintained. But, occurrence of the lamella tearing has been reported in ultra thick plate used for construction. It is reportedly caused by impurities such S(sulfur), P(phosphorus) and others accumulated in the ultra thick plate's centerline in the thickness direction with strip shape or by restraint residual stress caused by the welding. In the ultra thick plate made by continuous casting method, occurrence of lamination is difficult to avoid because of the properties of production procedure. Therefore, with a view to reducing the lamella properties, this report tries tearing in the steel structure in the view of welding strength rather than metallic properties, this report tries to seek the optimum groove and welding procedure by using the computer simulation based on FEM(Finite Element Method).

• Journal of the Korean Magnetics Society
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• v.8 no.5
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• pp.255-260
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• 1998

Fabrication condition and magnetic properties of ultrathin Co-based amorphous alloy have been investigated. When the ejection gas pressure was lower than 0.05 kgf/$\textrm{cm}^2$ at the roll speed of 55 m/s, ultrathin ribbons with the thickness less than 10 ${\mu}{\textrm}{m}$ were successfully obtained. The ribbon thickness decreased linearly with the decrease in ejection pressure. Moreover the significant decrease in ribbon width was accompanied with the decrease of thickness in the range of ejection pressure to form an ultrathin ribbon. This behavior was attributed to the decrease of effective ejection pressure in the both end-sides of rectangular nozzle due to the larger friction between molten metal and nozzle wall. The effective permeability at low frequency (1 kHz) decreased largely with the decrease in ribbon thickness, while the coercive force increased with the thickness decrease. It was considered that these behaviors were due to the enhancement of surface effect leading to the suppression of wall motion. However effective permeability at high frequency (1 MHz) increased with the decrease in ribbon thickness, and this was ascribed to the easier magnetization rotation owing to the reduction of eddy current.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.627-632
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• 1995

W-Cu composites utilize the high electrical conductivity of copper and arc erosion resistance of tungsten to provide properties better suited to electrical contact applications than either tungsten or copper alone. W-Cu composite materials were milled in an attritor with an impeller speed of 300rpm for various milling times. The milled powders were compacted at 300MPa into cylinders, 16m in diameter, and approximately 4m high. Sintering was performed in dry H$_2$at temperature ranging from 1200$^{\circ}C$ to 1400$^{\circ}C$. Samples were sectioned and were polished for scanning electron microscopy (SEM) of microstructures. Homogeneous W-Cu composites were formed after 10 hours mechanical alloying and could be attained 99% density at 1330$^{\circ}C$. As mechanical alloying time increased, Fe-concentration was increased linearly. Intermetallic compound formation interupted the growth of W particles Increased hardness.

• Journal of the Korean Electrochemical Society
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• v.8 no.3
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• pp.130-134
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• 2005

To the best knowledge, the formation and characterization of InSb nanowires have not been reported yet in spite of its good characteristics as a III-V compound semiconductor. The nanowire arrays were potentiostatically electrodeposited in a mixing solution of indium chloride, antimony chloride, citric acid, and potassium citrate according to our previous work on the electrodeposition of the stoichiometric InSb films. The electrical properties of nanowire arrays were measured by semiconductor parameter analyzer, and the microstructural analysis of the nanowires was conducted by employing XRD. Our experimental results indicate that the InSb nanowires have a highly preferred orientation of (220) direction and also exhibit electrical characteristics of n-type semiconductors which we, however, similar to semi-metals mainly due to their narrow band-gap and high electron mobility.

• Journal of the Korean Electrochemical Society
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• v.8 no.3
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• pp.135-138
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• 2005

We investigated the electrochemical formation of a stoichiometric III-V compound semiconductor of InSb from an aqueous citric solution. Under an? optimized electrochemical condition, not like other research results, the electrodeposited InSb are satisfied exactly with the stoichiometry. Furthermore it retains the inherent characteristics of III-V compound semiconductor, InSb without heat treatment. EPMA, XPS and XRD were employed for confirmation of its composition/stoichiometry, chemical state, and crystallographic orientation, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.17-21
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• 2017

Horizontal thin-film thermoelectric cooler has been simulated using a commercial software (ANSYS Workbench Thermal-electric). The thermoelectric cooler consists of thin-film n-type $Bi_2Te_3$, p-type $Sb_2Te_3$ thermoelectric elements, and Au electrode, respectively. The hot spot was placed under the center of device which represents Joule heating. Numerical analysis was conducted by geometric variable, and a maximum temperature difference of $13^{\circ}C$ was obtained. As from the simulation parameters, we presented an optimized design for high efficiency cooling.