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http://dx.doi.org/10.6117/kmeps.2017.24.2.017

Simulation of Horizontal Thin-film Thermoelectric Cooler for the Mobile Electronics Thermal Management  

Park, Sangkug (Department of Mechanical Engineering, Soonchunhyang University)
Park, Hong-Bum (Department of Materials Science and Engineering, Seoul National University)
Joo, Young-Chang (Department of Materials Science and Engineering, Seoul National University)
Joo, Youngcheol (Department of Mechanical Engineering, Soonchunhyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.2, 2017 , pp. 17-21 More about this Journal
Abstract
Horizontal thin-film thermoelectric cooler has been simulated using a commercial software (ANSYS Workbench Thermal-electric). The thermoelectric cooler consists of thin-film n-type $Bi_2Te_3$, p-type $Sb_2Te_3$ thermoelectric elements, and Au electrode, respectively. The hot spot was placed under the center of device which represents Joule heating. Numerical analysis was conducted by geometric variable, and a maximum temperature difference of $13^{\circ}C$ was obtained. As from the simulation parameters, we presented an optimized design for high efficiency cooling.
Keywords
Thermoelectric cooler; ANSYS Thermal-Electric; FEM simulation;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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