• Title/Summary/Keyword: 균일 온도

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컷오프 탐침과 랑뮤어 탐침을 이용한 자화유도결합플라즈마 특성 진단

  • Son, Ui-Jeong;Kim, Dong-Hyeon;Lee, Ho-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.131.1-131.1
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    • 2015
  • 플라즈마 진단법으로서 컷오프 탐침과 랑뮤어 탐침은 다양한 분야에서 많은 연구가 진행되었다. 하지만 고밀도 및 균일성 관점에서 많은 이점을 가지고 있는 자화유도결합플라즈마에서 컷오프 탐침의 적용 가능성에 대한 연구는 많이 부족하다. 본 연구에서는 두 가지 탐침법을 이용하여 전자밀도를 비교하고 각각의 특성을 분석하였다. 먼저 랑뮤어 탐침법을 이용하여 RF파워, 압력, 외부자기장에 따른 플라즈마 변수(전자밀도, 전자온도, 플라즈마 전위)를 측정하였다. 외부자기장을 인가하였을 때 전자구속으로 인하여 전 영역의 전자밀도는 증가하였지만 R방향의 전자밀도 분포는 균일하지 않았다. 반면 전자온도는 외부자기장을 인가하였을 때 챔버 중심에서 감소하였으며, 챔버 끝에서 전자온도는 증가하였다. 즉, R방향의 전자온도 분포는 U형태가 나타났다. 또한 컷오프 탐침으로 전자밀도를 측정한 결과 비교적 낮은 $10^{11}/cm^3$ 이하에서 정확한 컷오프 주파수를 확인하여 전자밀도를 구할 수 있었으며, 그 이상의 전자밀도를 갖는 경우 동축케이블의 손상 문제로 인하여 신뢰성 있는 결과를 얻기는 힘들다. 현재 이 문제를 해결하기 위한 연구가 지속적으로 진행 중이다.

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A Verification Algorithm for Temperature Uniformity of the Large-area Susceptor (대면적 서셉터의 온도 균일도 검증 알고리즘)

  • Yang, Hac Jin;Kim, Seong Kun;Cho, Jung Kun
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.10
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    • pp.947-954
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    • 2014
  • Performance of next generation susceptor is affected by temperature uniformity in order to produce reliably large-sized flat panel display. In this paper, we propose a learning estimation model of susceptor to predict and appropriately assess the temperature uniformity. Artificial Neural Networks (ANNs) and Support Vector Machines (SVMs) are compared for the suitability of the learning estimation model. It is proved that SVMs provides more suitable verification of uniformity modeling than ANNs during each stage of temperature variations. Practical procedure for uniformity estimation of susceptor temperature was developed using the SVMs prediction algorithm.

A Study to Improve Temperature Uniformity in Hot Plate Oven for Silicon Wafer Manufacturing (반도체 웨이퍼용 핫 플레이트 오븐에서 온도 균일도 향상을 위한 연구)

  • Lee, Sei-Young;Cho, Hyung-Hee;Lee, Young-Won
    • Proceedings of the KSME Conference
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    • 2000.11b
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    • pp.261-266
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    • 2000
  • Temperature variation during silicon wafer baking is mainly due to natural convection caused by temperature difference between silicon wafer and upper plate. Several cases are tested and calculated numerically to improve temperature uniformity. The temperature difference and velocity magnitude in the flow cell is reduced for a small gap between the wafer and upper plate because the natural convection force is suppressed in the small space. The uniform temperature distribution can be obtained with controling the incoming flow distribution from the upper plate. An alternative method is the adiabatic wall condition on the upper plate to maintain the temperature uniformity within $0.3^{\circ}C$ on the water plate.

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TRIPLE SOLUTIONS IN NATURAL CONVECTION OF A FLUID IN A HORIZONTAL ANNULUS WITH CONSTANT TEMPERATURE WALLS (일정 온도 벽면을 갖는 수평 환형공간 내의 유체의 자연 대류에서의 삼중해)

  • Yoo, Joo-Sik
    • Journal of computational fluids engineering
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    • v.22 no.1
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    • pp.110-115
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    • 2017
  • Natural convection of a fluid with the Prandtl number of 7(water) in a horizontal annulus with constant temperature walls is numerically investigated. The inner cylinder is hotter than the outer cylinder. The flows are classified by the number of eddies in a half annulus. It is found that dual or triple solutions exists above a critical Rayleigh number for an annulus with a aspect ratio $D_i/L=4$. Transitions of $3{\rightarrow}1$ and $2{\rightarrow}1$ eddy flow occur with decrease of Rayleigh number. However, reverse transitions of $1{\rightarrow}3$ and $1{\rightarrow}2$ eddy flow do not occur with increase of Rayleigh number, and no hysteresis phenomenon is observed. In the regime of triple solutions, the 3 eddy flow has the largest mean Nusselt number value and the 1 eddy flow has the smallest value.

Development of an Atmospheric Pressure Plasma Source for Resist Removal on 12 Inch Si Wafers

  • Yu, Seung-Yeol;Seok, Dong-Chan;Park, Jun-Seok;Yu, Seung-Min;No, Tae-Hyeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.488-488
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    • 2012
  • 상압에서 12인치 실리콘 웨이퍼 표면처리가 가능한 장치를 개발하였다. 배치타입 공정으로 플라즈마 발생 전극은 직경 340 mm의 대면적 원형 형태을 가지고 있다. 시스템은 탈부착이 가능한 플라즈마 모듈부와 공정챔버로 나누어지며 균일도를 높이기 위해 웨이퍼스테이지는 가열, 회전 및 축간 조절이 가능하게 설계하였다. 플라즈마발생은 DBD 전극방식을 채용하고 있으며 공정가스흐름 및 전극배열 등을 연구하였다. 또한, 기판 온도, 가스 조합 등의 공정파리미터를 변화시켜가며 높은 애슁 속도 및 균일도를 얻기 위한 실험이 진행되었다. 주파수 15 kHz, 인가 파워 7 kW, 시편 가열 온도 95도, 60 rpm, 80 spm에서 분당 200 nm의 PR제거율을 확인하였다.

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Interpretation for inductive heating in MOCVO system to deposit white LED (백색 LED증착용 MOCVD장치의 유도 가열 해석)

  • Hong, Kwang-Gi;Ju, Jeong-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2009.10a
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    • pp.240-240
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    • 2009
  • 오늘날 반도체 기술의 획기적인 발전에 의해서 마침내 에디슨의 탄소 필라멘트 백열전구를 대체할 수 있는 "반도체 필라멘트"라 불리는 고출력 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 공정은 기판의 온도 균일도를 향상시키는 것이 매우 중요하다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 둥이 장비의 설계 요소이다. 본 연구에서는 기관과 induction heater의 간격에 따른 온도를 thermal imaging camera (Fluke, Ti-10)을 이용하여 측정하였다.

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The study on enhanced micro climate of the oyster mushroom cultivation house with multi-layered shelves by using CFD analysis (CFD 분석에 의한 느타리버섯 재배사 환경균일성 향상 연구)

  • Lee, Sung-Hyoun;Yu, Byeong-Kee;Lee, Chan-Jung;Lim, Yeong-Taek
    • Journal of Mushroom
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    • v.15 no.1
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    • pp.14-20
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    • 2017
  • The oyster mushroom cultivation house typically has multiple layers of growing shelves that cause the disturbance of air circulation inside the mushroom house. Due to this instability in the internal environment, growth distinction occurs according to the area of the growing shelves. It is known that minimal air circulation around the mushroom cap facilitates the metabolism of mushrooms and improves their quality. For the purpose of this study, a CFD analysis FLUENT R16 has been carried out to improve the internal environment uniformity of the oyster mushroom cultivation house. It is found that installing a section of the working passage towards the ceiling is to maintain the internal environment uniformity of the oyster mushroom cultivation house. When all the environment control equipment - including a unit cooler, an inlet fan, an outlet fan, an air circulation fan, and a humidifier - were operated simultaneously, the reported Root Mean Square (RMS) valuation the growing shelves were as follows: velocity 23.86%, temperature 6.08%, and humidity 2.72%. However, when only a unit cooler and an air circulation fan operated, improved RMS values on the growing shelves were reported as follows: velocity 23.54%, temperature 0.51%, and humidity 0.41%. Therefore, in order to maintain the internal environment uniformity of the mushroom cultivation house, it is essential to reduce the overall operating time of the inlet fan, outlet fan, and humidifier, while simultaneously appropriately manage the internal environment by using a unit cooler and an air circulation fan.

Design of Chamber in Continuous Furnace for Uniform Temperature Distribution (균일 온도를 유지하는 연속 소성로 체임버의 설계)

  • Lee, Kwangju;Choi, Joon Hyeok;Jang, Han Seul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.11
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    • pp.5344-5351
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    • 2013
  • Chambers in a continuous furnace were designed. A chamber consists of inlets and outlets of nitrogen gas which is used to discharge burned gas and heating pipes (HP) which are used to keep temperature of fired materials at $1,300^{\circ}C$. Design variables were numbers of inlets and outlets, distance between floor and lower HP ($h_1$), distance between lower HP and fired materials ($h_2$), distance between fired materials and upper HP ($h_3$), temperature of HP, numbers of HP and distance between HP. The numbers of inlets and outlets were determined so that nitrogen gas formed a laminar flow for efficient discharge. All other design variables were determined so that temperature of fired materials is as uniform as possible near $1,300^{\circ}C$. Chambers were produced and temperature was measured at 21 points using thermocouples. The largest deviation from $1,300^{\circ}C$ was less than ${\pm}2.2^{\circ}C$.

티타늄 선삭 공구수명 향상을 위한 공구냉각기술

  • Lee, Seok-U
    • Journal of the KSME
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    • v.56 no.7
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    • pp.51-54
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    • 2016
  • 이 글에서는 티타늄 합금의 절삭가공 시 공구수명을 향상시키기 위해 적용하는 액체질소를 사용한 극저온가공에서, 공구의 냉각 균일성을 향상시키기 위한 방법으로 극저온간접냉각(Indirect cryogenic cooling) 방식을 소개한다.

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