• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Computational Structural Engineering
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• v.8 no.4
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• pp.87-97
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• 1995

For the same configuration of two-dimensional finite element models, 6-node element exhibits stiffer bending stiffness than 8-node element. This is true in the relation between 16-node element and 20-node element for three-dimensional model. This stiffening phenomenon comes from the elimination of several mid nodes from full-node elements. Therefore, this may be called 'relative stiffness stiffening phenomenon'. It seems that there are a couple of ways to correct the stiffening effect, however, we could find only one effective method-the method of modification of Gauss sampling points-which passes the patch test and does not alter other kinds of stiffness, such as extensional stiffness. The quantity of modification is a function of Poisson's ratios of the constituent materials. We could obtain two modification equations, one for plane stress case and the other for plane strain case. This method can be extended to 3-dimensional solid elements. Except the exact plane strain cases, most 3-dimensional plates could be modeled successfully with 16-node element modified by the equation for the plane stress case. The effectiveness of the modification method is checked by applying it to several examples with excellent improvements. In numerical examples, beams with various boundary conditions are subjected to static and time-dependent loads. Free and forced motion analyses of beams and plates are also tested. The beam and plate may be composed of isotropic multilayers as well as a single layer.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.45-51
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• 2020

As flexible electronics will be used under high temperature and high humidity with repeated bending deformations, the effects of environmental condition and repeated mechanical deformations are considered simultaneously to achieve long-term reliability. In this study, the mechanical reliability of metal electrodes (Al, Ag, Cu) deposited on flexible polymer substrate is investigated under 4 different conditions: with and without repeated mechanical deformations and normal environmental or high temperature and high humidity conditions (85℃/85%). The mechanical failure does not occur in all the metal electrodes without mechanical deformation even under high temperature and high humidity conditions. The electrical resistance of metal electrode increased about 400% to 600% after 100,000 bending cycles under normal condition. For high temperature and high humidity condition, the electrical resistance of Al and Ag increased similarly. However, the resistance of Cu during bending fatigue test under high temperature and high humidity condition increased over 90000% because of the combined effect of corrosion and mechanical fatigue. This study can give a helpful information for designing electrode materials with high mechanical reliability under high temperature and high humidity.

• Journal of the Korea Convergence Society
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• v.7 no.2
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• pp.43-52
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• 2016

The purpose of this study was to suggest the effective squat exercise position to strengthening vastus medialis oblique, and vastus lateralis in quadriceps. Subjects were twenty patients with patellofemoral pain syndrome (PFPS) volunteered to participate in this study. All subjects were applied to static squat convergence exercise with knee flexed $45^{\circ}$, $60^{\circ}$, and $90^{\circ}$ for 30 seconds total 5 times. Measurement variables were maximal voluntary isometric contraction (MVIC) of the quadriceps, Q angle and length of thigh. Those were measured before and after the squat exercise on knee joint angle, change rate of which were used for statistical analysis. As a result, squat exercise with knee flexed $90^{\circ}$ increase significantly among knee joint angle in the MVIC change rates of quadriceps (p<.05), however the rates of Q-angle and length change of thigh showed no significant difference. Therefore, this findings suggest that squat exercise with knee flexed $90^{\circ}$ strengthen quadriceps effectively in patients with PFPS.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.75-82
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• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.

• The korean journal of orthodontics
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• v.25 no.2 s.49
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• pp.187-200
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• 1995

To estimate the characteristics of Korean Ni-Ti alloy orthodontic wire, this study investigated compositions, tensile properties, bending properties, heat treatment effects, and ion releasing degrees, and compared these characteristics to those of the imported Ni-Ti alloy wire. The results obtained are as follows ; 1. Ti and -Ni elements in ORTHOLLOY were in a range showing superelasticity, and there was a little difference in the Ni and Ti contents of ORTHOLLOY as compared with those of SENTALLOY. 2. The results of the tensile test concerning ORTHOLLOY exhibited a superelastic effect, indicating an area of a definite amount of stress in spite of the changes in the range from $2\%\;to\;8\%$ in the strain rate. 3. ORTHOLLOY presented higher load values than SENTALLOY in the same deflection values when the wire was tested in three-point bending. A load range displaying a superelastic effect was 80-l00g, 140-l80g, and 130-200g respectively, in wire diameters of 0.014', 0.016', and 0.018' 4. By heat treatments at $400^{\circ}C$ and at $500^{\circ}C$, a load range showing the effect of superelasticitly was lessened by the duration of the heat treatment time. The superelastic effect was destroyed as a result of the 10 minutes heat treatment at $600^{\circ}C$. 5. The quantity of the Ni ion released from ORTHOLLOY, tended to be greater than the amount of released Ni ion in SENTALLOY. The Co ion released was very little(<0.01ppm) in SENTALLOY and ORTHOLLOY irrespective of the lapse of time. Released Ni ions on the 1st day were at the maximum, and the releasing rate showed plateaus after three days. 6. The surface morphology of SENTALLOY was relatively regular irrespective of the lapse of rime, and the corrosion tendency was not observed. However, the surface morphology of ORTHOLLOY was rather irregular and shelved fitting corrosion after immersion.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Composites Research
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• v.31 no.2
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• pp.69-75
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• 2018

In this study, a grid panel structure in which the woven CFRP composites were stacked in the orthogonal array was proposed and the mechanical properties were analyzed and studied. The grid parts were fabricated by cutting prepregs and laminating them. The grid panel structure was fabricated by co-curing with lower laminate plate in auto-clave process. The behavior of the proposed grid panel structure was evaluated by tests under tensile, compressive, shear, and bending loads. The effect of increasing the stiffness of the orthogonal grid structure was verified through these tests. In addition, the finite element model was constructed and compared with the test results, confirming the validity and reliability of the test and analysis.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2011.03a
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• pp.104-104
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• 2011

섬유가 가늘어지면 굽힘 강성이 저하되고 비표면적이 증가하는 등의 많은 특징을 발휘한다. 특히 폴리에스테르 극세사는 실크와 같은 외관, 유연한 태 등의 감각적으로 우수한 특성을 가지므로 제품의 태에 대한 질적 향상을 요구하는 소비자의 욕구와 맞아떨어져 다양한 용도로 전개되고 있다. 초극세 섬유를 제조하는 방법은 통상적으로 멜트블로운법, 플래쉬법, 전기방사법 그리고 해도형 복합방사법의 4가지로 분류된다. 그중 해도형 복합방사법은 가장 안정적인 방법으로 PET기준으로 0.01데니어 급까지 상용화가 되어 있다. 해도형 복합섬유의 개발에 있어서 중요한 것 중에 하나가 해성분 폴리머의 용출기술이다. 초극세화를 목적으로 해성분인 변성폴리에스테르를 제거시키기 위해서 실시되는 알칼리(NaOH)에 의한 감량공정은 그 처리조건에 따라서 초극세사로 잔존해야하는 도성분의 정규 폴리에스테르까지 손상시킬 수 있기 때문에 균일한 용출조건의 확립은 매우 중요하다. 그러나 초극세화가 진행될수록 알칼리가 필라멘트의 가운데 영역까지 균일하게 침투하기가 어려우며 감량된 도성분도 비표면적이 증가하기 때문에, 해성분의 균일한 용출 및 감량을 위한 안정적인 조건을 선정하기가 어렵다. 따라서 본 연구에서는 울트라마이크로-나노급(800nm) 해도형 폴리에스테르 섬유를 이용하여 해성분 용출공정에서 정규 폴리에스테르를 손상시킬 수 있는 알칼리 감량 조건을 완화시키면서 기존과 동일한 감량 효과를 얻을 수 있는 용출 공정을 확립하고자 한다. 이를 위하여 유기산을 이용한 전처리 조건 및 알칼리 감량공정에서 NaOH의 농도, 처리시간, 처리온도의 변화가 울트라마이크로-나노급 해도형 섬유의 용출에 미치는 영향에 대하여 검토하였다.