• Journal of the Korean Society for Precision Engineering
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• v.15 no.12
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• pp.220-225
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• 1998

압축성 초탄성 평판의 순수굽힘에 대한 비선형 변형해석의 수학적 정해가 본 논문에 구해져 있다. 이차원 평면 변형도 상태가 해석을 위하여 가정되었으며, 비선형 순수굽힘 변형해석결과는 고전적인 선형 순수굽힘 변형해석결과와 비교되었다. 고전적인 선형굽힘 결과와는 다르게 비선형 순수굽힘 상태에서는 반경방향응력은 영이 아니며 또한 각방향응력도 선형 상태가 아닌 것으로 규명되었다.

• Proceedings of the Korean Society of Computer Information Conference
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• 2022.01a
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• pp.341-344
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• 2022

본 논문에서는 삼각형 메쉬 기반에서 변형률 기반 동역학(Strain-based dynamics, SBD)을 안정적으로 표현할 수 있는 굽힘 스프링 구조와 감쇠 기법에 대해 설명한다. SBD는 삼각형 메쉬의 에지 길이(Edge length) 기반의 에너지 대신 변형률(Strain)을 활용하여 에너지를 모델링한다. 하지만, 비정상적인 삼각형(Degenerate triangle)인 경우 변형률이 불안정하게 계산되어 잘못된 방향으로 늘어나는 문제가 발생한다. 본 논문에서는 이러한 문제를 효율적으로 처리할 수 있는 굽힘 스프링(Bending spring) 구조에 대해 소개한다. 결과적으로 본 논문에서 제안하는 기법은 안정적으로 SBD를 처리할 수 있기 때문에 다양한 재질의 옷감 시뮬레이션을 안정적으로 표현할 수 있도록 한다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.23-28
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• 2024

Electronic products utilizing flexible devices experience harsh mechanical deformations in real-use environments. As a result, researches on the mechanical reliability of these flexible devices have attracted considerable interest among researchers. This study employed previous bending strain models and finite element analysis to predict the maximum bending strain of metal films deposited on flexible substrates. Bending experiments were simulated using finite element analysis with variations in the material and thickness of the thin films, and the substrate thickness. The results were compared with the strains predicted by existing models. The distribution of strain on the surface of film was observed, and the error rate of the existing model was analyzed during bending. Additionally, a modified model was proposed, providing mathematical constants for each case.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.17 no.2
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• pp.171-181
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• 2004

This paper developed the theoretical method to predict structural performances and weight reduction rates of a carbody when its materials should be substituted. For the material substitution design of the carbody, the bending, axial and twisting deformations are evaluated under the constant stiffness and strength conditions. For the design of the primary structures such as the center beams, the cross beams and the cantrails, the bending and axial deformations are investigated under the condition of the constant bending stiffness, the constant bending or buckling strength by considering both the material properties and the cross sectional shapes. The developed indices to measure the weight reduction by the material substitution give good informations on the weak and strong points of a carbody design.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.1
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• pp.53-63
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• 2016

Wheel dynamometers are used to measure dynamic load that is conveyed from the road to a vehicle while driving. In this paper, two types of six-component wheel dynamometers utilizing shear deformation and bending deformation were designed and evaluated. Prior to designing the shear and bending type wheel dynamometers, the shear and bending deformation behaviors of the basic structure of the wheel dynamometer itself were analyzed using finite element analysis. Strain analysis was performed repeatedly in order to obtain a similar output sensing strain for each load component. The design was modified with a bridge circuit in order to minimize coupling strain. The results indicated that the shear type dynamometer was expected to obtain stable characteristics due to uniform strain distribution while the bending type dynamometer was expected to obtain high-quality sensitivity performance due to consistent output sensitivity.

• Composites Research
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• v.18 no.1
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• pp.30-37
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• 2005

The bending strength characteristics and local deformation behaviors of honeycomb sandwich composites were investigated using three-point bending experiment and finite element simulation with a real model of honeycomb core. Two kinds of cell sizes of honeycomb core, two kinds of skin layer thicknesses, perfect bonding specimen as well as initial delamination specimen were used for analysis of stress and deformation behaviors of honeycomb sandwich beams. Various failure modes such as skin layer yielding, interfacial delamination, core shear deformation and local buckling were considered. Its simulation results were very comparable to the experimental ones. Consequently, cell size of honeycomb core and skin layer thickness had dominant effects on the bending strength and deformation behaviors of honeycomb sandwich composites. Specimens of large core cell size and thin skin layer showed that bending strength decreased by $30\~68\%$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.47-52
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• 2017

Recently, a great attention has been paid to the mechanical behavior of ITO (Indium Tin Oxide) film, which is widely used in current smart devices due to its excellent electrical properties and transparency. In this study, the reliability of ITO thin films on flexible substrates was investigated using bending test and bending fatigue test. According to the relative position of ITO and substrate, the experiment was conducted on both outer and inner bending conditions. Inner bending condition exhibited superior electrical stability compared to outer bending test. The electrical resistance during outer bending fatigue test significantly increased compared to that in the inner bending fatigue. The crack nucleation and propagation differs according to the stress state and they have a great influence on the electrical resistance. The crack morphologies were observed by scanning electron microscopy.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.29-32
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• 1994