• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.285-288
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• 2007

Numerical study of the influence of the boundary layer of micro-supersonic jet impinging on a flat plate with a hole was performed, to investigate the role of gas jet to eject melted materials from the cut zone in the laser machining. The detailed shock structures and the information of the mass flow rate through the hole were compared to the results of the previous study, in which the effects of boundary layer inside nozzle was not accounted. It was found that the boundary layer inside the micro- nozzle introduced stronger Mach disc over the machining zone, and thus that the mass flow rate through the hole decreased.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1632-1642
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• 1992

When a blind hole of small diameter is drilled in the field of residual stress, strain relieved around the hole is function of magnitude of stress, patterns of stress distribution and hole geometry of diameter and depth. Relieved strain coefficients can be calculated from FEM analysis of relieved strain and actual stress. These relieved strain coefficients make it possible to measure residual stress which vary along the depth in the subsurface of stressed material. In this study, the calibration tests of residual stress measurement are carried out by drilling a hole incrementally on the cantilever or on the tensile test bar. Residual stresses can be determined from measured strains around a shallow hole by application of power series method. For the sake of reliable measurement of residual stress, much efforts should be done to measure relieved strains and hole depth more accurately comparing with conventional procedures of gage subject to the external load. Otherwise linear equations converting strains into stresses may yield erratic residual stresses because of ill-conditions of linear equations. With accurate measurements of relieved strains, residual stress even if varying along the depth can be measured. It is also possible to measure residual stress in the thin film of material by drilling a shallow hole.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.292-307
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• 2002

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.97-101
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• 2005

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.100-104
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• 2001

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.231-238
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• 2002

미세 절삭에 의한 마이크로 형상가공 및 이를 이용한 미세금형 가공기술개발을 위하여 절삭 공구를 이용한 기계적 미세 가공법에 대한 고찰과 더불어 shaping, end-milling, drilling 등의 가공이 가능한 기계적 미세 가공시스템을 구성하고 이를 이용한 미세 치형 그루브와 미세 격벽 등 미세 형상 구조의 금형 개발을 위한 가공실험을 수행하였다. 본 실험에서는 먼저 shaping 방식으로 세 종류의 다이아몬드 바이트를 사용하여 알루미늄, PMMA, Nickel, 황동 등의 소재에 pitch $150{\mu}m$, 높이 $8{\mu}m$ 내외의 미세 치형의 금형 코어를 가공하였고, 다음으로 Z축에 air spindle을 설치하여 $\phi0.2mm$의 end-mill(WC)을 사용하여 황동 소재에 깊이 $200{\mu}m$, 폭 $200{\mu}m,\;100{\mu}m,\;50{\mu}m,\;30{\mu}m$의 두께 변화를 주어 미세 격벽에 대한 가공실험을 하였다. 미세 구멍가공실험으로는 drilling 전용장비를 구성하여 $\phi0.6\~0.15mm$의 drill공구로 SM45C와 세라믹$(Si_3N_4-BN)$ 소재에 스텝이송방식에 의한 미세 구멍 가공 실험을 실시하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.316-320
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• 1992

기계나 구조물등의 부재는 비금속 개재 물이나 가공과 같은 자연 결함과 함께 볼트구멍이나 기름구멍등의 인공 결함들을 가지고 있다. 이러한 인공 결함들은 초기 결함으로서 작용을 하여 반복되는 낮은 응력을 받을 경우 응력 집중원이 되고, 피로파괴의 원인이 된다. 이런 기계구조물에 대한 안전성 보장을 위하여, 금속재료의 제조 및 가공 공정상의 질적 개선과 함께 최적 설계가 강조되고 피로파괴 현상에 대한 많은 연구가 요구되고 있다.

• Journal of Industrial Technology
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• v.19
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• pp.1-7
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• 1999

This is the pre-study to pile up the basic technique for the electro-discharge machining in the field of micro-drilling. The machined chips are flowed out from the machining area by the flow arisen from the high speed rotation of the electrode. The cylindrical shape electrode, whose diameter is 0.5mm, is clamped by the three point clamping type clamper and the clamper is attached at the front shaft of the high speed rotating DC motor. The current for machining is controlled by pulse width modulation technique and the machining conditions such as frequency and duty ratio are changed to find out the effect of the variables for machined results.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.1
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• pp.18-23
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• 2005

This paper reports experimental results on microdrilling process for silicon parts used in semiconductor equipments. An experimental system was developed consisting of a high speed precision machine, microscope system, and project profile instrument. The experimental results indicate that the amount of chipping at the entrance and exit of micro hole decreases as the spindle speed increases up to 18,000 rpm. At higher spindle speed, however, the amount of chipping increases rapidly. The amount of chipping and infeed rate show proportional relationship up to 20 m/min of infeed rate. Beyond that infeed rate, however, sudden increase in the amount of chipping has occurred.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1056-1059
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• 2001

These days, as dynamic function and special properties to compare traditional material, $Al_20_3$ ceramic use all over the industry. But it is very difficult to process because of high hardness and brittleness. Therefore, in this paper, it was investigated that laser process parameter which can produce appropriate quality of $Al_20_3$ ceramic microhole machining.