• Proceedings of the KWS Conference
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• 2006.05a
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• pp.227-229
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• 2006

3차원 실장을 하기 위해서 딥핑 방법으로 전기적 신호를 전달할 수 있는 비아를 가진 실리콘 웨이퍼를 제작하였다. 레이저를 이용하여 실리콘 웨이퍼에 개구부가 원형에 가까운 관통 홀을 형성하였다. 관통 홀의 벽에 도금 방법으로 시드 층을 형성하였다. 관통 홀의 충전 금속은 Sn-3.5Ag-0.7Cu 솔더를 사용하였다. 딥핑 방법으로 시드 층과 솔더 사이의 확산 현상 이용하여 전기적 신호를 전달 할 수 있는 비아를 형성하였다. 비아 내부에 일부 기공과 크랙이 발견되기도 했으나 딥핑 방법을 통해서 빠른 시간 내에 비아를 가진 실리콘 웨이퍼를 제작 할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.29-36
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• 2007

The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.55.2-55.2
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• 2007

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.75-75
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• 2010

3D 패키징 기술은 전기소자의 소형화, 고용량화, 저전력화, 높은 신뢰성등의 요구와 함께 그 중요성이 대두대고 있다. 이러한 3D 패키징의 연결방법은 와이어 본딩 또는 플립칩등의 기존의 방법에서 TSV(Through Silicon Via)를 이용하여 적층하는 방법이 주목받고 있다. TSV는 기존의 와이어 본딩과 비교하여 고집적도, 빠른 신호전달, 낮은 전력소비 등의 장점을 가지고 있어 많은 연구가 진행되고 있다. TSV의 세부 공정 중 비아필링(Via filling)기술은 I/O수 증가와 미세피치화에 따른 비아(Via) 직경의 감소 및 종횡비(Via Aspect Ratio)증가로 인해 기존 필링 공정으로는 한계가 있다. 기존의 비아 홀(Via hole)에 금속을 필링하기 위한 방법으로 전기도금법이 많이 사용되고 있으나, 전기도금법은 전기도금액 조성, 첨가제의 종류, 전류밀도, 전류모드 등에 따라 결과물에 큰 차이가 발생되어, 최적공정조건의 도출이 어렵다. 또한 20um이하의 비아직경과 높은 종횡비로 인하여 충진시 void형성등의 문제점이 발생하기도 한다. 본 연구에서는 용융솔더와 진공을 이용하여 비아를 필링시켰다. 이 방법은 관통된 비아가 형성된 웨이퍼 양단에 압력차를 주어, 작은 직경을 갖는 비아 홀의 표면장력을 극복하고, 용융상태의 솔더가 관통된 비아 홀 내부로 필링되는 방법이다. 관통 비아홀이 형성 된 웨이퍼 위에 솔더페이스트를 $250^{\circ}C$이상 온도를 가해 용융상태로 만든 후 웨이퍼 하부에 진공을 형성하여 필링하는 방법과 용융솔더를 노즐을 통하여 위쪽으로 유동시켜 그 위에 비아홀이 형성된 웨이퍼를 접촉하고 웨이퍼 상부에 진공을 형성하여 필링하는 방법으로 실험을 각각 실시하였다. 이 때, 웨이퍼 두께는 100um이하이며 홀 직경은 20, 30um, 웨이퍼 상부와 하부의 진공차는 약 0.02~0.08Mpa, 진공 유지시간은 1~3s로 실시하여 최적 조건을 고찰하였다. 각 조건에 따른 필링 후 단면을 전자현미경(FE-SEM)을 통해 관찰하였다. 실험 결과 0.04Mpa 이상에서 1s내의 시간에 모든 비아홀이 기공(Void)없이 완벽하게 필링되는 것을 관찰하였으며 이 결과는 기존의 방법에 비하여 공정시간을 감소시켜 생산성이 대폭 향상 될 수 있는 방법임을 확인하였다.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.28 no.6A
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• pp.853-859
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• 2008

As a new system of steel pipe pile cap reinforcement, the application of perforated flat bar bolted to the steel pipe pile head was suggested for the improvement of structural performance of footing structure. This study investigates the structural characteristics of perforated flat bar shear connectors according to shape and diameter of hole, number of rebars passing through the hole and the depth of settlement. The result shows several requirements to ensure sufficient pull-out resistance and ductility such as that the hole diameter excluding diameter of rebar should exceed the size of aggregates; the hole should be perforated with diameter as the half of plate height; and the adequate depth of settlement should be ensured for the optimal performance.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.304-310
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• 2001

Cracks at mechanical fastener holes usually nucleate as elliptical comer cracks at the faying surface of the mechanical joints and grow as elliptical arc through cracks after penetrating the opposite surface. In this study mode I, II and III stress intensity factors at two surface points of elliptical arc through cracks at mechanical fastener holes are analyzed by applying weight function method. The weight function method for two dimensional mixed-mode problem is extended to three dimensional one and it is verified.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.24-30
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.117-123
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• 2014

Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.28 no.3A
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• pp.331-340
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• 2008

This study is to suggest the details of new concept of bridge deck. Experimental studies on the behavior of a inverted T-shaped steelconcrete composite deck were carried out. The part of inverted T-shaped steel is embedded in concrete. Reinforced concrete deck specimen and composite deck specimens were fabricated and static bending fracture tests were conducted. The ultimate strength and fracture strength of specimens were evaluated. The effects of shear hole crossing bars of composite deck were also analyzed. From the results of experiments, composite deck with shear hole crossing bar increased shear strength, and showed typical tensile failure. Ultimate strength and fracture strength of composite deck with shear hole crossing bar are higher than those of reinforced concrete deck. The displacement of composite deck is higher than that of reinforced concrete deck.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.9
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• pp.481-487
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• 2019

Additive manufacturing is a state-of-the-art manufacturing process technology in which three-dimensional structures are fabricated by laminating two-dimensional sections of a structure using various materials such as plastic, ceramics, and metals. The additive manufacturing technology has the advantage of high design freedom, while the surface property (roughness) of the finished product varies depending on the process conditions, which necessitates performing a post-process after the products are manufactured. In this study, the surface roughness of a structure made of polyamide 12, which was manufactured by SLS (Selective Laser Sintering) and MJF (Multi Jet Fusion) process was compared. The processing condition was classified by the building orientation of structure as 0, 45, and 90 degrees, which is the angle between the analytical surface and the horizontal plane of the fabrication platform. Structures with a hole of various diameters ranging from 1mm to 10mm were manufactured and the hole characteristics (ratio of hole depth to diameter) and results of the specimens were compared. As a result of the surface characteristics analysis, the surface roughness value of the specimens manufactured with a building orientation of $45^{\circ}$ was the highest in both technologies. In the case of the through-hole structure fabrication, the shape was maintained with 5mm and 10mm diameter holes regardless of the building orientation, although the hole forming was difficult for the smaller holes.