• Title/Summary/Keyword: 공정조합

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A Study on Developing of Soldering Flux (납땜 플럭스 개발에 관한 연구)

  • 이통영
    • Fire Science and Engineering
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    • v.14 no.2
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    • pp.33-38
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    • 2000
  • Flux, essentially used in soldering process of PCB (Printed Circuit Board) in electronics industry, contains IPA (Isopropyl alcohol) and methanol, which are highly inflammable and explosive. Hazard Chemical Controlling Law classified methanol as toxic material and Environmental Law classified methanol as VOC (Volatile Organic Compound). So there have been pressing needs of developing substitutes for the existing Flux. New solvent which is non-flammable and main component is DCP having same specific character of the existing Flux. It's been combirated with proper composition ratio adding stabilizer. As a result, it relieved working Environment Allowance thickness 200 ppm to 470 ppm, chance of not been soldered 0.083% to 0%, spread 85% to 87%, power saving resistance 1.0$\times$$10^{12}$$\Omega$ to 6.9$\times$$10^{12}$$\Omega$, which means a lot better than the existing Flux. Therefore, Flux confirmed the chance of improving productivity, safety, environment safety and quality. Also, Flux got a satisfied result after product quality test and product reliability test.

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The latest movement of PVD coating for industrial application (산업용 PVD코팅 기술 최근 동향)

  • Im, Sang-Won
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.33-55
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    • 2016
  • PVD(Physical Vapour Deposition)코팅은 70년대 미국의 Multi-arc이란 기업에 의해 질화물계나 탄화물계 피막 증착이 가능한 아크이온플레팅(Arc Ion Plating) 기술이 산업에 소개되어, 주로 내마모나 내구성을 요구하는 금형, 절삭공구, 산업용 부품 분야 등에 적용되면서 꾸준한 성장세를 거듭해 왔다. 최근 들어 PVD기술은 그 수요의 급증과 더불어 보다 진화된 형태의 코팅장치 및 코팅피막들이 산업에 소개 되고 있다. 먼저 절삭가공분야에는 new composition, nano composite, multi-element composition, multi-layer, SML(Self Modification Layer)등의 코팅피막들이 단독 또는 조합된 형태로 개발되어 철계 소재를 대상으로 고경도 소재의 고속가공, 저경도~중경도 소재의 중속~고속 광범위영역에서 동시 절삭을 가능케 하였고, 비철.비금속 소재 절삭용으로 종전의 가스방식의 DLC(a-C:H)코팅을 훨씬 능가하는 ta-C Plus(Ultra super DLC) 코팅이 개발되어 고 Si함량의 Al-Si계 합금, Cu-W계, 고 섬유 CFRP, CFRM 및 반소결 상태의 세라믹 소재들을 황삭에서 정삭까지 단일 공정으로 절삭이 가능한 고성능 공구들이 개발보급되고 있다. 금속 성형분야에는 고장력 강판을 냉간에서 성형 가능한 Lubricative multi-layer coating, 열간 또는 고온에서 성형이 가능한 functional multi layer과 이형성이 더한층 개선된 dimpled(or embossed) functional multi layer 코팅들이 개발되어 산업현장에 빠르게 확산되고 있다. PVD 코팅의 또 다른 주요 적용분야로 의료분야를 들 수 있는데, 이는 코팅의 대다수가 고경도의 생체친화적인 특성을 가진데 착안되었으며, 흔히 현대성 질환이라 일컫는 과민성 체질, 과체중 및 허약체질 환자의 증가와 각종 재해 및 사고의 증가 및 인간 수명 증가에 따른 인공적인 시술의 요구증가에 편승하여 이 분야의 시장 또한 가파르게 성장하고 있다. 또한 대량으로 양산 적용단계에 접어든 자동차 핵심부품들을 비롯해서 각종 산업용, 방산용 기계 부품에도 성능 향상, 내구성 향상, 환경친화성 등 다양한 목적으로 확대 적용되고 있는 사례들을 본 발표를 통해 간략하게나마 소개하고자 한다.

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DLC Structure Layer for Piezoelectric MEMS Switch (압전 MEMS 스위치 구현을 위한 DLC 구조층에 관한 연구)

  • Hwang, Hyun-Suk;Lee, Kyong-Gun;Yu, Young-Sik;Lim, Yun-Sik;Song, Woo-Chang
    • Journal of Satellite, Information and Communications
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    • v.6 no.1
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    • pp.28-31
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    • 2011
  • In this paper, a new set of structural and sacrificial material that is diamond like carbon (DLC)/photoresist for high performance piezoelectric RF-MEMS switches which are actuated in d33 mode is suggested. To avoid curing problem of photoresist sacrificial layer, DLC structure layer is deposited at room temperature by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) method. And lead zirconate titanate (PZT) piezoelectric layer is deposited on structure layer directly at room temperature by rf magnetron sputtering system and crystallized by rapid thermal annealing (RTA) equipment. Particular attention is paid to the annealing of PZT film in order to crystallize into perovskite and the variation of mechanical properties of DLC layer as a function of annealing temperature. The DLC layer shows good performance for structure layer in aspect to Young's modulus and hardness. The fabrication becomes much simpler and cheaper with use of a photoresist.

Measurement System for Phosphor Dispensing Shape of LED Chip Package Using Machine Vision (머신비전에 의한 LED Chip Package 형광물질 토출형상 측정)

  • Ha, Seok-Jae;Kim, Jong-Su;Cho, Myeong-Woo;Choi, Jong-Myung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.5
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    • pp.2113-2120
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    • 2013
  • In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.

Effect of Water Temperature on Heat Transfer Characteristic of Spray Cooling on Hot Steel Plate (냉각수온 효과에 따른 고온 강판의 스프레이 냉각 열전달 특성 연구)

  • Lee, Jung-Ho;Yu, Cheong-Hwan;Park, Sang-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.503-511
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    • 2011
  • Water spray cooling is a significant technology for cooling of materials from high-temperature up to $900^{\circ}C$. The effects of cooling water temperature on spray cooling are mainly provided for hot steel plate cooling applications in this study. The heat flux measurements are introduced by a novel experimental technique that has a function of heat flux gauge in which test block assemblies are used to measure the heat flux distribution on the surface. The spray is produced by a fullcone nozzle and experiments are performed at fixed water impact density of G and fixed nozzle-totarget spacing. The results show that effects of water temperature on forced boiling heat transfer characteristics are presented for five different water temperatures between 5 to $45^{\circ}C$. The local heat flux curves and heat transfer coefficients are also provided to a benchmark data for the actual spray cooling of hot steel plate cooling applications.

A Study on Design of Object-oriented Database using UML - IPCS(Intergrated Production Control System) Construction - (UML를 이용한 객체지향 데이터베이스 설계에 관한 연구 - 통합생산관리시스템 구축을 중심으로 -)

  • 이승범;주기세
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 1999.05a
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    • pp.163-167
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    • 1999
  • The relational data model can't be applied to CAD/CAM, CE, and CIM since it can't support the semantic model concept such as complex object, random data definition, manipulation, version control, generalization, aggregation and so on. In this paper, the IPCS(Integrated Production Control System) for hand-rail of ship is parted into several module according to process function. further more, the object oriented data model is designed with UML(Unified Modeling Language). UML is the object oriented design methodology of industrial standard that combines the Booch's methodology, the Rumbaugh's On(Object Modeling Technique), and the Jacobson's OOSE(Object-Oriented Software Engineering) methodology. The efficient management is expected with object-oriented data model construction, since this developed system can achieve efficient process control, system maintenance, repair and extension.

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An Implemention of Low Power 16bit ELM Adder by Glitch Reduction (글리치 감소를 통한 저전력 16비트 ELM 덧셈기 구현)

  • 류범선;이기영;조태원
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.36C no.5
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    • pp.38-47
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    • 1999
  • We have designed a 16bit adder which reduces the power consumption at each level of architecture, logic and transistor. The conventional ELM adder has a major disadvantage which makes glitch in the G cell when the particular input bit patterns are applied, because of the block carry generation signal computed by the input bit pattern. Thus, we propose a low power adder architecture which can automatically transfer each block carry generation signal to the G cell of the last level to avoid glitches for particular input bit patterns at the architecture level. We also use a combination of logic styles which is suitable for low power consumption with static CMOS and low power XOR gate at the logic level. Futhermore, The variable-sized cells are used for reduction of power consumption according to the logic depth of the bit propagation at the transistor level. As a result of HSPICE simulation with $0.6\mu\textrm{m}$ single-poly triple-metal LG CMOS standard process parameter, the proposed adder is superior to the conventional ELM architecture with fixed-sized cell and fully static CMOS by 23.6% in power consumption, 22.6% in power-delay-product, respectively.

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A Digital Automatic Gain Control Circuit for CMOS CCD Camera Interfaces (CMOS CCD 카메라용 디지털 자동 이득 제어 회로)

  • 이진국;차유진;이승훈
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.36C no.5
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    • pp.48-55
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    • 1999
  • This paper describes automatic gain control circuit (AGC) design techniques for CMOS CCD camera interface systems. The required gain of the AGC in the proposed system is controlled directly by digital bits without conventional extra D/A converters and the signal settling behavior is almost independent of AGC gain variation at video speeds. A capacitor-segment combination technique to obtain large capacitance values considerably improves the effective bandwidth of the AGC based on switched-capacitor techniques. A proposed layout scheme for capacitor implementation shows AGC matching accuracy better than 0.1 %. The outputs from the AGC are transferred to a 10b A/D converter integrated on the same chip. The proposed AGC is implemented as a sub-block of a CCD camera interface system using a 0.5 um n-well CMOS process. The prototype shows the 32-dB AGC dynamic range in 1/8-dB steps with 173 mW at 3 V and 25 MHz.

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A Sub-${\mu}$W 22-kHz CMOS Oscillator for Ultra Low Power Radio (극저전력 무선통신을 위한 Sub-${\mu}$W 22-kHz CMOS 발진기)

  • Na, Young-Ho;Kim, Jong-Sik;Kim, Hyun;Shin, Hyun-Chol
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.12
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    • pp.68-74
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    • 2010
  • A sub-${\mu}$W CMOS Wien-Bridge oscillator for ultra low power (ULP) radio applications is presented. The Wien-Bridge oscillator is based on an non-inverting opamp amplifier with a closed-loop gain $1+R_2/R_1$ as a means of providing necessary loop gain. An additional RC network provides appropriate phase shift for satisfying the Barkhausen oscillation condition at the given frequency of 1/($2{\pi}RC$). In this design, we propose a novel loop gain control method based on a variable capacitor network instead of a rather conventional variable resistor network. Implemented in $0.18{\mu}m$ CMOS, the oscillator consumes only 560 nA at the oscillation frequency of 22 kHz.

A Low-complexity Mixed QR Decomposition Architecture for MIMO Detector (MIMO 검출기에 적용 가능한 저 복잡도 복합 QR 분해 구조)

  • Shin, Dongyeob;Kim, Chulwoo;Park, Jongsun
    • Journal of IKEEE
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    • v.18 no.1
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    • pp.165-171
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    • 2014
  • This paper presents a low complexity QR decomposition (QRD) architecture for MIMO detector. In the proposed approach, various CORDIC-based QRD algorithms are efficiently combined together to reduce the computational complexity of the QRD hardware. Based on the computational complexity analysis on various QRD algorithms, a low complexity approach is selected at each stage of QRD process. The proposed QRD architecture can be applied to any arbitrary dimension of channel matrix, and the complexity reduction grows with the increasing matrix dimension. Our QR decomposition hardware was implemented using Samsung $0.13{\mu}m$ technology. The numerical results show that the proposed architecture achieves 47% increase in the QAR (QRD Rate/Gate count) with 28.1% power savings over the conventional Householder CORDIC-based architecture for the $4{\times}4$ matrix decomposition.