• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1138-1141
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• 2004

고분자 재료에 이온을 주입하면 표면전기저항이 이온주입조건에 따라 $10^{16}\Omega/sq$ 에서 $10^7\Omega/sq$ 까지 변하게 되며, 광학적 특성도 변하게 된다. 이는 산업적으로 대전방지 등에 적용이 가능하며 이러한 신소재 개발을 위하여 산업용 이온빔 표면처리 장치를 제작하고 인출광학을 기초로 이온빔을 제어하여 고분자 재료의 이온주입처리 양산기술을 개발하였다. 본 연구에서는 대면적, 대전류 이온빔 인출을 위한 이온원의 광학적 설계 및 빔라인에서의 솔레노이드 전자석을 이용한 빔프로파일 제어방법을 설명하였다. 사용된 고분자 소재는 PC(PolyCarbonate) 및 PET(PolyEthylene Teraphthalate)이며, 질소이온주입조건은 이온에너지 40-50 keV, 이온주입량 $5\times10^{15}$, $1\times10^{16}$, $7\times10^{16}ions/cm^2$의 조건으로 공정을 수행하였다. 또한 대전방지용 고분자 대량생산을 위한 연속 생산조건과 양산공정조건에 따른 표면전기저항변화를 관찰하였다.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.2904-2906
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• 2000

본 논문에서는 반도체 제조 공정에서 장비와 호스트간에 통신을 할 수 있는 SECS(SEMI Equipment Communications Standard) 프로토를의 개발을 제안한다. SECS 프로토콜은 메시지 전송을 위한 헤더 부분을 정의하는 SECS-I 프로토콜과 메시지 내용을 정의하는 SECS-II 프로토콜로 나뉘어지는데, RS232 시리얼 통신을 하는 SECS-I 프로토콜 대신에 이더넷(ethernet)을 통해 TCP/IP 통신을 할 수 있는 HSMS 프로토콜을 구현하고자 한다. HSMS(High-speed SECS Message Services)프로토콜은 SECS-I과 마찬가지로 SECS-II 메시지 내용을 전송 할 수 있도록 10바이트 크기의 헤더로 정의된다. HSMS 프로토콜 통신은 TCP/IP를 기반으로 하기 때문에 SECS 메시지 전송을 위한 통신 선로를 설정하기 위해 소켓 API를 응용하고 항상 통신 대기상태를 유지하기 위해 데몬(daemon) 형태로 구성한다. 실제 메시지 내용을 정의하고 있는 SECS-II 프로토콜은 데이터 인덱스 테이블과 표준에 정의된 형식에 맞게 파일형태나 DLL(Dynamic Link Library)형태로 구성하고 프로세스 프로그램(process program)을 수행하기 위해 SECS 프로토콜 표준에서 정의하는 SML(SECS Message Language)형식으로 변환 할 수 있는 스크립트 변환기(script translator)를 구현한다. 또한 HSMS 프로토콜이 전송할 SECS-II 메시지를 저장하기 위한 파라미터를 정의하고 실제 통신을 위한 테스트 베드를 위한 응용 프로그램을 제작한다

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2004.05a
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• pp.249-256
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• 2004

STEP-NC 는 기존의 G-code 를 대체할 새로운 CNC 인터페이스 언어로써 현재 밀링 공정에 대해서는 국제 표준 단계에 있으며 조만간 기존의 G-code 를 대체할 것으로 기대된다. 그러므로 국내에서도 CAD-CAM 업체, CNC maker, 공작기계 제작 업체, 사용자 등 생산 환경 전반에 걸쳐 이에 대한 대응이 시급하다. 본 논문에서는 국내에서의 STEP-NC 의 promotion 을 위해 1) STEP-NC data model 을 분석하고, 2) 파트 프로그램의 작성 방법을 자세히 설명하고, 3) STEP AP203 CAD 파일로부터 STEP-NC 파트 프로그램을 생성하는 과정을 Korea STEP-NC 시스템을 통해서 설명하였다.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.139-146
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• 2004

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation scratch test was studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass 7740) were used as specimens, and forming conditions to reduce the elastic recovery and pile-up were proposed. The indenter was modeled as a rigid surface. Minimum mesh sizes of specimens are 1-l0nm. Variables of the nanoindentation scratch test analysis are scratching speed, scratching load, tip radius and tip geometry. The nano-indentation scratch tests were performed by using the Berkovich pyramidal diamond indenter. Comparison between the experimental data and numerical result demonstrated that the FEM approach can be a good model of the nanoindentation scratch test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.26 no.4
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• pp.423-431
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• 2008

The control surveying which aims at identifying the coordinate system of satellite images with that of ground is a repeatedly performed essential process to produce digital ortho - photos and it acts as the main factor to increase the production cost of the photos by duplicated budgets and redundant works when executing the projects for acquiring basic geographical information from high density satellite images. During the experimentation, an application system was established for producing a stereo image chip by the analysis of DPPDB file structure, the stereo image chip was produced with SPOT and IKONOS images, the analysis of 3D modeling accuracy was performed to secure the required accuracy and to present the optimal number and deployment of the control points, and a 3D modeling was performed for new SPOT images and lastly, 3D ground coordinates were extracted by the observation of the same points through the overlapping with the new images. As the results of the research, it is proved that the stereo image chip can be used as the ground controls through the accuracy analysis between the coordinates of the images and the ground, close results were obtained between the coordinates by the ground survey and those by the 3D modeling using new images and the observation of the same points, positional changes were not found during observing the same points, and the research presented the methodology for improving the process of the control survey by showing the availability of the image controls on the stereo image chip instead of the ground controls.

• Journal of the Korean Vacuum Society
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• v.22 no.5
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• pp.238-244
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• 2013

Doping process using laser is an important process in fabrication of solar cell for heat treatment. However, the process of using the furnace is difficult to form a selective emitter doping region. The case of using a selective emitter laser doping is required an expensive laser equipment and induce the wafer's structure damage due to high temperature. This study, we fabricated a new costly plasma source. Through this, we research the selective emitter doping. We fabricated that the atmospheric pressure plasma jet injected Ar gas is inputted a low frequency (a few tens kHz). We used shallow doping wafers existing PSG (Phosphorus Silicate Glass) on the shallow doping CZ P-type wafer. Atmospheric plasma treatment time was 15 s and 30 s, and current for making the plasma is 40 mA and 70 mA. We investigated a doping profile by using SIMS (Secondary Ion Mass Spectroscopy) and we grasp the sheet resistance of electrical character by using doping profile. As result of experiment, prolonged doping process time and highly plasma current occur a deeper doping depth, moreover improve sheet resistance. We grasped the wafer's surface damage after atmospheric pressure plasma doping by using SEM (Scanning Electron Microscopy). We check that wafer's surface is not changed after plasma doping and atmospheric pressure doping width is broaden by increase of plasma treatment time and current.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2013.11a
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• pp.161-164
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• 2013

본 논문에서는 다양한 멀티미디어 코덱을 고속으로 처리하기 위하여 전용하드웨어가 아닌 병렬 어레이 프로세서 기반의 U-Chip(Universal-Chip) 구조를 제안하고 TSMC 80nm 공정을 사용하여 11,865,090개의 게이트 수를 가지는 칩으로 개발하였다. U-Chip은 역양자화(IQ), 역변환(IT), 움직임 보상(MC) 연산을 위한 $4{\times}16$ 개의 프로세싱 유닛으로 구성된 병렬 어레이 프로세서와 문맥적응적 가변길이디코딩(CAVLC)을 위한 비트스트림 프로세서와 인트라 예측(IP), 디블록킹필터(DF) 연산을 위한 순차 프로세서와 DMAC의 데이터 전송 및 각 프로세서를 제어하여 병렬 파이프라인 스케쥴링을 처리하는 시퀀서 프로세서 등으로 구성된다. 1개의 프로세싱 유닛에 1개의 매크로블록 데이터를 맵핑하여 총 64개의 매크로블록을 병렬처리 하였다. 64개 매크로블록의 대용량 데이터 전송 시간과 각 프로세서들의 연산을 동시에 병렬 파이프라인 함으로서 전체 연산 성능을 높일 수 있는 이점이 있다. 병렬 파이프라인 구조의 H.264 디코더 프로그램을 개발하였고 제작된 U-Chip을 통해 $720{\times}480$ 크기의 베이스라인 프로파일 영상에 대하여 코어 192MHz 동작, DDR 메모리 96MHz 동작에서 30fps의 처리율을 가짐을 확인하였다.

• The Journal of the Korea Contents Association
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• v.7 no.8
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• pp.134-141
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• 2007

In 3D animation rendering process, Although we can render the output as a movie file format, most productions use image sequences in their rendering pipelines. This Image Sequence rendering process is extremely important step in final compositing in movie industries. Although there are various type of making image rendering processes, TGA format Is one of most widely used bitmap file formats using in industries. People may ask TGA format is most suitable for in any case. As we know 3D softwares have their own image formats. so we need to testify on this. In this paper, we are going to focus on Alias' 3D package software called MAYA which we will analyze of compressing image sequence, Image quality, supporting Alpha channels in compositing, and Z-depth information. The purpose of this paper is providing to 3D Pipeline as a guideline about effective image sequence format.

• Membrane Journal
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• v.32 no.5
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• pp.314-324
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• 2022

This study is aimed to design a membrane process that systematically removes contaminants including microplastics in sun-dried salt using a separation membrane. In this study, we selected the separation membrane material, pore size, and module suitable for the sun-dried salt fields, and proceeded with the experiments under the salt fields and laboratory conditions. A pilot plant was constructed and tested in our lab and in the actual saltern with the selected 200 kDa, 4 kDa ultrafiltration membranes, and 3 kDa nanofiltration membranes. Most of the impurities in the sea salt were 0.1 ㎛ in size, and more than 7 types of various microplastics were detected in the impurities. After that, as a result of checking the filtered water through the separation membrane process, no impurities were detected. As a result of comparing the existing sea salt component and the sea salt component prepared with separation membrane filtrate, impurities were effectively removed without change in the sea salt component.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.5897-5905
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• 2013

In spite of advantage by using BIM as quantity take-off, schedule control and clash check, absence of guidelines is a barrier to applying BIM to road domain. In this research, domestic and overseas cases of BIM guideline are analyzed in order to develop the road BIM deliverable submission system. The analysis is classified 5 topics which are BIM submit product list, submit files format, availability of existing 2D based products, BIM authoring tools and submit process. As a result, It needs a lot of effort to standardize BIM delivery system for road domain because BIM submit product list and BIM authoring tools are changable depending on BIM use cases. However, submit files format and submit process are common part to suggest guidelines of road BIM delivery system. It requires to combine BIM and 2D products for road BIM delivery system because delivery products are not exactly alternative 2D based delivery products for the present. The authors expect this research to use as basic data for development of the BIM deliverable submission system in road domain.