• Journal of IKEEE
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• v.14 no.1
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• pp.8-16
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• 2010

This paper presents a design of the successive approximation ADC(SA-ADC) applicable to a midium-low speed analog-front end(AFE) for the maximum 15MS/s CCD image processing. SA-ADC is effective in applications ranging widely between low and mid data rates due to the large power scaling effect on the operating frequency variations in some other way of pipelined ADCs. The proposed design exhibits some distinctive features. The "differential capacitor-coupling scheme" segregates the input sampling behavior from the sub-DAC incorporating the differential input and the sub-DAC output, which prominently reduces the loading throughout the signal path. Determining the MSB(sign bit) from the held input data in advance of the data conversion period, a kind of the signed successive approximation, leads to the reduction of the sub-DAC hardware overhead by 1 bit and the conversion period by 1 cycle. Characterizing the proposed design in a 3.3 V $0.35-{\mu}m$ CMOS process by Spectre simulations verified its validity of the application to CCD analog front-ends.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.5
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• pp.401-409
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• 2013

Numerical analysis on RF (Radio-Frequency) thermal plasma treatment of micro-sized Ni metal was carried out to understand the synthesis mechanism of nano-sized Ni powder by RF thermal plasma. For this purpose, the behaviors of Ni metal particles injected into RF plasma torch were investigated according to their diameters ($1{\sim}100{\mu}m$), RF input power (6 ~ 12 kW) and the flow rates of carrier gases (2 and 5 slpm). From the numerical results, it is predicted firstly that the velocities of carrier gases need to be minimized because the strong injection of carrier gas can cool down the central column of RF thermal plasma significantly, which is used as a main path for RF thermal plasma treatment of micro-sized Ni metal. In addition, the residence time of the injected particles in the high temperature region of RF thermal plasma is found to be also reduced in proportion to the flow rate of the carrier gas In spite of these effects of carrier gas velocities, however, calculation results show that a Ni metal particle even with the diameter of $100{\mu}m$ can be completely evaporated at relatively low power level of 10 kW during its flight of RF thermal plasma torch (< 10 ms) due to the relatively low melting point and high thermal conductivity. Based on these observations, nano-sized Ni metal powders are expected to be produced efficiently by a simple treatment of micro-sized Ni metal using RF thermal plasmas.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.6
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• pp.519-525
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• 2008

For this study, SM45C steel rods using generally for power transmission shafts and machine components was selected and welded by butt-GMAW method. And then it was studied about estimation of fatigue strength and the region of infinite life by Haigh diagram using Goodman's equation. Fatigue strength in weld zone presents highly in order of the boundary between deposited metal zone and heat affected zone, deposited metal zone, heat affected zone. This result agrees with distribution of hardness in weld zone. Fatigue strength in base metal zone presents highly compared with weld zone in low cycles between $10^4$ cycles and $10^6$cycles, but it presents the lowest fatigue strength on the order of heat affected zone in the vicinity of $10^6$cycles. It is the result that the first high compressive residual stress distributed by drawing process of the steel rods is released and the base metal is softened by alternating stresses. The region of infinite life by Haigh diagram presents highly in order of the boundary between deposited metal zone and heat affected zone, deposited metal zone, heat affected zone. From this results, it is demanded that the stress for safety design of machine components using SM45C butt-welded steel rods must be selected in the region of the lowest infinite life of heat affected zone.

• Journal of Korea Foundry Society
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• v.23 no.4
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• pp.195-203
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• 2003

Hyper-eutectic Al-Si alloy is used much to automatic parts and material for the electronic parts because of the low coefficient of thermal expansion, superior thermal stability and superior wear resistance. In this work, A390 alloy specimens were fabricated for control of the Si particle size by various processes, such as spray-casting, permanent mold-casting and squeeze-casting. To minimize the effect of microporosity of the specimens, hot extrusion was carried out under equal condition. Each specimens were evaluated tensile properties at room temperature and thermal expansion properties in the range from room temperature to 400$^{\circ}C$. Ultimate tensile strength and elongation of the spray-cast and extruded specimens which have fine and well distributed Si particles were improved greatly compare to the permanent mold-cast and extruded ones. Specimens which have finer Si particles showed higher ultimate tensile strength and elongation than those having large Si particle size, and coefficient of thermal expansion of the specimens increased linearly with Si particle size. In case of the repeated high temperature exposures, thermal expansion properties of the spray-cast and extruded specimens were found to be more stable than those of the others due to the effect of fine and well distributed Si particles.

• Journal of the Korean Applied Science and Technology
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• v.32 no.1
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• pp.116-126
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• 2015

The present study utilized a shuttle mechanism of wet chemical absorption using MEA. In addition, industrial by-products containing a large amount of inorganic alkali substances were utilized for wet carbonization process. Chemical pretreatment of industrial by-products extracted calcium ions. ICP result of calcium ion was obtained up to 17,900 ppm(17.9%) by acidic substance. And also, In this work, 94% of recovery rate was obtained using wet MEA absorption process from $CO_2$ flow at the ambient condition. Through the liquid carbonation process, a sludge was fixed with rate of 0.175 mg of $CO_2$ per mg of sludge. It was found from XRD results that the structure of final product was composed of a calcite structure which is general structure of $CaCO_3$.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.12
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• pp.1343-1349
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• 2011

In this study, the power enhancement potential of a Rankine power cycle by transcritical operation was investigated by comparing the power of an HFC-134a subcritical cycle with that of an HFC-125 transcritical cycle, for a low-grade heat source with a temperature of about $100^{\circ}C$. For a fair comparison using different working fluids, each cycle was optimized by three design parameters from the viewpoint of power. In contrast to conventional approaches, the working fluid's heat transfer and pressure drop characteristics were considered in the present approach, with the aim of ensuring a more realistic comparison. The results showed that the HFC-125 transcritical cycle yields 9.4% more power than does the HFC-134a subcritical cycle under the simulation conditions considered in the present study.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.368.2-368.2
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• 2014

$SnO_2$을 이용한 반도체는 기체 센서, 트랜지스터, 태양전지와 같은 여러 분야에 적용 가능하기 때문에 많은 각광을 받고 있다. $SnO_2$을 이용한 반도체 소자는 높은 화학적 안정성과 독특한 물리 화학적 특성을 지니고 있을 뿐만 아니라 부피에 대한 높은 표면적 비율을 가지고 있다. 우수한 $SnO_2$나노구조를 얻기 위해서 전자관 박막증착, 졸겔법, 물리적 증기증착, 열증착과 같은 다양한 방법들이 사용되었다. 다양한 합성 방법들 중에서 전기화학 증착법은 높은 성장율, 대면적 공정, 낮은 가격과 같은 장점을 가지고 있어 많은 연구가 진행되었지만, $SnO_2$ 구조의 성장조건에 따른 체계적인 연구는 진행되지 않았다. 본 연구는 indium-tin-oxide (ITO)로 코팅된 유리 기판 위에 전기화학 증착법을 사용하여 다양한 성장 조건에 따라 성장된 $SnO_2$나노구조들의 물리적 특성들을 관찰하였다. ITO 유리 기판 위에 성장된 $SnO_2$나노구조는 음극의 전구체와 전류의 상호작용에 의해 생성되는 산소 분자의 환원에 의해 형성된다. $SnO_2$나노구조의 모양은 전기화학 증착의 성장 환경에 따라 달라진다. $SnO_2$나노구조를 관찰하기 위해 시간에 따른 전압-전류, X-ray광전자분광법, 주사형전자현미경, X-ray회절분석법을 사용하여 측정하였다. ITO 유리 기판 위에 성장한 $SnO_2$ 소자에 서로 다른 인가 전압을 가해 주었을 때에 따른 전류밀도를 측정하였다. 일정한 인가전압에서 $SnO_2$나노구조의 X-ray광전자분광법 측정 을 통해 화학적 결합과 X-ray회절분석법 통한 $SnO_2$ 성장 방향을 관찰하였다. 주사형전자현미경 측정을 통하여 $SnO_2$의 표면을 관찰하였다

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.168-172
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• 1999

We have studied the formation of Co/Ti bilayer silicide with low resistivity and good thermal stability on the heavily boron doped $\textrm{p}^{+}$-Si region. In this paper, Co/Ti bilayer silicides were fabricated by depositing Co($150\AA$)/Ti($50\AA$) films on the clean $\textrm{p}^{+}$-Si substrates in an E-beam evaporator and performing the two step RTA process (first annealing: 650$50^{\circ}C$/20sec, second annealing: $800^{\circ}C$/20sec) in a $N_2$ambient with the pressure of $\textrm{10}^{-1}$atm. Co/Ti bilayer silicides obtained from our experiments exhibited the low resistivity of about $18\mu\Omega$-cm and the uniform thickness of about $500\AA$ without change of sheet resistance and agglomeration under the long post0annealing time up to $1000^{\circ}C$.

• Korean Chemical Engineering Research
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• v.55 no.4
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• pp.514-519
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• 2017

Adsorption characteristics of acid green 27 dye using activated carbon were investigated as function of adsorbent dose, pH, initial concentration, contact time and temperature. Freundlich isotherm explained adsorption of acid green 27 dye very well and Freundlich separation factors (1/n=0.293~0.387) were found that this process could be employed as effective treatment method. Kinetic studies showed that the kinetic data were well described by the pseudo second-order kinetic model. Pseudo second rate constant ($k_2$) decreased with the increase in initial acid green 27 concentration. Activation energy (10.457 kJ/mol) and enthalpy (79.946 kJ/mol) indicated that adsorption process was physisorption and endothermic. Since Gibbs free energy decreased with increasing temperature, spontaneity of adsorption reaction increased with increasing temperature in the temperature range of 298 K~318 K.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.107-107
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• 2017

전자제품의 성능이 향상됨에 따라서 전자제품에 사용되는 부품의 고집적화가 필연적으로 요구되고 있으며, 고집적화 된 전자제품의 방열(heat dissipation)에 관한 문제점이 대두되고 있다. 방열은 전자기기의 성능과 수명을 유지하는데 있어서 중요한 문제 중 하나로서 방열 효과를 높이기 위해 다양한 연구 개발이 진행 중이다. 방열에 사용되는 소재로는 Cu가 있으며, 저렴한 가격과 상대적으로 높은 방열 효율을 가지는 장점이 있다. Cu는 전기 도금 증착 방법을 사용하여왔으나, 전기도금 방식으로 증착된 Cu 방열판은 제품에 열이 축적될 경우 Cu와 substrate 사이의 residual stress로 인해 박리나 뒤틀림 현상 등이 발생하여 high power를 사용하는 device의 방열 소재로 사용하기에는 개선해야 할 문제점이 있다. 이러한 문제점을 극복하기 위한 방법으로 magnetron sputter 증착 방법이 있으며, magnetron sputter은 대면적화가 용이하고, 다양한 물질의 증착이 가능한 장점으로 인해 hard coating 또는 thin film 증착과 같은 공정에 사용되고 있다. 특히 증착된 film의 특성을 조절하기 위해서 magnetron sputter에 pulse 또는 ICP (inductively coupled plasma) assisted 등을 적용하여 plasma 특성을 조절하는 방법 등에 관한 연구가 보고되고 있다. 본 연구에서는 pulsed magnetron sputtering 방식을 이용하여 증착된 Cu film 특성 변화를 확인하였다. 다양한 pulsing frequency와 pulsing duty ratio 조건에서, Si substrate 위에 증착된 Cu film과의 residual stress 변화를 측정하였다. Pulse duty ratio가 90% 에서 60%로 감소함에 따라서 Cu film의 residual stress가 감소하였고, pulsing frequency가 증가함에 따라 Cu film의 residual stress가 감소하는 것을 확인하였다. 증착 조건에 따른 plasma의 특성 분석을 위하여 oscilloscope를 이용하여 voltage와 current를 측정하였고, Plasma Sampling Mass spectrometer 를 이용하여 ion energy의 변화를 측정하였다. 이를 통해 plasma 특성 변화가 증착된 Cu film에 미치는 영향과 residual stress의 변화에 대한 연관성에 대하여 확인할 수 있었다.