• Composites Research
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• v.28 no.5
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• pp.322-326
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• 2015

We developed the high-power LED beacon and investigated the applicability of composite materials for the light-weight design of LED beacon. By means of the application of composite materials, the vertical deformation could be reduced by 17% and the total weight of LED beacon 8.9 kg comparable to 20% light-weighting against aluminum beacon. In thermal radiation test, the maximum temperature of LED package was measured to $63.5^{\circ}C$ under ambient temperature ($20^{\circ}C$), which is acceptable considering both performance and lifespan of LED packages. In this study, the applicability of composite materials was demonstrated for light-weight design of high-power LED beacon.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.569-575
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• 2011

Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.

• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.203-204
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• 2014

본 논문은 넓은 출력범위를 갖는 LED 조명을 위한 하프-브릿지 제타 컨버터를 통합한 고효율 비대칭 하프-브릿지 컨버터를 제안한다. 넓은 출력 범위에서 기존의 비대칭 하프-브릿지 컨버터는 낮은 시비율에서 동작하기 때문에 영전압 스위칭이 어려워 전 출력 범위에서 높은 효율을 획득하기 어렵다. 또한, 하프-브릿지 LLC 컨버터는 넓은 영전압 스위칭 범위를 갖지만 큰 코어 손실로 높은 효율을 획득하는데 한계가 있다. 따라서, 본 논문에서는 기존의 문제를 해결하기 위해 기존의 비대칭 하프-브릿지 컨버터의 스너버 다이오드를 스위치로 변경한 새로운 하프-브릿지 컨버터를 제안한다. 낮은 출력범위에서는 스너버 스위치를 꺼서 기존의 비대칭 하프-브릿지로 동작시키며, 높은 출력 범위에서는 스너버 스위치를 켜서 하프-브릿지 제타 컨버터로 동작시켜 전 출력 범위에서 고효율을 달성 할 수 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.297-298
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• 2009

대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

• Proceedings of the Optical Society of Korea Conference
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• 2004.07a
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• pp.232-233
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• 2004

LED 광원의 특성인 높은 색재현성, 친환경성, 저소비전력 등을 디스플레이 광원으로 그 활용도가 높이 평가되고 있다. 최근 비약적인 광효율 증가를 보이고 있는 고출력 LED 광원을 대화면의 LCD TV 용 BLU 와 Projection TV의 조명계에 적용하기 위하여 기술개발에 필요한 주요 요소들을 살펴본다.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Information Display
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• v.15 no.1
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• pp.12-19
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• 2014

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Proceedings of the Optical Society of Korea Conference
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• 2008.02a
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• pp.139-140
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• 2008

• Electrical & Electronic Materials
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• v.17 no.9
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• pp.16-22
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• 2004

오늘날 반도체 기술의 획기적인 발전에 의해서 마침내 에디슨의 탄소 필라멘트 백열전구를 대체할 수 있는 "반도체 필라멘트"라 불리는 고출력 백색 LED(lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다.(중략)