Browse > Article
http://dx.doi.org/10.3795/KSME-B.2011.35.6.569

Study on Thermal Performance of Multiple LED Packages with Heat Pipes  

Hwang, Soon-Ho (Dept. of Mechanical and Automotive Engineering, Kongju National Univ.)
Lee, Young-Lim (Dept. of Mechanical and Automotive Engineering, Kongju National Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers B / v.35, no.6, 2011 , pp. 569-575 More about this Journal
Abstract
Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. Recently, LED packages have been applied to high-power lights such as car headlamps or street lights, and it is known that cooling using only free convection is not at all efficient. Thus, in this study, a heat pipe with forced convection was examined for the optimization of the cooling performance in high-power LED lights. In addition, optimal on-off control of a fan was adopted to increase the fan lifetime, since the lifetime of the fan is generally shorter than that of the LEDs.
Keywords
LED Light; Heat Pipe; Fan; Fan Lifetime;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 1
연도 인용수 순위
1 Weng, C, J., 2009, "Advanced Thermal Enhancement and Management of LED Packages," International Communications in Heat and Mass Transfer, Vol. 36, No. 3, pp. 245-248.   DOI   ScienceOn
2 Lee, Y. L. and Hwang, S. H., 2010, "Study on Thermal Design of a 3W MR16 Light with Single High-Power LED," The Korean Academia-Industrial Cooperation Society, Vol. 11, No. 4, pp. 1023-1209.   과학기술학회마을   DOI   ScienceOn
3 Hwang, S. H., Park, S. J. and Lee, Y. L., 2010, "A Study on Thermal Design for a 10W LED Lamp," The Korean Academia-Industrial cooperation Society, Vol. 11, No. 7, pp. 2317-2322.   과학기술학회마을   DOI   ScienceOn
4 Chen, H., Lu, Y., Gao, Y., Zhang, H. and Chen, Z., 2009, "The Performance of Compact Thermal Models for LED Package," Thermochimica Acta, Vol. 488, No. 1-2, pp. 33-38.   DOI   ScienceOn
5 Lu, X., Hua, T., Liu, M. and Cheng, Y., 2009, "Thermal Analysis of Loop Heat Pipe Used for High-Power LED," Thermochimica Acta, Vol. 493, pp. 25-29.   DOI   ScienceOn
6 Liu, S., Yang, J., Gan, Z. and Luo, X., 2008, "Structural Optimization of a Microjet Based Cooling System for High Power LEDs," International Journal of Thermal Sciences, Vol. 47, pp. 1086-095.   DOI   ScienceOn
7 Cree, Inc, http://www.cree.com.
8 Shin, W. G., Lee, S. H. and Song, Y. S., 2005, "A Development of a Life Test Procedure for Cooling fan motor," Proceeding of the KAMES, No. 11, pp. 1394-1399.
9 Nidec, Inc, http://www.nidec.com.
10 Ansys CFX, Inc., 2008