• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• Current Photovoltaic Research
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• v.8 no.4
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.7-16
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• 2022

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.4
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• pp.575-581
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• 2020

A colorless antistatic agent was prepared for use in antistatic films for liquid crystal displays (LCDs) requiring low surface resistance and high transmittance. Among various lithium-fluoro compounds and quaternary ammonium salts, antistatic materials were selected based on their electrical conductivity, and antistatic agents were prepared to measure the surface resistance. As a result, the material with high conductivity showed a relatively low surface resistance, i.e., relatively good antistatic performance. Based on the antistatic materials selected, the formulation ratio for producing the best antistatic agent was established through the experimental design method and the effects of each factor were analyzed. The higher the use of lithium- fluoro compounds as antistatic materials, the higher the ratio of oligomer use with multi-functional groups, and the smaller the surface resistance. The quaternary ammonium salts increased the antistatic performance of the lithium-fluoro compounds, but the effects of the amount used were not relatively large. After manufacturing the antistatic PET film, the properties of the antistatic film showed low surface resistance values (<10⁹ Ω/sq.), high permeability (>92%), low haze (<0.5%), and high whiteness (L^⁎>95). In addition, the antistatic film reliability was found to be excellent by showing a stable surface-resistance change rate of less than 10%, even under high temperature and high humidity conditions.

• Journal of Applied Biological Chemistry
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• v.63 no.1
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• pp.1-8
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• 2020

This study investigated the processing characteristics of soybean (HaePum) sprouts based on temperature (5, 15 and room temperature), period (0, 6 and 12 mon) and relative humidity (20, 40, 60, and 80%) during storage. The initial germination rate of soybean sprouts was 76.02±6.32%, which significantly reduced to 57.18±8.51%, and 0% as the storage temperature of soybean increased for a period of 12 mon. The germination rate of soybean sprouts with 30 ℃ and 80% RH decreased after 4 mon of storage to 4.94%. The yellowness of cotyledon of soybean sprouts was not significantly changed during the 12 mon period of storage at 5 ℃, whereas, soybean sprouts stored at 15 ℃ and room temperature demonstrated decreased yellowness. However, the stress of cotyledon decreased with an increase in both storage temperature and time, and the hardness of hypocotyl decreased with an increase of storage time. The stress of cotyledon affected by high temperature (30 ℃) and humidity (80%) during 4 mon was reduced to 44.39±9.38 g/㎟. The asparagine content of soybean sprouts showed a similar result with the germination rate due to the amount of hypocotyl. Therefore, lower temperatures and shorter storage times are suitable for soybean sprout processing. The first order kinetic model and Arrhenius equation (activation energy =29.56 kJ/mol) were able to predict the yield of sprout at various storage temperatures and periods.

• Journal of Conservation Science
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• v.29 no.4
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• pp.333-343
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• 2013

The exhibition hall of museum has been damaged by abundant dust and mold of the air in the room. Occurrence of microorganisms on the surface of the cultural heritage will cause damages such as coloration, materials degradation, deterioration, etc. In this study, we investigated the temperature/humidity and microbes distribution in exhibition hall, display showcase, and on surface of wall paintings in the Muwisa museum. From some samples collected in exhibition hall and display showcase, we identified so many varieties of micro-organisms such as Aspergillus sp., Penicillium sp., Cladosporium sp.. In particular, we could see a large number of microorganisms in the number 1, 2 exhibition hall compared with the number 3 exhibition hall. The results examining the distribution of the temperature and humidity were showed as $28{\pm}4^{\circ}C$ and 70~80%, respectively. The number 1 exhibition showcase was higher humidity environment than the number 2, 3 exhibition hall compared to the distribution ratio, which considered as correlation with the distribution of microorganism concentration. As these results, we understood that high temperature and humidity in the exhibition hall and display showcase of the Muwisa museum were characteristics caused by environmental management and hermetically-sealed rooms.

• Journal of Conservation Science
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• v.32 no.4
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• pp.501-510
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• 2016

In this study, we investigated the degradation of adhesives when exposed to ultraviolet light irradiation using samples of lacquer (L), treated lacquer (TL), lacquer mixed with glue (LG), and urushiol mixed with glue (UG). Four types of film specimens were collected under the ultraviolet exposure time, and gloss test, tensile shear strength test, scanning electron microscope analysis, and infrared spectroscopic analysis were conducted for the specimens. LG and UG showed lowering rate of gloss is somewhat later than L. Also, it was observed that with increasing exposure time to ultraviolet irradiation, the surface of L began to show spherical pits and cracks when the polysaccharide layers started to be exposed, whereas the surfaces of LG and UG remained smooth. The Infrared spectra of L and TL showed that the intensity of the overall peak decreased with increasing ultraviolet irradiation time. There was no change in the peak intensity of LG, but for UG, the peaks at $3013cm^{-1}$, $1593cm^{-1}$ and so on disappeared and the overall intensity declined. The tensile shear strength of LG and UG was maintained or increased as compared to the initial test, whereas the tensile shear strength of L decreased sharply after 600 h. LG and UG exhibited fewer changes as a result of high temperature and humidity conditions, and they retained their strength under UV exposure. These results indicate that LG and UG are more durable than L when subjected to environmental change.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.111-116
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• 2011

The characteristics of natural resin, sap of the lacquer tree were examined as an adhesive for the ceramic conservation since it has such outstanding properties like corrosion resistance against acid and alkali, heat-resistance, waterproof, antiseptic and protection against insects. In order to utilize raw lacquer as an adhesive not under the hardening conditions of lacquer like high humidity (RH 75 to 85%) and high temperature (120 to $170^{\circ}C$), but under normal condition, isinglass and animal glue were added to raw lacquer at certain ratio. In addition, the viscosity and the drying time were measured and their possibilities of application were also investigated through measurement of tensile and adhesive strength. As a result of experiment, it was possible to dry at room temperature and RH $50{\pm}5%$ to mix with raw lacquer and glue, and the drying time of sample with animal glue was faster than that of isinglass. Furthermore, the adhesion of sample with glue was increased more than raw lacquer. It seems to be possible to use the environmental friendly traditional adhesive for the ceramic conservation and restoration, if there are studies or examinations of safety of applications on objects and weathering resistance.

• Polymer(Korea)
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• v.36 no.4
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• pp.486-493
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• 2012

Photocurable sulfonated polyimide (SPI) polyelectrolyte containing chalcone group was prepared and fabricated on an alumina electrode pretreated with chalcone-containing silane-coupling agent. SPI films with bis(tetramethyl)ammonium 2,2'-benzidinedisulfonate ($Me_4N$-BDS)/4,4'-diaminochalcone (DAC)/pyromellitic dianhydride (PA)= 90/10/100 possessed very linear response(Y = -0.04528X+7.69446, $R^2=0.99675$) and showed resistance changing from 4.48 to $2.1k{\Omega}$ between 20 and 95 %RH. The response time for absorption and desorption measurements between 33 and 94 %RH% was about 79 s, which affirmed the high efficiency of crosslinked SPI film for rapid detection of humidity. A negative temperature coefficient showing $-0.49%RH/^{\circ}C$ was found and proper temperature compensation should be considered in future applications. Moreover, pretreatment of the substrates with chalcone-containing silane-coupling agent was performed to improve the water durability and the stability of the humidity sensors at a high humidity and a high temperature and long-term stability for 480 h. The crosslinked SPI films anchored to electrode substrate could be a promising material for the fabrication of efficient humidity sensors with superior characteristics compared to the commercially available sensors.