• Polymer(Korea)
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• v.24 no.3
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• pp.382-388
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• 2000

Polymer electrolyte films consisting of poly(vinylidenefluoride-hexafluoropropylene) (PVdF-HFP), LiClO$_3$ and a mixture of ethylene carbonate (EC) and ${\gamma}$-butyrolactone (GBL) were examined in order to obtain the best compromise between high ionic conductivity, homogeniety, dimensional and electrochemical stability. Measurements of ionic conductivity, differential scanning calorimetry and linear sweep voltammetry have been carried out for various compositions. The highest conductivity of 3.8$\times$10$^{-3}$ S$cm^{-1}$ / at 3$0^{\circ}C$ were obtained for a film of 30(PVdF-HFP)+7.8LiClO$_4$+62.2EC/GBL. From the DSC study, it has been found that the PVdF-HFP gels are stable up to 10$0^{\circ}C$, and the salt lowers the melting temperature of crystalline part of PVdF by interacting sensitively with polymer segments. When Lithium metal is in contact with the gel films, it tends to undergo corrosion and the reaction products accumulate resulting in the formation of a passive film on Li electrode. As the aging time progresses, the interfacial resistance increases continuously. Anodic stability is measured to extend up to about 4.5 V vs. Li.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.82-87
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• 1998

In the oxidation process of the $NH_3/O_2$ oxidation method, adding $NH_3$ gas to $O_2$ gas, the detected outlet gases in the reaction quartz chamber are N2, $O_2$ and $H_2O$ and in addition, a very small quantity of $CO_2$, NO and $NO_2$ are detected. Two kinds of species ($O_2$ and H2O) contribute to oxidation, so the growth rate is determined by oxidation temperature and by also partial pressure of the NH3 and $O_2$ gases. The slop of growth rate is identified to be medial and in parallel between that of the dry and wet oxidation. Auger electron spectroscopy (AES) indicates that $NH_3/O_2$ oxide film has a certain stoichiomerty of $SiO_2$, this oxidation method restrains the generation of defects in the $SiO_2/Si$ interface, minimizing fixed charges. The breakdown voltage of $NH_3/O_2$ oxide film (470$\AA$) is 57.5 volts, and the profile of the C-V curve including flat band voltage (0.29 volts) agree with the ideal curve.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.22-22
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• 2010

최근 염료감응형 태양전지(DSSC)는 광변환효율 측면에서 향상 가능성이 높으며, 전기화학적 반응을 바탕으로 하므로 생산단가가 낮아 차세대 태양전지로 관심을 모우고 있다. 염료감응형 태양전지에 있어서 주요 구성성분 중의 하나는 다공성 산화물 광전극 재료이다. 다양한 반도체 물질과 비교할 때 $TiO_2$는 전도대의 위치와 전자이동성 면에서 비교적 적합하며, 유기물과의 흡착성 및 안정성 측면에서 대단히 우수하다. 염료감응형 태양전지의 $TiO_2$ 광전극이 갖추어야 할 요건은 표면적이 넓어서 염료 흡착량이 많아야 하며, 전자전달 및 전해질 이동을 위한 효율적 구조이어야 한다. $TiO_2$ 광전극 제작을 위한 재료로서는 나노입자가 널리 이용되며, 입자의 크기는 20 nm 부근이 적합한 것으로 알려져 있다. 본 발표에서는 나노입자 외에 나노막대, 나노섬유, 나노튜브, inverse-opal 구조 등과 같이 지금까지 연구되고 있는 $TiO_2$ 나노구조 관련연구를 소개 한다. 한편으로 효율적 전극구조를 제작하려면 $TiO_2$ 나노구조 제어 외에도, 투명전극과 $TiO_2$ 전극과의 계면층(interfacial layer) 제어, 빛의 효율적 이용을 위한 산란층(scattering layer) 및 $TiO_2$ 전극에서 전해질로의 전자손실 억제를 위한 blocking layer 도입 등이 필요하다. 이에 대한 기본개념을 설명하고 다른 연구자의 연구결과를 소개한다. 본 연구실의 연구 결과인, 메조 포러스 구조, 다공성 속빈구 구조와 구형구조체를 합성하고 이를 염료감응형 태양전지에 응용한 내용을 소개한다. 다공성 속빈구의 경우, 산란층으로 대단히 우수한 결과를 나타내었고, 다공성 구형구조체는 광전극 주재료로 적합한 특성을 나타내었다. 즉, 다공성 구형구조체를 적용한 광전극은 표면적이 대단히 넓고 또한 효율적 동공구조가 형성되어 전해질 이동에도 매우 효율적이다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.641-647
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• 2017

In order to meet the stricter emission regulations, the proportion of after-treatments for vehicles and vessels has been increasing gradually. The objective of this study is to investigate the physicochemical properties according to ash cleaning agents of CDPF for Diesel Engines. Penetrating agents with strong penetration into ash and a surfactant component to mix water and oil were prepared properly. The cleaning characteristics of S1 sample were good. Washcoat loss rate of S1 sample was lower by about 2.2% because of less KOH component and lower Na2SiO3 content. Washcoat loss rate of S4 sample with an added KOH and Na2SiO3 components by penetration agents was increased by about 13%. In terms of less than about 13% of CDPF's washcoat loss rate, it was able to reduce the harmful gas components.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.957-963
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• 2010

The aging behavior of aluminum borate whisker ($Al_{18}B_4O_{33}$) reinforced AS52+Sr magnesium matrix composites was investigated with Vickers hardness measurements, bending tests, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Experimental results showed that aging is accelerated in the $AS52+Sr/Al_{18}B_4O_{33}$ composite compared with an unreinforced AS52+Sr alloy. The hardness of the alloy and composite increases monotonically as a function of the aging time before reaching its peak hardness and then gradually decreases. The composite reaches its peak hardness in 10 h, whereas the matrix alloy requires 30h, indicating accelerated age-hardening in the $AS52+Sr/Al_{18}B_4O_{33}$ composite compared with the unreinforced AS52+Sr alloy at $170^{\circ}C$. The interfacial reaction of $AS52+Sr/Al_{18}B_4O_{33}$ magnesium matrix composite is considered to play a dominant role in the strengthening mechanism, ultimately affecting the mechanical properties of the composite.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Korean Journal of Microbiology
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• v.55 no.2
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• pp.87-102
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• 2019

Most chronic wounds persist in the inflammatory phase during wound healing due to the biofilm. Biofilms are resistant to antibiotics, weakening penetration, resistance to biocides and weakening local immune responses. The biofilm is firmly attached to the surrounding tissues and is very difficult to remove. Therefore, strategies to remove hard biofilms without damaging surrounding tissue are very important. One of possible strategies is dispersal. So many studies have been done to develop new strategies using dispersal mechanisms. In this review paper, especially chemotaxis, phage therapy, polysaccharides, various enzymes (glycosidases, proteases, and deoxyribonucleases), surfactants, dispersion signals, autoinducers, inhibitors were introduced. Combination therapies with other therapies such as antibiotic therapy were also introduced. It is expected that the possibility of treatment of chronic wound infection using the knowledge of the biofilm dispersal mechanisms presented in this paper will be higher.

• Applied Chemistry for Engineering
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• v.22 no.3
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• pp.235-242
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• 2011

This perspective describes recent advances made in the development of various electrochemical technologies to treat waste water containing organic pollutants, reducible/oxidizable and non-reducible/non-oxidizable anions and cations using redox reactions on the solid surface as well as at the interface between solid electrode and liquid electrolyte. Some of representative multiplexing and hybrid electrochemical treatment technologies are discussed, which have great advantages of high efficiency, stability and cost-effective instrumentation without the need of considering non-specific conditions such as high-temperature and high-pressure; however, choices and usages of electrode materials are absolutely critical issues.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.