• Title/Summary/Keyword: 계면 반응

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Interfacial reaction of cBN in Ag-based Brazing Filler Metal by wiresaw (와이어 쏘우용 Ag계 브레이징 필러를 이용한 cBN 계면 반응 분석)

  • Lee, Jang-Hun;Chae, Na-Hyeon;Im, Cheol-Ho;Park, Seong-Won;Lee, Ji-Hwan;Song, Min-Seok
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.248-250
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    • 2007
  • 이 연구는 cBN과 활성 Ag계 금속필러메탈을 이용하여 접합계면에서의 금속성분과 화합물, 탄화물의 거동을 분석하는데 있다. 진공 브레이징은 $900{\sim}1000^{\circ}C$에서 $25^{\circ}C$ 간격으로, 유지 시간은 각각 5, 10, 15, 20분으로 실시하였다. Ag-Cu-Ti을 사용하여 브레이징된 cBN은 $950{\sim}1000$도, 유지시간 10분 사이에서 각각 건전한 계면과 표면을 얻을 수 있었으며, 계면에서 Ti-rich상과 화합물이 확인되었다. 이상의 결과로 부터 화합물의 생성과 건전한 접합공정은 브레이징 온도와 시간이 좌우하며, N과 B, Ti의 함유량이 cBN의 브레이징 접합 특성의 중요변수로 생각되어진다. cBN과 Ag계 브레이징 필러의 계면에서의 미세조직 및 화학반응의 메커니즘은 DTA, SEM, EPMA, XRD를 이용하여 분석하였다.

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Study on the Cu/Polyimide interface using XPS: Initial growth of Cu sputter-deposited on the polyimide at high temperature (II) (XPS를 이용한 Cu/Polyimide의 계면에 관한 연구: 고온에서 증착한 Cu의 초기성장과 정(II))

  • 이연승;황정남
    • Journal of the Korean Vacuum Society
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    • v.7 no.2
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    • pp.135-140
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    • 1998
  • We investigated the initial growth mode of Cu deposited on polyimide at high temperature($350^{\circ}C$) using x-ray photoelectron spectroscopy. We could find that when Cu is sputter-deposited on the polyimide at high temperature, Cu-C-N complex is formed first, Cu-N-O complex and Cu-oxide are mainly formed successively, and then funally metallic Cu grows. In the chemical reaction point of view, the interface of Cu/polyimide at high temperature is than that at room temperature.

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Reduction of PCBs in Contaminated Marine Sediments by Using Fenton-like Reaction with Surfactants (유사-펜톤 반응과 계면활성제에 의한 해양퇴적물의 PCBs 정화)

  • Choi, Jin Young;Kim, Kyoungrean
    • Journal of Korean Society of Environmental Engineers
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    • v.37 no.6
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    • pp.340-348
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    • 2015
  • Removal efficiency of PCBs in contaminated marine sediments treated by Fenton-like oxidation combined with surfactant was investigated in this research in order to achieve remediation of PCBs. A washing treatment using various concentrations of hydrogen peroxide (1% and 15%) and surfactants (Triton X-100, Tween 60 and Tween 80) was evaluated at various conditions in laboratory scale experiments. The mean removal efficiencies of tPCBs varied from 24.1 to 46.7% in the sediments for 1 hour duration of the treatments. The concentration of tPCBs in contaminated marine sediments after the simultaneous treatment with hydrogen peroxide and surfactant satisfied the domestic environmental standards for the beneficial use of sediments. When suitable surfactant was used for Fenton-like oxidation, the removal efficiency of tPCBs at low concentration of hydrogen peroxide was similar to that at high hydrogen peroxide concentration. Thus the efficient removal of PCBs in contaminated marine sediments could be achieved through treatment with Fenton-like oxidation combined with surfactant washing.

A Study on Interfacial Reaction and Mechanical Properties of 43Sn-57Bi-X solder and Cu Substrate (Sn-Bi-X계 땜납과 Cu 기판과의 계면반응 및 기계적 특성에 관한 연구)

  • Seo, Yun-Jong;Lee, Gyeong-Gu;Lee, Do-Jae
    • Korean Journal of Materials Research
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    • v.8 no.9
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    • pp.807-812
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    • 1998
  • Interfacial reaction and mechanical properties between Sn-Bi-X ternary alloys(X : 2Cu. 2Sb 5In) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 60days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3mm $\textrm{min}^{-1}$ to measure strength and elongation. According to the result of EDS, it is supposed that the soldered interfacial zone was composed of $\textrm{Cu}_{3}\textrm{Sn}$ and $\textrm{Cu}_{6}\textrm{Sn}_{5}$. According to the tensile test of Cu/solder joint, joint strength was decreased by aging treatment. Fractographs of Cu/Sn-Bi solder detailed the effect of aging on fracture behavior. When intermetallic was thin, the fracture occurred through the solder. But as the interfacial intermetallic is thickened, the fracture propagated along the intermetallic/solder interface.

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Reaction between Calcium-doped Lanthanum Chromite and Yttria Stabilized Zirconia (칼슘이 첨가된 란탄-아크롬산 염과 이트리아 안정화 지르코니아 계면간의 반응)

  • Choe, Jin-Sam
    • Korean Journal of Materials Research
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    • v.11 no.6
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    • pp.460-464
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    • 2001
  • The ceramic diffusion coupling with the green body of calcium-doped lanthanum chromite(La$_{0.8}$Ca$_{0.2}$CrO$_3$CLC- G) and sintered calcium-doped lanthanum chromite(La$_{0.8}$Ca$_{0.2}$CrO$_3$ CLC) by Pechini's method on yttria stabilized zirconia(YSZ) plate has been investigated. The X-ray diffraction pattern of CLC sides at the reacted CLC-G/ CLC and CLC/YSZ interface were identified as La$_{1-x}$ Ca$_{x}$CrO$_3$ and the unreacted YSZ side was cubic-ZrO$_2$ at the treated condition, 1300~1500 C for 10 hr in air, respectively. The order of migration components between CLC/YSZ interface was Zr>La>>Cr>>>Ca and these changes were not dependent upon the treated conditions. The grain shape and size at the interface of CLC-G/CLC was appeared to have a uniform distribution with increasing temperature. The bonding reaction of YSZ/CLC was occurred without a large amount change of the compositions in SEM photos.os.otos.os.

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Adhesion Improvement of Polymer/Metal Interface Produced by Surface Treatment (표면 처리에 의한 고분자/금속 계면에서의 접착력 향상)

  • 박수진;서민강;김학용;이덕래
    • Proceedings of the Korean Fiber Society Conference
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    • 2002.04a
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    • pp.489-492
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    • 2002
  • 고분자/금속 복합재료는 현대 전자산업에 중요한 역할을 하고 있다. 그러나 이들간의 계면은 고분자의 수축 또는 계면 안정성의 저하로 인하여 박리가 일어나게 된다. 즉, 계면의 접합이 떨어지게 되면 전기 화학적인 반응이 계면에서 발생하여 드러난 금속부위는 산화되고 산소가 환원될 때 발생하는 OH기와 같은 라디칼들에 의해 금속과 고분자 사이의 결합이 파괴되어 금속표면으로부터의 고분자의 박리가 발생한다. (중략)

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Bioactive Foam Reactors for the Enhanced Biological Degradation of Toluene (계면활성제 거품을 이용한 미생물반응기에서의 기체상 톨루엔 분해)

  • Kim, Yong-Sik;Son, Young-Kyu;Khim, Jee-Hyung;Song, Ji-Hyeon
    • Journal of Korean Society of Environmental Engineers
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    • v.27 no.5
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    • pp.468-475
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    • 2005
  • Biofilters packed with various materials have emerged as a sustainable technology for the treatment of volatile organic compounds (VOCs); however, problems including low performance and clogging are commonly encountered. Recently, a bioactive foam reactor (BFR) using surfactants has been suggested to ensure efficient and stable VOCs removal performance. This study was mainly conducted to investigate the feasibility of BFRs using toluene as a model compound. Prior to bioreactor studies, a series of bottle tests were used to select a suitable surfactant for the BFR application. Experimental results of the batch bottle tests indicated that TritonX-100 was the most appropriate one among the surfactants tested, since it showed a minimal effect on the toluene biodegradation rate while the other surfactants lowered the toluene biodegradation rate significantly. Using the selected surfactant, the BFR performance was determined by changing operating parameters including gas residence time and toluene loading. As the gas residence time increased from 0.5 minutes to 2 minutes, the toluene removal efficiency increased from approximately 50% to 80%. In addition, an increase of the toluene loading from $38\;g/m^3/hr$ to $454\;g/m^3/hr$ resulted in a decrease of toluene removal efficiency from approximately 70% to 20%. The BFR had a maximum elimination capacity of $108\;g/m^3/hr$ for toluene, which was much higher than those generally reported in the literature. The high toluene-elimination performance indicates that the BFR be a potential alternative to the conventional, packed-type biofilters. However, the limitation of toluene solubilization and foam stability at either high or low gas flow rate are still problems to be challenged.

The Kinetics of Montmorillonite Expansion in the Treatment with Hexadecyltrimethylammonium (HDTMA와 반응하는 몬모릴로나이트의 팽창 속도론)

  • Lee Seung Yeop;Cho Won Jin
    • Journal of the Mineralogical Society of Korea
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    • v.17 no.4
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    • pp.299-307
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    • 2004
  • Surfactant adsorption by two montmorillonite types with different interlayer cations of Ca and Na was characterized by examining the time dependence of surfactant behavior on the clay surfaces. Surfactants with different micelle concentration were conducted in our experiment to observe a nonequilibrium activity of cationic surfactant on the clay over reaction periods ranging from 0.1 min to 11 days. As compared with Ca-montmorillonite (SAz), a more active intrusion of surfactant molecules into the interlayers was found in Na-montmorillonite (SWy). During a short 'initiation' stage, the basal spacing of SWy montmorillonite increased rapidly with logarithmic time. For SAz montmorillonite, however, the abrupt basal spacing increase occurred at the later stage of the reaction. From the result, the difference in the adsorption behavior exhibited by the two montmorillonite types partly results from their intrinsic nature, that is, inorganic cations originally existing on the clay surfaces. Additionally, the micelle concentration of surfactants affects the development of organo-montmorillonite, especially, in the intercalant formation and stabilization under nonequilibrium.

Discontinuous precipitation in Sn-Bi Alloys (Sn-Bi계 합금의 불연속 석출현상)

  • Kim, Jeong-Seok;Kim, Ju-Hyeong;Yu, Chung-Sik
    • Korean Journal of Materials Research
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    • v.8 no.3
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    • pp.238-244
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    • 1998
  • Sn-rich합금의 석출 현상을 조사하였다. 첫째, 대기중과 진공 중에서 용해된 90Sn-o10Bi(wt%)합금을 $140^{\circ}C$에서 용체화 처리한 후 석출반응을 조사하였다. 90Sn-10Bi(wt%)합금은 불연속 석출(DP)현상을 나타냈다. 공기 중에서 용융된 시료의 DP반응이 진공 중에서 용융된 시료보다 빠르게 진행되었다. 이것은 공기 중에서 용융하는 과정에서 시료에 용존된 산소에 의해 입계 에너지가 감소한 것에 기인하는 것으로 판단된다. 둘째, 용융 후 서냉 응고된 Sn-Bi(-In)합금을 $140^{\circ}C$이하의 온도에서 열처리하여 미세조직 변화를 조사하였다. 명확한 고경각 입계가 존재하지 않는 응고조직에서, 편석영역으로부터 DP반응이 진행되어 석출셈이 형성되었다. DP반응선단에는 반응계면이 관찰되었다. 이 현상은, 이제까지 알려진 바와는 다르게, DP반응이 반응 전에 존재하는 고경각 입계뿐만 아니라 재결정현상에 의해 새로운 석출계면이 생성될 수 있음을 의미한다. 이러한 재결정 현상은 확산에 의한 정합변형(coherency strain)으로 설명된다.

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