• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.31 no.4A
• /
• pp.295-302
• /
• 2011

The setting time which is the important element for the determination of slip-up speed of Slip-Form system is the hardening time of early-age concrete when the in place concrete has minimum compressive strength before the concrete appears out of Slip-Form system. But it is very difficult to predict the setting time because it depends on not only the composition ratio of concrete but also various conditions of construction fields. Thus, the technique to estimate accurately and continuously the hardening time of early-age in place concrete during operating Slip-Form system is necessary to guarantee the safety of Slip-Form system and the maintenance of the shape of concrete. Ultrasonic wave-based nondestructive testing methods have the advantages which are accurate and continuous in estimating concrete compressive strength. Of such methods, the method using surface wave which propagates along the surface of material is effective for thick member such as a pylon. Thus, in this paper a study on the determination of slip-up speed for Slip-Form system using surface wave velocity is performed. The relation between the slip-up speed of Slip-Form system and the setting time is formulated, and the surface wave velocity is estimated from continuous wavelet transform of the numerical results for surface wave propagation. Finally, the accuracy of this method according to the distance between the wave source and receivers and the relation between the estimated surface wave velocity and the elastic modulus are investigated.

• Journal of Adhesion and Interface
• /
• v.2 no.3
• /
• pp.16-24
• /
• 2001

The curing behavior of a phenolic resin (F/p: 1.3, 1.9, 2.5 for resol resin, F/P: 0.5, 0.7, 0.9 for novolac resin) has been studied by FT-IR spectroscopy. In this study is to synthesis of resol and novolac type phenolic resin with different F/P molar ratios and to compare the level of cure at different curing temperature conditions ($130^{\circ}C$, $160^{\circ}C$, $180^{\circ}C$ for resol resin, $160^{\circ}C$, $170^{\circ}C$, $180^{\circ}C$ for novolac resin) for 3, 5, 7, 10, 20, and 60 (min.), respectively. The conversion (${\alpha}$) was determined by the ratio of the peak area with time to the peak area of non-baked phenolic QH ($3300cm^{-1}$) at spectra. It is concluded that the initial curing rate of resol and novolac resin was increased as the molar ratio of formaldehyde/phenol increased and as the curing temperature of resin increased. According to the analysis was by the homogenous first-order model, the initial curing rate of resol and novolac resin was increased as the molar ratio of formaIdehyde/phenol increased at specific curing temperature.

• Journal of the korean Society of Automotive Engineers
• /
• v.6 no.4
• /
• pp.29-35
• /
• 1984

에폭시 레진이 경화될 때 이들의 기계적 성질의 변화는 지금까지 주로 실험과 실험식에 의하여 구하여졌다. 근간에 이들의 변화를 이론적으로 구하기 위한 구성방정식이 본 발표자에 의하여 발표되었으나 실험데이터와 구성방정식 상호간의 정량적 관계가 정립되지는 못하였다. 본 연구 에서는 세 종류의 시료, 즉 Epon 815/V140, Epon 820/Z와 DER 332가 경화될 때 이들의 기계적 성질을 구성방정식을 사용하여 구하여 초음파 방법으로 측정된 실험 결과와 비교검토함으로써 에폭시 레진의 경화에 따른 기계적 성질들의 대부분을 제안된 구성 방정식으로 구할 수 있음을 보였다.

• Journal of Life Science
• /
• v.1 no.1
• /
• pp.2-14
• /
• 1991

활성산소 및 그의 반응산물들에 의해 노화가 진행되고, 특히 혈관의 노화인 동맥경화가 활성산소 및 지질과산화에 의해 유발된다면, 생체 내에서 끊임없이 생성되고 있고 경우에 따라 필수 불가결한 활성산소를 어떻게 잘 처리하는 가가 중요하다. 즉, 활성산소 발생정도에 대한 항산화능의 유도가 미치지 못한다면, 체내의 활성산소 및 그 생산물에 의해 노화, 동맥경화가 진행될 것이다. 활성산소의 생성계와 제거계의 balance가 잘 유지된다면 정상적인 노화로 자연사에 이르게 될 것이고, 이 balance가 깨어져 과도한 활성산소의 축적에 대해 제거계가 따르지 못할 경우에는 활성산소와 그 생산물에 의해 동맥경화와 비정상적인 노화가 진행될 것이다.

• Proceedings of the Korean Nuclear Society Conference
• /
• 1997.05b
• /
• pp.42-45
• /
• 1997

핵융합로 제1벽이 사용수명 동안에 받는 조사량은 300dpa 이상인데, 연구용 원자로에서 이와같은 조사량으로 조사시키기 위해서는 상당히 장기간이 요구된다. 그러므로 핵융합로 제1벽 재료의 연구에서는 중성자 조사 대신에 단시간에 높은 조사량으로 조사시킬 수 있는 싸이클로트론 등 입자가속기를 이용한 이온조사 시험이 활용되고 있다. 따라서 조사 손상에 미치는 이온조사와 중성자조사의 상관성은 대단히 중요하므로 본 연구에서는 이의 상관성에 대해 검토 분석하였는데, 이온조사시 경화가 일정하게 일어나는 plateau, 영역에서는 중성자 조사와 선형 관계가 있으나 경화가 크게 일어나는 peak 영역에서는 중성자 조사에 비해 경화가 크게 일어났다.

• Journal of the Korean Wood Science and Technology
• /
• v.38 no.4
• /
• pp.333-340
• /
• 2010

The Korean Dendropanax lacquer, made from a natural resinous sap from Dendropanax orbifera Lev., was used as a golden and transparent varnish for the traditional artifacts (armor uits, helmets, arrowheads, etc.) to make them be brilliant golden color. The cured film of the acquer has excellent protective properties such as weatherability, water resistance, and nticorrosive. But, one of disadvantages is that takes a long time and much energy to fulfill curing the lacquer. The chemical constituents of the lacquer contained conjugated diene compounds s the photopolymerizable monomers. These monomers easily polymerized in sunlight to form olden-colored, hard-coating films in a short time. Photooxidation may be one of the most mportant reactions in the chemistry of the lacquer. Although the Korean Dendropanax Lacquer hould be dried to a thoroughly dry stage to achieve optimal film properties, curing with elevated emperatures may be required for the protracted curing time at atmospheric temperature. So we ntended to accelerate the curing rate of the lacquer by dual curing of thermal and radiation uring. The effect of thermal initiator on the thermal curing reaction was evaluated by monitoring he changes in double bond peak with FT-IR. Then the curing rate of the lacquer blended with hermal initiator and photoinitiator together was measured during dual curing using a RPT with V spot curing machine. Thermal initiator not only accelerated the curing rate but also improved he physical property. And the curing rate of the Korean Dendropanax lacquer was improved by ual curing method of thermal and UV curing. According to these results, the application area of he Korean Dendropanax lacquer could be expanded to surface coatings for electronic devices uch as mobile phones or electronics.

• Polymer(Korea)
• /
• v.25 no.2
• /
• pp.199-207
• /
• 2001

In the present study the cure behavior of diglycidyl ether of bisphenol-A(DGEBA) using an anhydride-based hardener in the presence of N,N-dimethyl benzyl amine (BDMA) or 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN) as an accelerator has been monitored and interpreted from the viewpoint of photophysical properties by means of fluorescence spectroscopy. To do this, 1,3-bis-(1-pyrene)propane (BPP) was well incorporated in the epoxy resin system by mechanical blending. The BPP probe, which is very sensitive to conformational change of the molecule influenced by the surrounding medium, successfully formed intramolecular excimer fluorescence. It is susceptible to the micro-viscosity or local viscosity and molecular mobility according to the epoxy cure. The cure behavior was explained with monomer fluorescence intensity ($I_{M}$ ), excimer fluorescence intensity ($I_{E}$ ) and $I_{M}$ /$I_{E}$ ratio as a function of cure time, cure temperature and accelerator. The present work agreed with the previous report on the cure behavior of an epoxy-anhydride system studied using DSC or torsion pendulum method. This study also suggests that the use of fluorescence technique may provide information on cure behavior of a thermosetting resin in a low temperature region, which has not been well interpreted by other analytical methods.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.12
• /
• pp.261-267
• /
• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Composites Research
• /
• v.18 no.4
• /
• pp.14-20
• /
• 2005

To determine the effect of chemical structure of aromatic amino curing agents on thermal and mechanical properties, standard epoxy resin DGEBF (diglycidylether of bisphenol F) was cured with diaminodiphenyl methane (DDM) and diaminodiphenyl sulphone (DDS) in a stoichiometrically equivalent ratio. From this work the effect of aromatic amino curing agents on the thermal and mechanical properties is significantly influenced by the chemical structure of curing agents. In contrast, the results show that the DGEBF/DDS system having the sulfone structure between the benzene rings had higher values in the thermal stability, density, shrinkage ($\%$), thermal expansion coefficient, tensile modulus and strength, flexural modulus and strength than the DGEBF/DDM system having methylene structure between the benzene rings, whereas the DGEBF/DDS system presented low values in maximum exothermic temperature, conversion of epoxide, and grass transition temperature. These results are caused by the relative effects of sulfone group having strong electronegativity and methylene group having (+) repulsive property. The result of fractography shows that the grain distribution of DGEBF/DDS system is more irregular than that of the DGEBF/DDM system.

• Composites Research
• /
• v.33 no.5
• /
• pp.302-308
• /
• 2020

We measured the thermal conductivity of composite materials manufactured by the autoclave and vacuum bag only processes and predicted the cure behavior of the external and internal of composite parts with a cure kinetics model. The temperature difference between the external and internal depends on the processes because of the change of thermal conductivity. In the autoclave process, the temperature and cure behavior of the internal were similar to those of the external because of the high thermal conductivity. However, the temperature of the internal of the vacuum bag only process was different from that of the external. The difference can influence the part quality and evacuation of air. Compression tests were performed to find the mechanical property using 0° unidirectional specimens. The composite of the vacuum bag only process was found to have a lower compressive strength than that of the autoclave process.