• Korean Journal of Optics and Photonics
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• v.15 no.4
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• pp.331-336
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• 2004

The phase change due to the reflection from target surfaces in a white-light interferometer induces measurement errors when target surfaces are composed of dissimilar materials. We prove that this phase change on reflection as the polarization of the white-light changes causes a shift of both envelope peak position and fringe peak position of several tens of nanometers as the polarization of the white-light changes. In addition, we propose a new equation for white-light interference fringes depending on the polarization of the source.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.356-361
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• 1996

Nowadays, Electronic Speckle Pattern Interferometry is a well established measuring technique with a wide range of industrial applications, particularly in the fields of deformation measurement and vibration analysis. Comparing with holographic inteferometry, it has some attractive features, which are rapid recording and reconstruction, satisfiable automation etc. Time-average ESPI was used to provide vibration mode shape of an object whose vibration amplitude is given as a fringe pattern. However, it is not possible to determine the direction of motions of a point on the object at any given time, because time-average method does not give any information about the phase of vibration. A better technique is stroboscopic method which can measure the amplitude and phase of vibrating surface. In this paper, loudspeakers were tested by these two methods and the mode shape and amplitude of vibration were visualized. As measured results, we can assume that these techniques will be applied directly in the loudspeaker industry.

• Korean Journal of Optics and Photonics
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• v.14 no.4
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• pp.392-398
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• 2003

We present a novel concept of a phase-shifting diffraction-grating interferometer, which is intended for the optical testing of concave mirrors with high precision. The interferometer is configured with a single reflective diffraction grating, which performs multiple functions of beam splitting, beam recombination, and phase shifting. The reference and test wave fronts are generated by means of reflective diffraction at the focal plane of a microscope objective with large numerical aperture, which allows testing fast mirrors with low f-numbers. The fiber-optic confocal design is adopted for the microscope objective to focus a converging beam on the diffractive grating, which greatly reduces the alignment error between the focusing optics and the diffraction grating. Translating the grating provides phase shifting, which allows measurement of the figure errors of the test mirror to nanometer accuracy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.400-403
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• 2002

This paper presents a shearographic technique for measuring in-plane strains. During the measurement, the test object is illuminated alternately with two laser beams, symmetrically with respect to the viewing direction. Employing a phase shift technique, the phase distributions due to object deformation for each beam are obtained separately. The difference of the two phase distributions depicts the derivative of in-plane surface displacements. The technique is equivalent to a system of many strain gages.

• Korean Journal of Optics and Photonics
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• v.12 no.5
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• pp.362-370
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• 2001

We prove that 3-D profile mapping using white light interferometry has systematic errors caused by aberrations of the optimal system. The tilt of an object invokes an offset between the object and the reference ray, which eventually makes the aberration cancel incompletely. The fringe peak of a white light interferogram is mainly affected by the aberration effect while the envelope peak remains stable. By the difference between the two peaks, it is easily confirmed how much the error existed in the fringe peak. Experimental results prove that the error caused by aberration is varied by object tilt, microscope NA, optics alignment within the range of $\pm$50nm.

• Journal of the Institute of Convergence Signal Processing
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• v.7 no.3
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• pp.122-129
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• 2006

We propose the Fizeau-type phase shifting interferometer(FPSI) system for the performance test of high-order aspheric lenses. The proposed system is divided into two parts : optical part and signal processing part. Those two parts are operated by a program for hardware control. We also developed an analysis program adopting the phase shifting algorithm to analyze the obtained interferograms. We can confirm that the proposed system is efficient and adequate by direct comparison with the standard criterion in Mark IV interferometric system of Zygo. The peak-to-valley and RMS values of surface errors which are used to characterize high-order aspheric lenses are 0.845 wave and 0.1871 wave, respectively. The measurement errors between the proposed system and Mark IV are less than ${\lambda}/100$ and the repeatability is also calculated at less than ${\lambda}/100$.

• Journal of Astronomy and Space Sciences
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• v.14 no.1
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• pp.117-125
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• 1997

A Fabry-Perot interferometer has a very high (~1,000,000) resolution, so recently this has been widely used for many fields of space science. To understand the working principle of this a mathematical modeling is needed, and to analyze the interferogram it is essential to know the precise instrument function. The spectrum from the interferometer is mixed with a true signal from the light source and the instrument function through convolution. The true signal has the information about the quantum state of mo lecules, temperature and bulk motion of the gas. Therefore if we model the signal and convolve this with the theoretical instrument function we can predict the spectrum for the real case.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.12
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• pp.113-119
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• 1998

Recently Electronic Speckle Pattern Interferometry(ESPI) has been studied because it has the advantages to be able to measure the whole-field surface deformations of engineering components and materials in industrial areas with noncontact. The speckle patterns to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase informations of surface deformations. In this study we used this interference phenomena and the phase shifting method to measure the inplane deformations, together with the use of digital image equipment to process the informations contained in the speckle pattern and to display consequent interferograms on TV monitor. FEA was performed before experiments and we obtained good agreement between the experimental results and FEA.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.251-254
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• 2003

In recent years, shearogrpahy has significantly improved capabilities In the areas of unbend and separation detection in tires. Although shearography has many advantages fur qualitative evaluation, the technique remains the problem of quantitative analysis of inside defects, because shearography needs several effective factors including the amount of shearing, shearine direction and induced load, which exist as barrier for the quantitative analysis of inside defects. Since the factors are highly dependent on inspectors skill and also affect the in-situ workability. The factors were optimized and the size of cracks inside of pipeline and tire has been quantitatively determined.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.8
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• pp.1530-1535
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• 1992

An optical method of phase shifting interferometry is presented for the 3-dimensional profile measurement of mirror surfaces with nanometer resolution. A series of optical interferometric fringes are generated by comparing the surface to be measured with a reference flat. The fringes are captured by a CCD camera and then analyzed to obtain actual surface profile. Detailed principles are described along with necessary image processing algorithms. finally, several measurement examples are discussed which were performed on lapped surfaces, hard discs, and semiconductor wafers.