• Title/Summary/Keyword: 간섭검사

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Near Field Data Communication Mechanism based on Inaudible Sound (비가청주파수 기반 근거리 통신 메커니즘)

  • Jang, Insu;Chung, Myoungbeom;Yeom, Sanggil;Choo, Hyunseung
    • Proceedings of the Korea Information Processing Society Conference
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    • 2015.10a
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    • pp.343-344
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    • 2015
  • 본 논문에서는 비가청주파수 소리신호를 사용하는 데이터 전송 기법을 제안한다. 제안하는 방법은 각 비트에 매핑된 특정 주파수를 혼합하여 신호를 전송함으로써 동시에 여러 비트를 전송할 수 있다. 그리고 인접한 주파수 신호의 간섭으로 인한 데이터 에러를 검출하기 위해 순환 중복 검사 기법을 사용함으로써 데이터 전송 정확도를 높인다. 이 기법은 기존 전송 속도의 한계로 제한된 분야에서만 사용했던 비가청주파수 무선 통신 기법을 더 다양한 분야에 활용할 수 있을 것이다.

Enhancement of Ultrasonic C-scan Images for Inspection of Multi-layered Composite Panels (다층 후판 복합재 패널의 결함 검출을 위한 C-Scan 이미지 보정기법)

  • Cho Hyun;Song Sung-Jin
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2006.05a
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    • pp.264-267
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    • 2006
  • One of the serious problems that make the flaw identification in a multi-layered thick composite panel more difficult is the interferenceeffect of the upper layer. To take care of such a problem, here we propose an image enhancement approach that can get rid of such an interference effect to ultrasonic C-scan images by a normalization of the acquired signals by a reference signals, and demonstrate its performance in the experiments. Specifically, three specimens with artificial flaws are prepared and ultrasonic C-scan images are acquired experimentally to eliminate the undesired interference effect. Cleat successes are observed in the present study demonstrating the high potential of the proposed algorithm as a practical image enhancement tool in many practical situations.

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Multi-Point Optical Fiber Grating Strain Sensor System (광섬유 격자 다중화 스트레인 센서 시스템)

  • Lee, Yong-Wook;Jung, Jae-Hoon;Chung, Seung-Hwan;Lee, Byoung-Ho;Kim, Nam-Sik
    • Journal of the Korean Society for Nondestructive Testing
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    • v.21 no.2
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    • pp.147-151
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    • 2001
  • An optical fiber sensor is capable of nondestructive measurement of a structure and it has an advantage of the immunity to electromagnetic interference because light is not affected by electromagnetic wave. In addition, if optical fibers are buried in an object like a concrete, this sensor tan analyze defects and physical status of the object without disassembling it. Especially, the fiber Bragg grating sensor is a promising optical fiber sensor capable of nondestructive test of such an object. A fiber Bragg grating has the characteristics of reflecting or blotting light of a specific wavelength. If we apply physical quantity like strain to the fiber Bragg grating, the center wavelength of the reflected light is shifted and then we can find the physical quantity applied to the fiber Bragg grating by measuring the center wavelength shift of the reflected light. The fiber Bragg grating sensor capable ot static and dynamic strain measurement is being used in health-monitoring of buildings, structures, etc. Recently increasing is interest in dynamic strain measurement inevitable to the civil structures such as roads and bridges. In this study we implemented the optical fiber sensor system which can measure dynamic strain at multiple points using Fabry-Perot wavelength demodulation. And we measured the static and dynamic strain using this sensor system with a test structure(cantilever). Measurement results were similar to those obtained with the conventional electrical measurement methods.

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Development of Defect Inspection System for Polygonal Containers (다각형 용기의 결함 검사 시스템 개발)

  • Yoon, Suk-Moon;Lee, Seung-Ho
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.485-492
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    • 2021
  • In this paper, we propose the development of a defect inspection system for polygonal containers. Embedded board consists of main part, communication part, input/output part, etc. The main unit is a main arithmetic unit, and the operating system that drives the embedded board is ported to control input/output for external communication, sensors and control. The input/output unit converts the electrical signals of the sensors installed in the field into digital and transmits them to the main module and plays the role of controlling the external stepper motor. The communication unit performs a role of setting an image capturing camera trigger and driving setting of the control device. The input/output unit converts the electrical signals of the control switches and sensors into digital and transmits them to the main module. In the input circuit for receiving the pulse input related to the operation mode, etc., a photocoupler is designed for each input port in order to minimize the interference of external noise. In order to objectively evaluate the accuracy of the development of the proposed polygonal container defect inspection system, comparison with other machine vision inspection systems is required, but it is impossible because there is currently no machine vision inspection system for polygonal containers. Therefore, by measuring the operation timing with an oscilloscope, it was confirmed that waveforms such as Test Time, One Angle Pulse Value, One Pulse Time, Camera Trigger Pulse, and BLU brightness control were accurately output.

Application of Laser Ultrasonic Technique for Nondestructive Evaluation of Wall Thinning in Pipe (배관부 감육 손상의 비파괴 평가를 위한 레이저 초음파 기술 적용)

  • Hong, Kyung-Min;Kang, Young-June;Park, Nak-Kyu;Yoon, Suk-Bum
    • Journal of the Korean Society for Nondestructive Testing
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    • v.33 no.4
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    • pp.361-367
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    • 2013
  • Many of the nuclear power plant pipe is used in high temperature and high pressure environment. Wall thinning frequently caused by the corrosion. These wall thinning in pipe is expected gradually increase as nuclear power become superannuated. Therefore there is need to evaluate wall thinning in pipe and corrosion defect by non-destructive method to prevent the accident of the nuclear power facility due to pipe corrosion. Especially for real-time assessment of the wall thinning that occurs in nuclear power plant pipe, the laser ultrasonic technology can be measured even in hard-to-reach areas, beyond the limits of earlier existing contact methods. In this study, the optical method using laser was applied for non-destructive and non-contact evaluation. Ultrasonic signals was acquired through generating ultrasonic by pulse laser and using laser interferometer. First the ultrasonic signal was detected in no wall thinning in pipe, then a longitudinal wave velocity was measured inside of pipe. Artificial wall thinning specimen compared to 20, 30, 40 and 50% of thickness of the pipe was produced and the longitudinal wave velocity was measured. It was possible to evaluate quantitatively the wall thinning area(internal defect depth) cause it was able to calculate the thickness of each specimen using measured longitudinal wave velocity.

Measurement of Glucose and Protein in Urine Using Absorption Spectroscopy Under the Influence of Other Substances (타 성분 영향을 고려한 요당과 요단백의 흡수분광학 진단)

  • Yoon, Gil-Won;Kim, Hye-Jeong
    • Korean Journal of Optics and Photonics
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    • v.20 no.6
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    • pp.346-353
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    • 2009
  • Glucose and protein in urine are among the important substances for urine analysis and have generally been measured based on a reagent strip test. In this study, these two substances were measured using mid-infrared absorption spectroscopy. Samples were prepared from a commercial synthetic urine product. Glucose and albumin were added as well as red blood cells, which are expected to create the most spectroscopic interference of any substance. Concentrations of these substances were varied independently. Optimal wavelength regions were determined from a partial least squares regression analysis (glucose 980 - 1150/cm, albumin 1400 - 1570/cm). Interference by other substances increased the differences between measured and predicted values. Albumin measurement in particular weres heavily influenced by the presence of glucose and red blood cells. Depending on the inference by other substances, measurement errors were 29.85${\sim}$45.19 mg/dl for a glucose level between 0 and 1000 mg/dl and 14.0${\sim}$93.11 mg/dl for an albumin level of 0 ${\sim}$ 500 mg/dl. Our study proposes an alternative to the chemical test-strip analysis, which shows only discrete concentration levels.

Measurement of Width and Step-Height of Photolithographic Product Patterns by Using Digital Holography (디지털 홀로그래피를 이용한 포토리소그래피 공정 제품 패터닝의 폭과 단차 측정)

  • Shin, Ju Yeop;Kang, Sung Hoon;Ma, Hye Joon;Kwon, Ik Hwan;Yang, Seung Pil;Jung, Hyun Chul;Hong, Chung Ki;Kim, Kyeong Suk
    • Journal of the Korean Society for Nondestructive Testing
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    • v.36 no.1
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    • pp.18-26
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    • 2016
  • The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.

Evaluation of HbA1c Levels Via the Latex Immunoturbidimetric Method by Using Chemistry Autoanalyzer (자동화학분석기에서의 라텍스 면역비탁법의 Autolab HbA1c 평가)

  • Jo, Yongjun;Lee, So-young;Park, Hae-il;Kim, YeongSic;Lee, Jehoon;Kim, Yonggoo;Han, Kyungja
    • Laboratory Medicine Online
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    • v.2 no.1
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    • pp.10-14
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    • 2012
  • Background: Measurement of HbA1c levels is widely used to diagnose diabetes mellitus and to evaluate and monitor plasma-glucose concentrations over 6-8 weeks. In this study, we evaluated the diagnostic performance of the newly developed latex immunoturbidimetric method by using Autolab HbA1c. Methods: We analyzed and compared the diagnostic performance of Autolab HbA1c with that of Toshiba 200FR between April 2009 and July 2009. According to guidelines (EP5-A2, EP6-P, EP9-A2) of the clinical and laboratory standards institute (CLSI), we compared linearity, precision and correlation of Autolab HbA1c with those of G7 (Tosoh Corp., Kyoto, Japan) by using high-performance liquid chromatography (HPLC) method. Results: Data obtained using Autolab HbA1c showed good linearity in mixtures of samples with low (3.1%) and high (15.1%) levels of HbA1c (r2=0.9997). In the analysis of within-run precision of the samples with HbA1c levels of 5.1% and 12.1%, the SDs were 0.04 and 0.06 and covariances of these samples were 0.8% and 0.5%, respectively. In the Deming regression model, the regression equation was as follows: Autolab HbA1c=1.0859×Tosoh HPLC-0.6957. Conclusions: In this study, Autolab HbA1c method showed better performance characteristics than Tosoh G7 did. In reference review, there was no interference of variant hemoglobin. The data acquisition time of Autolab HbA1c was lower than that of Tosoh G7. The advantages of Autolab HbA1c are that it can be used as an autoanlyzer in routine chemical analysis, it does not require pre-analytical treatment, and the samples are automatically treated with distilled water for hemolysis.

A Study on the Development of Diagnosing System of Defects on Surface of Inner Overlay Welding of Long Pipes using Liquid Penetrant Test (PT를 이용한 파이프내면 육성용접부 표면결함 진단시스템 개발에 관한 연구)

  • Lho, Tae-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.10
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    • pp.121-127
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    • 2018
  • A system for diagnosing surface defects of long and large pipe inner overlay welds, 1m in diameter and 6m in length, was developed using a Liquid Penetrant Test (PT). First, CATIA was used to model all major units and PT machines in 3-dimensions. They were used for structural strength analysis and strain analysis, and to check the motion interference phenomenon of each unit to produce two-dimensional production drawings. Structural strength analysis and deformation analysis using the ANSYS results in a maximum equivalent stress of 44.901 MPa, which is less than the yield tensile strength of SS400 (200 MPa), a material of the PT Machine. An examination of the performance of the developed equipment revealed a maximum travel speed of 7.2 m/min., maximum rotational speed of 9 rpm, repeatable position accuracy of 1.2 mm, and inspection speed of $1.65m^2/min$. The results of the automatic PT-inspection system developed to check for surface defects, such as cracks, porosity, and undercut, were in accordance with the method of ASME SEC. V&VIII. In addition, the results of corrosion testing of the overlay weld layer in accordance with the ferric chloride fitting test by the method of ASME G48-11 indicated that the weight loss was $0.3g/m^2$, and met the specifications. Furthermore, the chemical composition of the overlay welds was analyzed according to the method described in ASTM A375-14, and all components met the specifications.

A study of fabrication micro bump for TSP testing using maskless lithography system. (Maskless Lithography system을 이용한 TSP 검사 용 micro bump 제작에 관한 연구.)

  • Kim, Ki-Beom;Han, Bong-Seok;Yang, Ji-Kyung;Han, Yu-Jin;Kang, Dong-Seong;Lee, In-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.5
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    • pp.674-680
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    • 2017
  • Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.