• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.146-146
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• 1999

BN은 천연에는 존재하지 않는 인공재료로서 특히 섬아연광형 질화붕소인 c-BN은 다이아몬드 다음가는 고경도, 높은 열전도도를 가지고 있을 뿐만 아니라 다이아몬드와는 달리 철계금속에 대해 화학적으로 매우 안정하기 때문에 다이아몬드의 응용이 매우 제한되고 있는 철강제품의 가공공구, 내마모 코팅재료로서 주목받고 있는 차세대 박막재료이다. 최근 c-BN박막 합성에 관한 많은 연구결과들이 보고되었는데 대부분의 연구자들이 성장하는 박막 표면에 입사되는 이온 에너지 및 유량이 c-BN 합성에 중요한 인자이며, 합성된 박막은 sp2결합층(h-BN)과 sp3결합층(c-BN)이 혼합되어 있음을 알 수 있다. 그러나 기존의 이온빔보조 합성법(IBAD) 공정에서는 입사빔과 증착물질이 공간적, 시간적으로 일치되는 경우에만 입사빔의 운동에너지가 증착공정에 기여하기 때문에 입사빔의 정밀한 에너지 조절이 어렵게 된다. 그러나 음이온 빔 직접 증착법에서는 입사이온빔 자신이 운동에너지를 운반하기 때문에 에너지 조절이 정밀할 뿐만 아니라 이를 통해 BN 박막의 상 및 성장거동을 조절할 수 있게 된다. 본 연구에서는 음이온 직접 증착법을 이용하여 c-BN박막을 합성하고 이의 초기성장층의 성장거동을 조사하였다. 증착시 음이온 빔의 에너지가 Bn 박막의 결정성에 미치는 영향을 알아보기 위하여 100~500eV의 보론 음이온빔을 조사하였으며 질소원으로는 낮은 낮은 에너지 범위의 질소이온을 동시에 공급하였다. FRIR 분석결과, 보론 이온의 에너지가 증가하면 cubic 상의 분율이 증가하였으며 증착된 박막은 15nm 두께의 sp2결합층이 먼저 성장한후 sp3결합층으로의 상전이가 일어났다. 질소이온빔의 에너지는 100eV 일 때 최대 cubic 함량과 두께를 보였으며 그 이상의 에너지에서는 c-BN 박막을 sputter시켰다. AFM 관찰결과, h-Bn층은 날카롭고 방향성을 가진 침상이었으며 c-BN 층은 atomically smooth 한 표면을 관찰할 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.79-79
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• 2011

water cavitation peening(WCP)은 water jet 과정으로 인한 cavitation이 발생할 때, 금속표면 cavitation 현상에 의해 재료표면의 잔류응력과 경도 등의 물성을 변화시키게 되며, 그로 인해 생긴 잔류 응력으로 재료의 내구성 및 수명을 향상시키는 기술이다. 최근에는 water jet을 이용한 장치들이 건설 분야, 일반기계분야, 컷팅 공정, 분쇄 등 다양한 분야에서도 사용되고있다. 그러나 water jet을 이용한 peening은 소개 된지 20여년이 경과했음에도 불구하고 연구 및 개발 내용은 shot peening에 비해 아직 초기 단계이다. water cavitation peening은 기존의 피닝 방법의 단점을 보완 할 뿐만 아니라 환경적인 측면에서도 그 가치가 크다. 아직은 다른 peening 기법 보다 잔류압축응력 부가 측면에서 그 효과가 떨어지지만, water cavitation peening은 열에 영향을 받는 영역이 생성되지 않으며, 기계의 표면 가공을 하는 동안 어떤 미세한 먼지도 생성하지 않아 친환경적이다. 또한 복잡한 외형을 가지는 부품 및 내면에 적용성이 뛰어나고, 표면 정밀도 저하가 낮다는 장점이 있다. 본 연구에서는 조류발전용 블레이드의 재료로 사용하려는 동합금에 대하여 증류수 내에서 water cavitation peening 시간, 거리, 파형 등의 변수를 적용하여 최적 조건을 찾고, 다양한 전기화학적 실험을 실시하였으며, water cavitation peening 부의 부식특성을 평가 하였다. ASTM-G32 규정에 의거하여 압전효과를 용한 진동발생 장치(RB 111-CE)를 이용하여 동합금 표면에 water cavitation peening을 실시하고, 실험 후 표면의 손상거동을 관찰하기 위하여 3D현미경 및 전자주사현미경(SEM)을 사용하였다. 물성치 변화를 확인하기 위하여 SHIMADZU사의 HVM-2 Model의 비커스 경도기를 이용하여 표면 경도값을 측정하였다. 전기화학실험은 각 3회 이상 실시하였으며, Tafel 분석결과로 부식전류밀도와 부식전위의 평균, 부식전위를 알 수 있었고, 음분극 실험결과, 용존산소 환원반응에 의한 농도분극에서 수소가스발생에 의한 활성화 분극으로 진행되는 변곡점을 확일 할 수 있었다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1581-1588
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• 2011

In this study, flow characteristics in a multi-cavity injection molding process were investigated. One of main problems occurred in the multi-cavity molding is a flow imbalance among cavities since it affects physical properties and quality of products. Charge imbalance is caused by the uneven shear stress. Therefore, changes in viscosity affect the physical properties of resin and injection conditions differ in the filling imbalance phenomenon. Through, this study focus on experimental studies of flow imbalance for PC and PP resin occurring in a balanced delivery system. Experimental results were compared with CAE results. By experimental and CAE analysis, main cause for the flow imbalance is temperature distribution in cross section of runner. New runner system with a simple change of runner shape was suggested to avoid the flow imbalance. A series of simulation to confirm feasibility of Volume Runner's effects was conducted using injection molding CAE.

• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.361-365
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• 2005

An absolute interferometer system with multiple point-sources is devised for tile 3-D measurement of rough surface profiles. The positions of the point sources are determined to be the system parameters that influence the measurement accuracy, so they are calibrated precisely prior to performing actual measurements. For the calibration, a CCD camera composed of a two-dimensional array of photo-detectors was used. Performing optimization of the cost function constructed with phase values measured at each pixel on the CCD camera, the position coordinates of each point source is precisely determined. Measurement results after calibration performed for the warpage inspection of chip scale packages (CSPs) demonstrate that the maximum discrepancy is 9.8 mm with a standard deviation o( 1.5 mm in comparison with the test results obtained by using a Form Taly Surf instrument.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.1
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• pp.98-103
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• 2001

Machining is the commonly used process in the manufacturing of prototypes. This process offers several advantages, such as rigidity of the machine, precision of the machine, precision of the operation and specially a quick delivery. The weight and immobility of the machine support and immobilize the part during the operation. However, despite these advantages it shows, machining still presents several limitations. The immobilization, location and support of the part are referred to as fixturing or workholding and present the biggest challenge for time efficient machining. So it is important to select and design the appropriate fixturing assembly. This assembly depends on the complexity of the part and the tool paths and may require the construction of dedicated fixtures. With traditional techniques, the range of fixturable shapes is limited and the identification of suitable fixtures in a given setup involves complex reasoning. To solve this limitation and to apply the automation, this paper presents the Reference Free Part Encapsulation(RFPE) and implementation of the encapsulation system. The feature-based modeling system and the encapsulation system are implemented. The small part of which it is difficult to find out the appropriate fixturing assembly is made by this system.

• Journal of the Korean Society for Precision Engineering
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• v.5 no.1
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• pp.84-93
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• 1988

The on-line detection of the chip flow is one of the most important technologies in com- pletly automatic operation of machine tool, such as FMS and Unmanned Factories. This problem has been studied by many researchers, however, it is not solved as yet. For the recognition of chip flow in this study, the dynamic cutting force components due to the chip breaking were measured by dynamometer of piezo-electric type, and the frequency components of cutting force were also analyzed. From the measured results, the effect of cutting conditions and tool geometry on the dynamic cutting force component and chip formation were investigated in addition to the relationships between frequency of chip breaking (fB) and side serrated crack (fC) of chip. As a result, the following conclusions were obtaianed. 1) The chip formations have a large effect on the dynamic cutting force components. When chip breaking takes place, the dynamic cutting force component greatly increases, and the peridoic components appear, which correspond to maximum peak- frequency. 2) The crater wear of tool has a good effect on the chip control causing the chiup to be formed as upward-curl shape. In this case, the dymamic cutting force component greatly increases also 3) fB and fC of chip are closely corelated, and fC of chips has a large effect on the change of the situation of chip flow and dynamic cutting force component. 4) Under wide cutting conditions, the limit value (1.0 kgf) of dynamic cutting force component exists between the broken and continuous chips. Accordingly, this value is suitable for recognition of chip flow in on-line control of the cutting process.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.35 no.3
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• pp.203-210
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• 2017

Korea has established an advanced infrastructure for real-time precise positioning such as CORS, virtual reference station service and perform continuous upgrading. However, in order to utilize the national infrastructure, it is necessary to process the acquired spatial information and take many steps to derive the final product. In addition, this process is highly dependent on foreign software. In this study, GNSS field survey system was developed and evaluation of its usability was performed. Real-time GNSS field survey system was developed and the system improves user̓s convenience and usability. The system was able to conduct survey effectively and produce the results. In addition, we compare the existing software with the survey performance to show the availability of the real-time GNSS surveying system. The system developed through the research can perform all the functions from real-time survey to the production of the outputs. It can create economical added value of the foreign software as a whole and simplify the work required for post-survey performance.

• Journal of the Society of Naval Architects of Korea
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• v.31 no.3
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• pp.129-134
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• 1994

A Laser Cutter is designed for the precise fabrications in the shipyards recently. The cutter is a gantry type one with specified functions of movability and strength in order to satisfy the workability. The gantry frame should move with a certain velocity in a relatively short time for the proper cutting of the object materials. The gantry is fitted with ball screw and the acceleration field is formed by actuating this ball screw. The relative displacement should be within the allowable design criteria to make sure the precise cutting of the materials by the laser. In this paper, modal and structural analysis for a Laser Cutter which is commonly used in the shipyards, is carried out to check the design criteria of the system. The system is modeled by placing the proper shell and soils finite elements and fictitious mass properties to represent the real one. The way how to extract the loading conditions based on the given velocity criteria of the system is presented. Static structural analysis is performed and the results came out as expected. Modal analysis for finding eigen-values and mode shapes of the system is performed and it is shown that the time dependent dynamic analysis is unnecessary for this system for its operating circumstances.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.14 no.4
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• pp.323-327
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• 2021

This paper produced SUS MASK, which is used for OLEDs, using an automatic liquid management system. The SUS MASK was tested by setting the hole diameter to 0.4 mm. The additive F300 was found to be excellent as the hole diameter was close to 0.4 mm and the error range was measured to be 0.08 on average. And as a result of measuring the weight reduction amount of CuCl2 and FeCl3 according to the change in oxidation-reduction potential (ORP), FeCl3 is relatively sensitive to ORP changes. Experiments were conducted on whether ORP (610 mV) and specific gravity (1.463) were automatically controlled while continuously etching the SUS Mask. Experimental results show that the automatic liquid management system is well controlled because the setting value is not significantly changed. After setting the hole diameter to 0.4 mm as the target, the experiment results were measured from 0.36 to 0.44. Therefore, it is expected that etching processing in the manufacturing process of SUS MASK can be improved with higher precision by applying the manufactured automatic liquid management system.