• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.7-16
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• 2015

Effects of chemical composition ($Cu^{2+}$, $K_4P_2O_7$ and additive concentrations) of baths on properties of Cu thin films electrodeposited from pyrophosphate copper bath were investigated. Current efficiency was increased to be near 100% with increasing $Cu^{2+}$ concentrations from 0.02 to 0.3M. Decrease of current efficiency was observed in the range of 1.5~1.8M $K_4P_2O_7$ concentration, but current efficiency of about 100% was measured in the ranges of both 0.9~1.3M and 2.1~2.4M. The change of additive concentration did not influenced current efficiency. Residual stress of electrodeposited Cu thin films was measured to be about 20 MPa below 0.15 M $Cu^{2+}$ concentration and increased with the increase of it to 0.25 M. Maximum residual stress of 120MPa was observed at 0.25M $Cu^{2+}$ concentration. On the other hand, residual stress decreased from 80 to near 0 MPa as $K_4P_2O_7$ concentration varied from 0.9 to 2.4M and but The change of additive concentration did not affected on residual stress. $Cu^{2+}$ and $K_4P_2O_7$ concentrations significantly affect on surface morphology of electrodeposited Cu thin films, but additive concentration slightly affected. From XRD analysis, the microstructures of electrodeposited Cu thin film was affected from the changes of $Cu^{2+}$ and $K_4P_2O_7$ concentrations, but not from that of additive concentration. Strong preferred orientation of (111) peak was observed with increasing $Cu^{2+}$ and $K_4P_2O_7$ concentrations.

• Journal of the Korean Magnetics Society
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• v.10 no.2
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• pp.67-73
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• 2000

Top spin valve samples with a structure Ta/NiFe/CoFe/Cu/CoFe/FeMn/Ta were deposited on a Si(100) substrate by changing d.c. magnetron sputtering conditions and the exchange-bias and magnetic properties of samples were investigated. The Exchange field, H$\_$ex/ increased with increase of sputtering power of FeMn from 30 to 150 W and CoFe from 30 to 100 W deposited on the Cu, the increase of H$\_$ex/ was found due to the improvement of preferred orientation of (111) FeMn phase from XRD results. In the case of Cu, H$\_$ex/ decreased with the increase of sputtering pressure ranging from 1 to 5 mTorr. The relationship between exchange field and resistance was investigated, spin valve samples with a large exchange field showed the lower resistance, which was strongly dependent on the good crystallinity and grain size increase as well as lower scattering effects. The Cu thickness was changed from 22 to 38 $\AA$ for Si/Ta/NiFe/CoFe/Cu(t), 30 W/CoFe, 100 W/FeMn, 100 W/Ta spin valve structures, MR ratio of 6.5 % and exchange field of about 190 Oe were obtained for the sample with Cu of 22 $\AA$ thickness. The increase of exchange field with decrease of Cu thickness was explained by FM/AFM spin-spin interaction.

• Journal of the Korean Vacuum Society
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• v.19 no.4
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• pp.293-299
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• 2010

Vertically aligned ZnO nanorods on Si (111) substrate were prepared by hydrothermal method. The ZnO nanorods on spin-coated seed layer were synthesized at $140^{\circ}C$ for 6 hours in autoclave and were thermally annealed in argon atmosphere for 20 minutes at temperature of 300, 500, $700^{\circ}C$. The effects of the thermal annealing on the structural and optical properties of the grown on ZnO nanorods were investigated by X-ray diffraction (XRD), field-emission scanning electron microscopy (FE-SEM), photoluminescence (PL). All the ZnO nanorods show a strong ZnO (002) and weak (004) diffraction peak, indicating c-axis preferred orientation. The residual stress of the ZnO nanorods is changed from compressive to tensile by increasing annealing temperature. The hexagonal shaped ZnO nanorods are observed. The PL spectra of the ZnO nanorods show a sharp near-band-edge emission (NBE) at 3.2 eV, which is generated by the free-exciton recombination and a broad deep-level emission (DLE) at about 2.12~1.96 eV, which is caused by the defects in the ZnO nanorods. The intensity of the NBE peak is decreased and the DLE peak is red-shifted due to oxygen-related defects by thermal annealing.