• 대한화학회지
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• 제66권5호
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• pp.341-348
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• 2022

In this work, radio frequency magnetron sputtering was used to deposit zinc selenide thin films on p-type silicon (100) wafers and glass substrates in a high vacuum chamber. Several surface characterization instruments were implemented to study the thin films. X-ray photoelectron spectroscopy results revealed that oxidized Zn bound to Se (Zn-Se) at 1022.7 ± 0.1 eV becomes the dominant oxidized species when Se concentration exceeds 70%. Scanning electron microscopy coupled with energy dispersive spectroscopy showed that incorporating Se in Zn thin films will lead to formation of ZnSe grains on the surface. Contact angle measurements indicated that ZnSe-60 exhibited the lowest total surface free energy value of 24.94 mN/m. Lastly, ultraviolet-visible spectrophotometry and ultraviolet photoelectron spectroscopy data evinced that the energy band gap gradually increases with increasing Se concentration with ZnSe-70 having the highest work function value of 4.91 eV.

• Journal of Radiation Protection and Research
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• 제28권2호
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• pp.87-95
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• 2003

반도체 검출기의 p+ 층의 도핑 농도, 열처리에 의한 불순물 재분포와 절단면에서의 guard ring 효과를 전산모사하여 최적의 구조와 공전을 설계하고, MCNP코드로 방사선 반응 특성을 분석하였다. 검출기는 반도체 집적회로 공정에서 설계된 공정변수를 적용하여 격자 방향 <100>, $400{\Omega}cm$, n형, Floating-Zone 실리콘 기판에서 제작되었다. 제작된 검출기의 누설전류 밀도는 $0.7nA/cm^2/100{\mu}m$로서 전기적 특성이 우수한 것으로 나타났으며, Cs-137 감마 선원에 의한 $5mR/h{\sim}25R/h$의 조사선량률 범위에서 방사선 반응 특성은 양호한 선형성을 보였다. 본 연구에서 제안된 공정으로 제작된 PIN 반도체 검출기는 개인선량 측정에 사용될 수 있을 것이다.

• 한국자기학회지
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• 제15권5호
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• pp.287-291
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• 2005

새로운 저온 박막증착 공정인 원자층 증착방법으로 증착된 $HfO_2$ 박막을 게이트의 유전물질로 사용하여 MOSFET 소자를 제작하기 위하여 $HfO_2$ 박막의 특성을 개선하고 평가하였다. MOSFET 소자는 p-type (100) 실리콘 웨이퍼 위에 두께가 $5\~6\;nm$인 원자층 증착 $HfO_2$ 박막을 증착한 다음, 압력이 $1\~20\;atm$의 $H_2$ 가스로 열처리 하여 활성 영역이 $5{\times}10^{-5}\;cm^2$이 되도록 알루미늄으로 전극을 증착하였다. 제작된 MOSFET 소자는 열처리 압력이 20 atm일 경우 $5\~10\%$ 정도 드레인 전류와 transconductance가 개선되었으며, 이것은 고집적화된 소자의 신뢰성 향상에 크게 기여할 것으로 생각된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.314-314
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• 2012

The dilute magnetic semiconductors (DMS) have been developed to multi-functional electro-magnetic devices. Specially, the Si based DMS formed by ion implantation have strong advantages to improve magnetic properties because of the controllable effects of carrier concentration on ferromagnetism. In this study, we investigated the deep level states of Fe- and Co-ions implanted Si wafer during rapid thermal annealing (RTA) process. The p-type Si (100) wafers with hole concentration of $1{\times}10^{16}cm^{-3}$ were uniformly implanted by Fe and Co ions at a dose of $1{\times}10^{16}cm^{-2}$ with an energy of 60 keV. After RTA process at temperature ranges of $500{\sim}900^{\circ}C$ for 5 min in nitrogen ambient, the Au electrodes with thickness of 100 nm were deposited to fabricate a Schottky contact by thermal evaporator. The surface morphology, the crystal structure, and the defect state for Fe- and Co- ion implanted p-type Si wafers were investigated by an atomic force microscopy, a x-ray diffraction, and a deep level transient spectroscopy, respectively. Finally, we will discuss the physical relationship between the electrical properties and the variation of defect states for Fe- and Co-ions implanted Si wafer after RTA.

• 한국재료학회지
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• 제4권5호
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• pp.510-515
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• 1994

플라즈마 화학 증착법으로 (100)p-type Si wafer위에 $Y_2O_3$-Stabilzed $ZrO_2$박막을 증착하였다. 반응 기체로는 zirconium triflouracethylacetonate[Zr(tfacac) $[Zr(tfacac)_4]$, tri(2.2.6.6 tetramethy1-3, 5-heptanate) yttrium $[Y(DPM)_3]$과 oxygen gas를 사용하였다. X-ray diffraction(XRD)과 fourier Particle induced x-ray emission(PIXE)을 통하여 $Y(DPM)_3$ bubbling temperature가 $160^{\circ}C, 165^{\circ}C, 170^{\circ}C$일때 $Y_2O_3$함량이 12.1mo1%, 20.4mol%, 31.6mol%임을 알 수 있었다. C-V측정에서 $Y(DPM)_3$ bubbling temperature가 증가함에 따라 flat band voltage가 더욱더 음의 방향으로 이동하였다.

• Current Photovoltaic Research
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• 제10권4호
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• pp.95-100
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• 2022

Solar cell is a device that converts photon energy into electrical energy. Therefore, absorption of solar spectrum light is one of the most important characteristics to design the solar cell structures. Various methods have emerged to reduce optical losses, such as textured surfaces, back contact solar cells, anti-reflection layers. Here, the anti-reflection coating (ARC) layer is typically utilized whose refractive index value is between air (~1) and silicon (~4) such as SiN_x layer (~1.9). This research is to print a material called polydimethylsiloxane (PDMS) to form a double anti-reflection layer. Light with wavelength in the range of 0.3 to 1.2 micrometers does not share a wavelength with solar cells. It is confirmed that the refractive index of PDMS (~1.4) is an ARC layer which decreases the reflectance of light absorption region on typical p-type solar cells with SiN_x layer surface. Optimized PDMS printing with analyzing optical property for cell structure can be the effective way against outer effects by encapsulation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.8-9
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• 2006

Hafnium oxide ($HfO_2$) thin films were deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$. Prior to the deposition of $HfO_2$ films, a thin Hf ($10\;{\AA}$) metal layer was deposited. Deposition temperature of $HfO_2$ thin film was $350^{\circ}C$ and its thickness was $150\;{\AA}$. Samples were then annealed using furnace heating to temperature ranges from 500 to $900^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Thermally evaporated $3000\;{\AA}$-thick AI was used as top electrode. In this work, We study the interface characterization of $HfO_2$/Hf/Si MOS capacitor depending on annealing temperature. Through AES(Auger Electron Spectroscopy), capacitance-voltage (C-V) and current-voltage (I-V) analysis, the role of Hf layer for the better $HfO_2$/Si interface property was investigated. We found that Hf meta1 layer in our structure effective1y suppressed the generation of interfacial $SiO_2$ layer between $HfO_2$ film and silicon substrate.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.206.2-206.2
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• 2015

최근 비정질 산화물 반도체 thin film transistor(TFT)는 차세대 투명 디스플레이로 많은 관심을 받고 있으며 활발한 연구가 진행되고 있다. 산화물 반도체 TFT는 기존의 비정질 실리콘 반도체에 비하여 큰 on/off 전류비, 높은 이동도 그리고 낮은 구동전압으로 인하여 차세대 투명 디스플레이 산업에 적용 가능하다는 장점이 있다. 한편 기존의 sputter나 evaporator를 이용한 증착 방식은 우수한 막의 특성에도 불구하고 많은 시간과 제작비용이 든다는 단점을 가지고 있다. 따라서 본 연구에서는 별도의 고진공 시스템이 필요하지 않을 뿐만 아니라 대면적화에도 유리한 용액공정 방식을 이용하여 박막 트렌지스터를 제작하였으며 thermal 열처리와 microwave 열처리 방식에 따른 전기적 특성을 비교 및 분석하고 각 열처리 방식의 열처리 온도 및 조건을 최적화 하였다. 제작된 박막 트렌지스터는 p-type bulk silicon 위에 산화막이 100 nm 형성된 기판에 spin coater을 이용하여 Al-Zn-Sn-O 박막을 형성하였다. 연속해서 photolithography 공정과 BOE (30:1) 습식 식각 과정을 이용해 활성화 영역을 형성하여 소자를 제작하였다. 제작 된 소자는 Pseudo-MOS FET구조이며, 프로브 탐침을 증착 된 채널층 표면에 직접 접촉시켜 소스와 드레인 역할을 대체하여 동작시킬 수 있어 전기적 특성평가가 용이하다는 장점을 가지고 있다. 그 결과, microwave를 통해 열처리한 소자는 100oC 이하의 낮은 열처리 온도에도 불구하고 furnace를 이용하여 열처리한 소자와 비교하여 subthreshold swing(SS), Ion/off ratio, field-effectmobility 등이 개선되는 것을 확인하였다. 따라서, microwave 열처리 공정은 향후 저온 공정을 요구하는 MOSFET 제작 시의 훌륭한 대안으로 사용 될 것으로 기대된다.

• 한국기계가공학회지
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• 제12권5호
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• pp.16-22
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• 2013

A two-dimensional photonic crystal structure was investigated using a roll-to-roll nanoreplication and physical vapor deposition processes for the inexpensive enhanced fluorescence substrate which is not sensitive to the polarization directions of excitation light source. An 8 inch silicon master having nano dot array with a diameter of 200 nm, a height of 100 nm and a pitch of 400 nm was prepared by KrF laser scanning lithography and reactive ion etching processes. A flexible polymer mold was fabricated by flat type UV replication process and a deposition of 10 nm nickel layer as an anti-adhesion layer. A roll mold was prepared by warping the flexible polymer mold on an aluminum roll base and a roll-to-roll UV replication process was carried out using the roll mold. After the deposition of ~ 100 nm $TiO_2$ layer on the replicated nano dot array, a 2 dimensional photonic crystal structure was realized with a resonance wavelength of 635 nm for both p- and s-polarized light sources.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.131-131
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• 2008

Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used a Monte-Carlo method. We studied the effect of channeling by Al implantation simulation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the Al distribution in 4H-SiC through the variation of the implantation energies and the corresponding ratio of the doses. The implantation energies controlled 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2\times10^{14}$ to $1\times10^{15}cm^{-2}$. In the simulation results, the Al ion distribution was deeper as increasing implantation energy and the doping level increased as increasing implantation doses. After the post-implantation annealing, the electrical properties of Al-implanted p-n junction diode were investigated by SILV ACO ATLAS numerical simulator.