• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.29-35
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• 2004

Hafnium-oxide gate dielectric films deposited by a metal organic chemical vapor deposition technique on a $N_2-plasma$ treated SiNx and a hydrogen-terminated Si substrate have been investigated. In the case of $HfO_2$ film deposited on a hydrogen-terminated Si substrate, suppressed crystallization with effective carbon impurity reduction was obtained at $450^{\circ}C$. X-ray photoelectron spectroscopy indicated that the interface layer was Hf-silicate rather than phase separated Hf-silicide and silicon oxide structure. Capacitance-voltage measurements show equivalent oxide thickness of about 2.6nm for a 5.0 nm $HfO_2/Si$ single layer capacitor and of about 2.7 nm for a 5.7 nm $HfO_2/SiNx/Si$ stack capacitor. TEM shows that the interface of the stack capacitor is stable up to $900^{\circ}C$ for 30 sec.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.237-242
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• 1997

The microstructure and soft magnetic properties of as-deposited Fe-Hf-O thin film alloys, which are produced at $P_{O2}=10%$ by rf magnetron sputtering method in $Ar+O_2$ mixed gas atmosphere, is investigated. Newly developed $Fe_{82}Hf_{3.4}O_{14.6}$ film exhibits good soft magnetic properties with $4{\pi}M_s=17.7$ kG, $H_c=0.7$ Oe and ${\mu}_{eff}$(0.5~100MHz)=2,500, respectively. The Fe-Hf-O films are composed of $\alpha$-Fe nanograins and amorphous phase with larger amounts of Hf and O elements which chemically combine each other. With increasing Hf area fraction, Hf and O contents increased proportionally. It was considered that O content in films was determined by Hf contents, because O was chemically combined with Hf. It results from decreasing the $\alpha$-Fe grain size by precipitates (Hf and O), high electrical resistivity. The $Fe_{82}Hf_{3.4}O_{14.6}$ film exhibits the quality factor (Q=$\mu$'/$\mu$") of 25 at 20 MHz. These good frequency characteristics are considered to be superior to other films already reported.o other films already reported.

• Nuclear Engineering and Technology
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• v.55 no.3
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• pp.895-901
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• 2023

Oxide-dispersion- strengthened nickel alloys with Hf additions are expected to present high temperature mechanical properties and durable helium resistance based on first-principles density functional theory (DFT) calculations. Energetic and charge density evaluations of the helium behaviors were performed in Ni matrix, Y₂Hf₂O₇ oxide and the oxide/matrix interface. With the presence of coherent Y₂Hf₂O₇ in Ni matrix, chances of helium bubbles in Ni can be greatly diminished. The helium atoms shall occupy the interfacial site initially, then diffuse into in the octahedral sites of Y₂Hf₂O₇, and these oxide-captured He atoms prefer to separate individually. Much higher diffusion barrier of He in Y₂Hf₂O₇ than in nickel is related to the strong hybridization between interstitial He-1s and nearest-neighboring O-2p orbitals.

• Journal of the Korean Magnetics Society
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• v.7 no.5
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• pp.243-248
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• 1997

The effect of $O_2$ partial pressure on microstructure and soft magnetic properties of as-deposited Fe-Hf-O thin film alloys, which are produced by rf magnetron sputtering method in $Ar+O_2$ mixed gas atmosphere, are investigated. Saturation magnetization ($4{\pi}M_s$) of Fe-Hf-O film were decreased with increasing $O_2$ partial pressure, the best soft magnetic properties exhibit at $O_2$ partial pressure of 10%. With further increase of $O_2$ partial pressure, soft magnetic properties decreased continuously. The $Fe_{82}Hf_{3.4}O_{14.6}$ film with $P_{O2}=10%$ exhibits good soft magnetic properties with $4{\pi}M_s=17.7kG$, $H_c=0.7Oe$ and ${\mu}_ {eff}$ (1~100 MHz)=2,500, respectively. The addition of O is effective in grain refinement. In case of $P_{O2}=15%$, it is observed that $Fe_3O_4$ compound is formed and high frequency soft magnetic properties are decrease. The electrical resistvity($\rho$) of Fe-Hf-O film is increased with increasing $O_2$ partial pressure. Electrical resistivity of $Fe_{82}Hf_{3.4}O_{14.6}$ film was 5 times higher than that of the film without oxygen. Thus, it is considered that the good magnetic properties of $Fe_{82}Hf_{3.4}O_{14.6}$ film results from decreasing the $\alpha$-Fe grain size by precipitates (Hf and O), high electrical resistivity.

• Journal of the Korean Vacuum Society
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• v.18 no.1
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• pp.30-36
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• 2009

The effects of $HfO_2$ film thickness on electrical, optical, and structural properties were investigated. We fabricated ITO/$HfO_2$/ITO metal-insulator- metal (MIM) capacitor using transparent conducting oxide. When $HfO_2$ film thickness increase from 50 nm to 300 nm, dielectric constant of $HfO_2$ was decreased from 20.87 to 9.72. The transparent capacitor shows an overall high performance, such as a dielectric constant about 21 by measuring the ITO/$HfO_2$/ITO capacitor structures and a low leakage current of $2.75{\times}10^{-12}\;A/cm^2$ at +5 V. Transmittance above 80% was observed in visible region.

• Journal of Powder Materials
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• v.18 no.6
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• pp.568-574
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• 2011

As operating temperatures of engines or turbines continually increase for higher efficiency, significant amounts of researches have been focused on finding new materials, which would be alternatives to conventional yttria-stabilized zirconia (YSZ) for thermal barrier coatings (TBCs). In this study, phase evolution and thermo-physical properties of $La_2(Zr_{1-x}Hf_x)_2O_7$ pyrochlore systems are investigated for TBC applications. $La_2(Zr_{1-x}Hf_x)_2O_7$ systems are comprised by selecting $La^{3+}$ as A-site ions and $Zr^{4+}/Hf^{4+}$ as B-site ions in $A_2B_2O_7$ pyrochlore structures. For the developed phases in $La_2(Zr_{1-x}Hf_x)_2O_7$ compositions, thermo-physical properties such as thermal conductivity, thermal expansion coefficient are examined. The potential of these $La_2(Zr_{1-x}Hf_x)_2O_7$ compositions for TBC application is also discussed.

• Electrical & Electronic Materials
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• v.16 no.9
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• pp.63.2-64
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• 2003

Epitaxial yttrium-stabilized HfO$_2$ thin films were deposited on p-type (100) Si substrates by pulsed laser deposition at a relatively lower substrate temperature of 550. Transmission electron microscopy observation revealed a fixed orientation relationship between the epitaxial film and Si; that is, (100)Si.(100)HfO$_2$ and [001]Si/[001]HfO$_2$. The film/Si interface is not atomically flat, suggesting possible interfacial reaction and diffusion, X-ray photoelectron spectrum analysis also revealed the interfacial reaction and diffusion evidenced by Hf silicate and Hf-Si bond formation at the interface. The epitaxial growth of the yttrium stabilized HfO$_2$ thin film on bare Si is via a direct growth mechanism without involoving the reaction between Hf atoms and SiO$_2$ layer. High-frequency capacitance-voltage measurement on an as-grown 40-A yttrium-stabilized HfO$_2$ epitaxial film yielded an dielectric constant of about 14 and equivalent oxide thickness to SiO$_2$ of 12 A. The leakage current density is 7.0${\times}$ 10e-2 A/$\textrm{cm}^2$ at 1V gate bias voltage.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.82.1-82.1
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• 2012

란타늄 산화물 ($La_2O_3$) 박막은 하프늄 산화물 ($HfO_2$) 박막보다 높은 유전 상수와 높은 밴드 오프셋으로 인해 dynamic random access memory(DRAM)에서 유전체 재료로써 연구되어 왔다. 그리고 Lanthanum이 도핑된 HfO2이 더 높은 유전 상수와 낮은 누설 전류 밀도를 갖는 다는 사실이 이전에 보고 된 바 있다. 본 연구에서 우리는 ALD를 이용하여, TiN 하부 전극 위에 $La_2O_3$의 위치를 달리하는 $La_2O_3/HfO_2$의 나노 층상조직 구조(두께 10 nm)를 금속 - 절연체 - 금속 (MIM) 구조로 제작 하였다. ALD는 좋은 comformality와 넓은 지역 균일성을 가지며, 원자수준의 두께를 조절할 수 있다는 장점을 갖고 있다. 또한, 다양한 화학 물질들을 이용한 복합적 계층구조를 만들 수 있는 점과 $HfO_2$ 및 $La_2O_3$ 계층의 수직 위치를 정확하게 조절할 수 있는 점으로 본 연구에 적합한 증착 방법이다. HfO2 속에 $La_2O_3$ 층을 깊이에 따라 삽입함으로써 $HfO_2$ 계층에 La 도핑의 효과와 더불어 TiN 하부 전극 위의 $La_2O_3$과 $HfO_2$의 차이점을 확인 하였다. $HfO_2$은 $250^{\circ}C$에서 TDMAH와 물을 사용하여, $La_2O_3$은 동일한 온도에서 $La(iPrCp)_3$와 물을 사용하여 제작되었다. 화학적 구성 및 binding 구조는 X선 광전자 분광법 (XPS)을 통해 분석하였다. 전기적 특성(유전 상수 및 누설 전류)은 Capacitance-Voltage (CV)와 Current-Voltage (IV) 측정으로 확인하였다. 결과적으로, $La_2O_3$ 또는 $HfO_2$을 한 종류만 사용한 절연층의 전기적 특성보다, $La_2O_3/HfO_2$의 나노 층상조직 구조가 더 나은 특성 (누설 전류 밀도 : $5.5{\times}10^{-7}\;A/cm^2$ @-1MV/cm, EOT : 14.6)을 갖는다는 것을 확인했고, 더불어 $La_2O_3$의 흡습 성질로 인한 화학 구조와 전기적 특성의 일부 차이를 확인하였다. 본 연구에서는 $HfO_2$ 속에 $La_2O_3$층이 TiN 하부 전극 바로 위에 위치할 때, 즉, 공기 중에 노출되지 않은 $La_2O_3/HfO_2$ 구조에서 가장 좋은 특성의 MIM capacitor를 얻을 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.382-382
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• 2010

The etch characteristics of the $HfAlO_3$ thin films and selectivity of $HfAlO_3$ to $SiO_2$ in $Cl_2/BCl_3$/Ar plasma were investigated in this work. The maximum etch rate was 108.7 nm/min and selectivity of $HfAlO_3$ to $SiO_2$ was 1.11 at $Cl_2$(3sccm)/$BCl_3$(4sccm)/Ar(16sccm), RF power of 500 W, DC-bias voltage of - 100 V, process pressure of 1 Pa and substrate temperature of $40^{\circ}C$. As increasing RF power and DC-bias voltage, etch rates of the $HfAlO_3$ thin films increased. Whereas as decreasing of the process pressure, those of the $HfAlO_3$ thin films were increased. The chemical reaction on the surface of the etched the $HfAlO_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.362-365
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• 2002

Hf thin films were deposited on bottom metal using a RF magnetron sputtering method followed by oxidation and annealing in O$_2$ and N$_2$ ambient, respectively. Various top metal electrodes (i.e., Al, Au, and Cu) were deposited by evaporation, and their roles on physical and electrical properties were investigated. Using the XRD, SEM and AFM techniques, we confirmed that the grain size of HfO$_2$ thin films enlarges as a function of oxidation temperature, increasing dielectric constant. However, other electrical properties (e.g., tan) deteriorateas a consequence. The dielectric constant and tan of HfO$_2$ thin films oxidized at 500 $^{\circ}C$ were 17-25 and 3${\times}$10-3 - 2x10-2, respectively, in the frequency range of 1 Hz to 1 MHz. The leakage current density was less than 1${\times}$10-8A/cm2 up to 0.7 MV/cm. In addition, electrical properties of HfO$_2$ thin films (e.g., the dielectric constant, leakage current and tan $\delta$) depend on top metal electrode. We showed that Al top metal electrode results in the best result.