• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2012년도 임시총회 및 하계학술연구발표회
• /
• pp.121-122
• /
• 2012

Iron-excess gallium ferrite, $Ga_{0.6}Fe_{1.4}O_3$ (GFO), is known to have room-temperature ferromagnetic phases and potentially exhibit ferroelectricity as well [1]. But, leaky polarization-electric field (PE) hysteresis curves of the GFO thin film are hurdle to prove its spontaneous polarization, in other words, ferroelecticity. One of the reasons that the GFO films have leaky PE hysteresis loop is carrier hopping between $Fe^{2+}$ and $Fe^{3+}$ sites due to oxygen deficiency. We focus on reducing conducting current by substituting divalent cations at $Fe^{2+}$ sites. GFO thin films were grown epitaxially along b-axis normal to $SrRuO_3/SrTiO_3$ (111) substrates by pulsed laser deposition. Current density of the ion-substituted GFO thin films was reduced by $10^3$ or more. Ferroelectric properties of the ion-substituted GFO thin films were measured using macroscopic and microscopic schemes. In particular, local ferroelectric properties of the GFO thin films were exhibited and their remnant polarization and piezoelectric d33 coefficient were obtained.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1997년도 추계학술대회 논문집
• /
• pp.56-59
• /
• 1997

SAW filters of transversal type were fabricated on some piezoelectric substrates of the LN 128$^{\circ}$ Y-X, LN 64$^{\circ}$Y-X, Quartz ST-cut wafers through the simulation in which the number o: IDT and window function were changed for the required frequency, and the mask making. Their IDT spacing and width were 3 ${\mu}{\textrm}{m}$, chip size was 4.462 $\times$ 2.086 mm$^2$, and they had double electrode transversal type IDTs. In addition to pure Al electrode devices, Ti thin films having the different thicknesses was introduced between the Al electrode and the substrate for improving the power resistance strength. They had 11-12 dB insertion losses similar to those of pure Al electrode SAW filters in case of LN 128$^{\circ}$ Y-X, LN 64$^{\circ}$ Y-X, meaning that Ti thin film was not detrimental to the insertion loss and general frequency properties. The filters had the center frequencies 162MHz for LN 128$^{\circ}$ Y-X, 186MHz for 64$^{\circ}$ Y-X, and 131MHz for Quartz ST-cut substrates.

• 한국재료학회지
• /
• 제8권2호
• /
• pp.131-134
• /
• 1998

$SiO_{2}$ 기판과 dimethylethylamine alane(DMEAA)을 반응소스로 하여 알루미늄을 증착시켜 증착전 전처리 가스 종류와 수소 플라즈마 처리에 따른 증착속도의 차이와 미세구조에 대하여 연구하였다. TiN기판에 증착된 알루미늄의 증착속도는 증착전 수소 가스에 의한 전처리한 경우 아르곤이나 헬륨에 의한 전처리에 비해 빠른 증착속도를 나타내었다. 이르곤 플라즈마 전처리나 플라즈마 전처리 하지 않고 $SiO_{2}$기판에 알루미늄을 증착하였을 경우에 비해 수소 플라즈마 전처리에 의해 알루미튬증착시 잠복기(incubation time)가 감소하였으며 치밀한 미세조직을 얻을 수 있었다.

• 한국재료학회지
• /
• 제22권4호
• /
• pp.202-206
• /
• 2012

$CoSi_2$ was formed through annealing of atomic layer deposition Co thin films. Co ALD was carried out using bis(N,N'-diisopropylacetamidinato) cobalt ($Co(iPr-AMD)_2$) as a precursor and $NH_3$ as a reactant; this reaction produced a highly conformal Co film with low resistivity ($50\;{\mu}{\Omega}cm$). To prevent oxygen contamination, $ex-situ$ sputtered Ti and $in-situ$ ALD Ru were used as capping layers, and the silicide formation prepared by rapid thermal annealing (RTA) was used for comparison. Ru ALD was carried out with (Dimethylcyclopendienyl)(Ethylcyclopentadienyl) Ruthenium ((DMPD)(EtCp)Ru) and $O_2$ as a precursor and reactant, respectively; the resulting material has good conformality of as much as 90% in structure of high aspect ratio. X-ray diffraction showed that $CoSi_2$ was in a poly-crystalline state and formed at over $800^{\circ}C$ of annealing temperature for both cases. To investigate the as-deposited and annealed sample with each capping layer, high resolution scanning transmission electron microscopy (STEM) was employed with electron energy loss spectroscopy (EELS). After annealing, in the case of the Ti capping layer, $CoSi_2$ about 40 nm thick was formed while the $SiO_x$ interlayer, which is the native oxide, became thinner due to oxygen scavenging property of Ti. Although Si diffusion toward the outside occurred in the Ru capping layer case, and the Ru layer was not as good as the sputtered Ti layer, in terms of the lack of scavenging oxygen, the Ru layer prepared by the ALD process, with high conformality, acted as a capping layer, resulting in the prevention of oxidation and the formation of $CoSi_2$.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.47-52
• /
• 2002

A processing method is developed for preparing sol-gel derived $Pb(Zr_{1-x}Ti_x)O_3$ (x=0.5) thin films on Pt-Ir($Pt_{80}Ir_{20}$)-alloy substrates. The as-deposited layer was dried on a plate in air at $70^{\circ}C$. And then it was baked at $1500^{\circ}C$, annealed at $450^{\circ}C$ and finally annealed for crystallization at various temperatures ranging from $580^{\circ}C$ to $700^{\circ}C$ for 1hour in a tube furnace. The thickness of the annealed film with three layers was $0.3{\mu}m$. Crystalline properties and surface morphology were examined using X-ray diffractometer (XRD). Electrical properties of the films such as dielectric constant, C-V, leakage current density were measured under different annealing temperature. The PZT thin film which was crystallized at $600^{\circ}C$ for 60minutes showed the best structural and electrical dielectric constant is 577. C-V measurement show that $700^{\circ}C$ sample has window memory volt of 2.5V and good capacitance for bias volts. Leakage current density of every sample show $10^{-8}A/cm^2$ r below and breakdown voltage(Vb) is that 25volts.

• 한국세라믹학회지
• /
• 제27권1호
• /
• pp.35-42
• /
• 1990

In the present investigation, ceramic PZT and Polymer were prepared. The former is Pb[(Sn1/2Sb1/2)0.1 Ti0.27Zr0.63]O3 including Pb(Sn1/2Sb1/2)O3 with good pyroelectric effect, and the latter PVA(Poly Vinyl Alcohol) with good plasticity. Then, they were fabricated to be flat by using 0-3 connectivity which is rather easily fabricated and capable of making thin film, extending surface area among the connectivities. Such were applied to the sample as variation of intensity of poling field, poling temperature, volume fraction between ceramic and polymer. Then dielectric constant, pyroelectric current, pyroelectric coefficient and the figure of merit were measured. And then their effects on pyroelectric characteristics were observed.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.77.1-77.1
• /
• 2013

Atomic layer deposition (ALD) is known for its self-limiting reaction, which offers atomic-level controllability of the growth of thin films for a wide range of applications. The self-limiting mechanism leads to very useful properties, such as excellent uniformity over a large area and superior conformality on complex structures. These unique features of ALD provide promising opportunities for future electronics. Although the ALD of Al2O3 film (using trimethyl-aluminum and water as a metal precursor and oxygen source, respectively) can be regarded as a representative example of an ideal ALD based on the completely self-limiting reaction, there are many cases deviating from the ideal ALD reaction in recently developed ALD processes. The nonconventional aspects of the ALD reactions may strongly influence the various properties of the functional materials grown by ALD, and the lack of comprehension of these aspects has made ALD difficult to control. In this respect, several dominant factors that complicate ALD reactions, including the types of metal precursors, non-metal precursors (oxygen sources or reducing agents), and substrates, will be discussed in this presentation. Several functional materials for future electronics, such as higher-k dielectrics (TiO2, SrTiO3) for DRAM application, and resistive switching materials (NiO) for RRAM application, will be addressed in this talk. Unwanted supply of oxygen atoms from the substrate or other component oxide to the incoming precursors during the precursor pulse step, and outward diffusion of substrate atoms to the growing film surface even during the steady-state growth influenced the growth, crystal structure, and properties of the various films.

• 한국진공학회지
• /
• 제19권2호
• /
• pp.141-147
• /
• 2010

$Al_2O_3$, $TiO_2$, $HfO_2$와 같은 high-k (고 유전상수) 산화물 박막을 Si, $SiO_2$/Si, GaAs 기판에 각각 입혀서 주기적인 온도변화에 의해 발생되는 박막 표면에서의 반사율 변화를 이용한 열-반사율법을 이용하여 열전도도를 측정하였다. 그 결과, 약 50nm 두께에서 0.80~1.29 W/(mK)와 같은 높은 열전도도를 가지고 있어 CMOS와 메모리 디바이스와 같은 전자 회로에서 발생되는 열을 효과적으로 방산할 수 있고, 또 미세 입자의 크기에 따라 열전달이 변화하는 것을 확인하였다.

• 한국재료학회지
• /
• 제11권2호
• /
• pp.151-154
• /
• 2001

상부전극, Pt, Ir, 그리고 $IrO_2$, 에 따라 수소 열처리전과 후, 그리고 회복열처리시 누설전류특성을 고찰하였다. Pt/PLZT/Pt 케페시터는 수소열처리 후에 다시 회복열처리를 수행하면 완전히 이력곡선의 회복을 보이며 또한 피로특성도 거의 회복 된다. Pt과 IrO$_2$ 상부전극의 경우의 진 누설전류 특성은 열처리조건에 관계없이 강한 시간 의존성을 갖는 space-charge influenced injection모델에 적합하다. 반면에 Ir 상부전극의 경우는 Ir과 PLZT 사이의 계면에 헝성된 전도성 상인 $IrO_2$로 인해 높은 누설전류 밀도를 보이면서 relaxation current 영역이 없이 steady state 영역을 보이는, 주로 Schottky barrier 모델에 의해 설명된다.

• 한국표면공학회지
• /
• 제54권5호
• /
• pp.230-237
• /
• 2021

In this study, the influence of silicon contents on the microstructure, mechanical and tribological properties of Ti-Al-Si-N coatings were systematically investigated for application of cutting tools. The composition of the Ti-Al-Si-N coatings were controlled by different combinations of TiAl₂ and Ti₄Si composite target powers using an arc ion plating technique in a reactive gas mixture of high purity Ar and N₂ during depositions. Ti-Al-Si-N films were nanocomposite consisting of nanosized (Ti,Al,Si)N crystallites embedded in an amorphous Si₃N₄/SiO₂ matrix. The instrumental analyses revealed that the synthesized Ti-Al-Si-N film with Si content of 5.63 at.% was a nanocomposites consisting of nano-sized crystallites (5-7 nm in dia.) and a three dimensional thin layer of amorphous Si₃N₄ phase. The hardness of the Ti-Al-Si-N coatings also exhibited the maximum hardness value of about 47 GPa at a silicon content of ~5.63 at.% due to the microstructural change to a nanocomposite as well as the solid-solution hardening. The coating has a low friction coefficient of 0.55 at room temperature against an Inconel alloy ball. These excellent mechanical and tribological properties of the Ti-Al-Si-N coatings could help to improve the performance of machining and cutting tool applications.