• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.90-90
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode($Pt/Ti.SiO_2/Si$) using RF sputtering method. The dielectric constant of SBN thin films were increased with the increase of annealing temperature. The maximum dielectric constant of SBN thin film is obtained by annealing at 700[$^{\circ}C$]. The dielectric constant and dielectric loss had a stable value within -5~+5[V].

• 센서학회지
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• 제9권1호
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• pp.83-89
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• 2000

TFELD의 절연층으로 사용하기 위해 ITO 유리위에 BST박막을 rf 마그네트론 스퍼터링법으로 증착시켰다. $O_2/(Ar+O_2)$의 혼합비는 10%, 기판온도는 상온에서 $500^{\circ}C$까지 변화를 주었고, 분위기압은 5 mTorr에서 30 mTorr까지 변화시켰다. 다양한 증착조건에서 성장된 BST박막의 전기적, 광학적, 구조적 및 화학량론적인 특성을 조사하였다. BST박막성장의 최적조건은 기판온도 $400^{\circ}C$, 분위기압 30 mTorr에서 구할 수 있었다. 주파수 1 kHz에서 비유전율은 254였고, 누설전류밀도는 5 MV/cm의 전계에서 $3.3{\times}10^{-7}\;A/cm^2$이하로 나타났으며, 가시광영역에서 광투과율은 82%였다.

• Journal of Magnetics
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• 제16권2호
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• pp.186-191
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• 2011

[ $YBa_2C_3O_{7-x}$ ]films were fabricated on a $SrTiO_3$ (100) substrate using a trimethylaceate propionic acid (TMAP)-based MOD process by controlling the precursor solution viscosity, firing temperature, and by using various coatings. The viscosity of the precursor solution was controlled by the addition of Xylenes. The films were heat treated with different temperatures from 750 to $800^{\circ}C$. c-axis oriented films were obtained. After adding 9 ml of Xylene into the precursor solution, the $T_c$ of the YBCO film, which was coated 2 times and heat treated at $800^{\circ}C$, was 86 K and the measured $J_c$ was above 2.5 MA/$cm^2$ at 77 K in a zero-field.

• 한국재료학회지
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• 제7권5호
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• pp.381-385
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• 1997

PEMOCVD에 의해서 SrBi$_{2}$Ta$_{2}$O$_{9}$밥막이 낮은 온도에서 성공적으로 Pt/Ti/SiO$_{2}$Si위에 증착되었다. 5$50^{\circ}C$에서 증착된 200nm박막은 치밀하고 작은 결정립을 보였으며 3V의 인가전압하에서 이력곡선은 포화되기 시작하였다. 3V에서 박막은 잔류분극 (P$_{r}$)과 항전계(E$_{c}$)는 각각 15$\mu$/$\textrm{cm}^2$과 50kV/cm이었다. 6V bipolar square pulse의 피로측정에서 박막은 1.0x$10^{11}$cycles까지 피로 현상을 보이지 않았다. PEMOCVD에 의해서 5$50^{\circ}C$에서 증착된 SBT박막은 비휘발성 기억소자에 충분히 활용할 수 있다.다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.632-635
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• 2003

[ $(Ba,Sr,Ca)TiO_3$ ] powders, prepared by the sol-gel method, were mixed with organic vehicle and the BSCT thick films were fabricated by the screen printing techniques on alumina substrates. The dielectric properties were investigated for various composition ratio and $Nb_2O_5$ doping contents. All the BSCT thick films, sintered at $1420^{\circ}C$, showed the typical XRD patterns of a perovskite polycrystalline structure. The Curie temperature and the relative dielectric constant decreased with increasing Ca content and $Nb_2O_5$ doping amount. The relative dielectric constant, dielectric loss and tunability of the BSCT(50/40/10) thick films doped with 1.0wt% $Nb_2O_5$ were 1410, 0.65% and 17.29% respectively.

• 한국정보통신학회논문지
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• 제9권3호
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• pp.576-581
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• 2005

강유전체$(SrTiO_3)$ 박막을 게이트 절연층으로 하여 수소화 된 비정질 실리콘 박막 트랜지스터를 유리 기판 위에 제조하였다. 강유전체는 기존의 $SiO_2,\;SiN$ 등과 같은 게이트 절연체에 비하여 유전특성이 매우 뛰어나 TFT의 ON 전류를 증가시키고 문턱전압을 낮추며 항복특성을 개선하여 준다. PECVD에 의하여 증착된 a-Si:H는 FTIR 측정 결과 $2,000cm^{-1}$과 $876cm^{-1}$에서 흡수 밴드가 나타났으며, $2,000cm^{-1}$과 $635cm^{-1}$은 $SiH_1$의 stretching과 rocking 모드에 기인한 것이며 $876cm^{-1}$의 weak 밴드는 $SiH_2$ vibration 모드에 의한 것이다. a-SiN:H는 optical bandgap이 2.61 eV이고 굴절률은 $1.8\~2.0$, 저항률은 $10^{11}\~10^{15}\Omega-cm$ 정도로 실험 조건에 따라 약간 다르게 나타난다. 강유전체$(SrTiO_3)$ 박막의 유전상수는 $60\~100$ 정도이고 항복전계는 IMV/cm 이상으로 우수한 절연특성을 갖고 있다. 강유전체를 이용한 TFT의 채널 길이는 $8~20{\mu}m$, 채널 넓이는 $80~200{\mu}m$로서 드레인 전류가 게이트 전압 20V에서 $3.4{\mu}A$이고 $I_{on}/I_{off}$ 비는 $10^5\~10^8,\;V_{th}$는 $4\~5\;volts$이다.

• 한국전기전자재료학회논문지
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• 제22권8호
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• pp.671-676
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode(Pt/Ti/$SiO_2$/Si) using RF sputtering method at various deposition conditions. We investigated the effect of deposition condition on the surface morphology and dielectric properties of SBN thin films. The optimum of the rougness showed about 4.33 nm in 70/30 of Ar/$O_2$ ratio. The crystallinity and rougness of SBN thin films were increased with the increase of rf power. Also, Deposition rate of SBN thin films was about 4.17 nm/min in 70 W of rf power. The capacitance of SBN thin films were increased with the increase of Ar/$O_2$ ratio, rf power and deposition temperature respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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• pp.21-21
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• 2010

(Ba,Sr)$TiO_3$ (BST) thin film with a perovskite structure has potential for the practical application in various functional devices such as nonvolatile-memory components, capacitor, gate insulator of thin-film transistors, and electro-optic devices for display. Normally, the BST thin films derived from sol-gel and sputtering are amorphous or partially crystalline when processed below $600^{\circ}C$. For the purpose of integrating BST thin film directly into a Si-based read-out integrated circuit (ROIC), it is necessary to process the BST film below $400^{\circ}C$. The microstructural and electrical properties of low-temperature crystallized BST film were studied. The BST thin films have been fabricated at $350^{\circ}C$ by UV-assisted rapidly thermal annealing (RTA). The BST films are in a single perovskite phase and have well-defined electrical properties such as high dielectric constant, low dielectric loss, low leakage current density, and high breakdown voltage. Photoexcitation of the organics contained in the sol-gel-derived films by high-intensity UV irradiation facilitates elimination of the organics and formation of the single-crystalline phase films at low temperatures. The amorphous BST thin film was transformed to a highly (h00)-oriented perovskite structure by high oxygen pressure processing (HOPP) at as low as $350^{\circ}C$. The dielectric properties of BST film were comparable to (or even better than) those of the conventionally processed BST films prepared by sputtering or post-annealing at temperature above $600^{\circ}C$. When external pressure was applied to the well-known contractive BST system during annealing, the nucleation energy barrier was reduced; correspondingly, the crystallization temperature decreased. The UV-assisted RTA and HOPP, as compatible with existing MOS technology, let the BST films be integrated into radio-frequency circuit and mixed-signal integrated circuit below the critical temperature of $400^{\circ}C$.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 춘계총회 및 연구발표회 초록집
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• pp.36.2-36
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• 2003

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.116.2-116
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• 2002