• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.660-663
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• 2001

The devices of BST thin films to composite (Ba$\_$0.7/ Sr$\_$0.3/)TiO$_3$using sol-gel method were fabricated by changing of the depositing layer number on Pt/Ti/SiO$_2$/Si substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was 2500[${\AA}$], 3500[${\AA}$], 3800[${\AA}$]. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency 1[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1504-1506
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• 2002

$(Ba_{0.6-x}-Sr_{0.4}Ca_x)TiO_3$ (x=0.10, 0.15, 0.20, y=$0.0{\sim}3.0$) powders were fabricated by the sol-gel method, and BSCT thick films were fabricated by the silk-screen printing method. Their structural and dielectric properties were investigated with variation of composition ratio. All BSCT thick films showed a homogeneous structure without presence of the second phase. BSCT film thickness, obtained by three cycle of printing, was approximately $80{\mu}m$. The dielectric constant and dielectric loss of the 3-coated BSCT(50/40/10) thick film were approximately 1700 and 0.07%, respectively.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.199-202
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• 1999

반강유전 물질인 Pb[(Zr. Sn)Ti]NbO₃를 La/sub 0.5/Sr/sub 0.5/CoO₃/Pt/Ti/SiO₂/Si 기판상에 RF 마그네트론 스퍼터링 방법으로 박막화하여 그 결정성과 전기적 특성을 조사하였다. 80 W의 RF power, 400℃의 기판온도, Ar:O₂= 9:0.5의 분위기에서 증착되고, 650 ℃에서 10초동안 RTP(Rapid Thermal Process) 방법으로 열처리된 박막이 가장 우수한 페로브스카이트 구조를 보였으며, 10 ㎑ 에서 유전상수(ε')는 721, 유전손실(tan δ)은 0.06을 나타내었다. 잔류분극(Pr)은 15.5 μC/㎠ 였으며, 항전계(Ec)는 51 ㎸/㎝로 비교적 낮은 값을 나타내었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1501-1503
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• 1999

The $(Sr_{0.85}Ca_{0.15})TiO_3$(SCT) thin films are deposited on Pt-coated electrode$(Pt/TiO_2/SiO_2/Si)$ using RF sputtering method. Ag, Cu, Al, Pt films for the formation of top eletrode were doposited on SCT thin films by thermal evaporator and sputtering. The effects of top electodes have be studied on SCT samples with a variety of top electrode materials.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.325-329
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• 1998

In this paper, the (Sr$_{1-x}$ Ca$_{x}$)TiO$_3$(SCT) thin films were deposited at various substrate temperature using RF magnetron sputtering method on optimized Pt-coated electrodes (Pt/TiN/SiO$_2$/Si). An influence of substrate temperature and annealing temperature on the structural and dielectric properties are investigated. The substrate temperature changed from 100[$^{\circ}C$] to 500[$^{\circ}C$] and crystalline SCT thin films were deposited abode 400[$^{\circ}C$]. All thin films had (111) preferred orientation, the (100) oriented films were obtained at the substrate temperature above 400[$^{\circ}C$]. The dielectric constant changes almost linearly in the temperature region of -80~+90[$^{\circ}C$], the temperature characteristics of the dielectric loss exhibited a stable value within 0.1, then not affected by substitutional contents. The capacitance characteristics appears a stable value within $\pm$5[%].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.244-247
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• 1999

The(Sr$\sub$0.85/Ca$\sub$0.15/) TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at room temperature is close to stoichiometry(1.102 in A/B ratio). Also, SCT thin films deposited on Pt-coated electrodes have the cubic perovskite structure and polycrystalline state. The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$].The dielectric constant changes almost linearly in temperature ranges of -80~+90[$^{\circ}C$].

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 하계학술발표회
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• pp.106-107
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• 2005

• 한국진공학회지
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• 제16권3호
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• pp.215-220
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• 2007

[ $Pt/SBT/Seed/Pt/Ti/SiO_2/Si$ ]의 구조로 $SBT(SrBi_2Ta_2O_9)$ 박막을 Self-seed layer를 사용하여 R.F. Magnetron sputter를 이용하여 증착을 하였다. Self-seed layer는 기판온도 RT(room temperature)와 $600^{\circ}C$에서 두께 30 nm으로 증착하였다. Self-seed layer의 결정화 온도를 알아보기 위해 열처리온도를 변화시켰고 이를 XRD를 통하여 결정화 유무를 확인하였다. Self-seed layer 위에 증착한 SBT를 XRD와 전기적 측정을 통해 특성을 관찰하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.12-12
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• 2008

Ruthenium is one of the noble metals having good thermal and chemical stability, low resistivity, and relatively high work function(4.71eV). Because of these good physical, chemical, and electrical properties, Ru thin films have been extensively studied for various applications in semiconductor devices such as gate electrode for FET, capacitor electrodes for dynamic random access memories(DRAMs) with high-k dielectrics such as $Ta_2O_5$ and (Ba,Sr)$TiO_3$, and capacitor electrode for ferroelectric random access memories(FRAMs) with Pb(Zr,Ti)$O_3$. Additionally, Ru thin films have been studied for copper(Cu) seed layers for Cu electrochemical plating(ECP) in metallization process because of its good adhesion to and immiscibility with Cu. We investigated Ru thin films by thermal ALD with various deposition parameters such as deposition temperature, oxygen flow rate, and source pulse time. Ru thin films were grown by ALD(Lucida D100, NCD Co.) using RuDi as precursor and $O_2$ gas as a reactant at 200~$350^{\circ}C$.

• 한국세라믹학회지
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• 제40권1호
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• pp.46-51
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• 2003

Liquid delivery MOCVD 공정으로 200nm 정도의 두께를 가진 강유전성 S $r_{0.7}$B $i_{2.1}$T $a_{2.0}$ $O_{9}$ 박막을 Pt/Ti/ $SiO_2$/Si 기판 위에 증착하였다. 본 실험에서는 Sr(TMHD)$_2$.pmdeta, Bi(ph)$_3$ 그리고 Ta( $O^{i}$ Pr)$_4$(TMHD)를 출발 물질로 사용하였으며 n-butyl acetate와 pentamethyldiethylenetriamine를 용매로 사용하였다. 이 실험의 기판 온도와 압력 조건은 각각 57$0^{\circ}C$와 5 Torr였다. 78$0^{\circ}C$에서 열처리한 SBT 박막의 3V와 5V 인가 전압하에서의 잔류분극값은 각각 7.247 $\mu$C/$\textrm{cm}^2$와 8.485 $\mu$C/$\textrm{cm}^2$이었다.다.다.