• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.189-190
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• 2008

The electrical characteristics of band-gap engineered tunneling barriers consisting of thin $SiO_2$ and $Si_3N_4$ dielectric layers were investigated. The band structure of stacked tunneling barriers was studied and the effectiveness of these tunneling barriers was compared with that of the conventional tunneling barrier. The band-gap engineered tunneling barriers show the lower operation voltage, faster speed and longer retention time than the conventional $SiO_2$ tunnel barrier. The thickness of each $SiO_2$ and $Si_3N_4$ layer was optimized to improve the performance of non-volatile memory.

• 한국세라믹학회지
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• 제39권3호
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• pp.217-221
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• 2002

Si and ${\alpha}-Si_3N_4$ powder mixtures added with 3 wt% $Y_2O_3$ were reacted under 5 MPa nitrogen pressure. The reaction products contained ${\alpha}-Si_3N_4$ particles with elongated shapes. Length and width of the elongated grains were the maximum when the starting powder mixture of 50 wt% Si - 47 wt% ${\alpha}-Si_3N_4$ and 3 wt% $Y_2O_3$ was used. Aspect ratio of the elongated grains were between 4.4 and 5. When the starting powder mixture contained 70 wt% Si, large particles with irregular shapes appeared. Meanwhile, the reaction did not proceed when the starting powder mixture contained 30 wt% Si and less. The SHS product was easy to crush and the elongated particles obtained from the starting powder mixtures of 40 wt% Si - 57 wt% ${\alpha}-Si_3N_4$ - 3 wt% $Y_2O_3$ and 50 wt% Si - 47 wt% ${\alpha}-Si_3N_4$ - 3 wt% $Y_2O_3$ were good candidates for the seeds.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.139-139
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• 2010

금속 실리사이드 나노입자는 열적 및 화학적 안정성이 뛰어나고, 절연막내에 일함수 차이에 따라 깊은 양자 우물구조가 형성되어 비휘발성 메모리 소자를 제작할 수 있다. 그러나 단일 $SiO_2$ 절연막을 사용하였을 경우 저장된 전하의 정보 저장능력 및 쓰기/지우기 시간을 향상시키는 데 물리적 두께에 따른 제한이 따른다. 본 연구에서는 터널장벽 엔지니어링을 통하여 물리적인 두께는 단일 $SiO_2$ 보다는 두꺼우나 쓰기/지우기 동작을 위하여 인가되는 전기장에 의하여 상대적으로 전자가 느끼는 상대적인 터널 절연막 두께를 감소시키는 방법으로 동작속도를 향상 시킨 $SiO_2/Si_3N_4/SiO_2$ 및 $Si_3N_4/SiO_2/Si_3N_4$ 터널 절연막을 사용한 금속 실리사이드 나노입자 비휘발성 메모리를 제조하였다. 제조방법은 우선 p-type 실리콘 웨이퍼 위에 100 nm 두께로 증착된 Poly-Si 층을 형성 한 이후 소스와 드레인 영역을 리소그래피 방법으로 형성시켜 트랜지스터의 채널을 형성한 이후 그 상부에 $SiO_2/Si_3N_4/SiO_2$ (2 nm/ 2 nm/ 3 nm) 및 $Si_3N_4/SiO_2/Si_3N_4$ (2 nm/ 3 nm/ 3 nm)를 화학적 증기 증착(chemical vapor deposition)방법으로 형성 시킨 이후, direct current magnetron sputtering 방법을 이용하여 2~5 nm 두께의 $WSi_2$ 및 $TiSi_2$ 박막을 증착하였으며, 나노입자 형성을 위하여 rapid thermal annealing(RTA) system을 이용하여 $800{\sim}1000^{\circ}C$에서 질소($N_2$) 분위기로 1~5분 동안 열처리를 하였다. 이후 radio frequency magnetron sputtering을 이용하여 $SiO_2$ control oxide layer를 30 nm로 증착한 후, RTA system을 이용하여 $900^{\circ}C$에서 30초 동안 $N_2$ 분위기에서 후 열처리를 하였다. 마지막으로 thermal evaporator system을 이용하여 Al 전극을 200 nm 증착한 이후 리소그래피와 식각 공정을 통하여 채널 폭/길이 $2{\sim}5{\mu}m$인 비휘발성 메모리 소자를 제작하였다. 제작된 비휘발성 메모리 소자는 HP 4156A semiconductor parameter analyzer와 Agilent 81101A pulse generator를 이용하여 전기적 특성을 확인 하였으며, 측정 온도를 $25^{\circ}C$, $85^{\circ}C$, $125^{\circ}C$로 변화시켜가며 제작된 비휘발성 메모리 소자의 열적 안정성에 관하여 연구하였다.

• 한국결정성장학회지
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• 제6권4호
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• pp.552-557
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• 1996

소결조제로 2 wt % $Al_2O_3$와 6 wt% $Y_2O_3$를 첨가한 $Si_3N_4/20$ vol % SiC 초미립복합 재료의 고온가압소결 중의 미세구조 발현과정을 sintering interruption법으로 관찰하였다. 밀도는 $1500^{\circ}C$와 $1700^{\circ}C$ 사이에서 빠르게 증가하였으며, $1800^{\circ}C$ 에서 이론밀도에 가깝게 치밀화하였다. 질화규소의 상전이 속도는 $1700^{\circ}C$와 $1800^{\circ}C$에서 증가하였으며, 길게 자란 기지상결정립들이 나타났다. 작은 입경의 SiC는 치밀화속도와 기지상 상전이를 억제하는 효과를 보였다.

• 한국세라믹학회지
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• 제28권1호
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• pp.53-59
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• 1991

The reaction product between Si3N4 and ZrO2 has been studied by heat treatment of Si3N4-Zr(Y)O2 composite in high vacuum(<10-5 torr) and in air at $700^{\circ}C$. ZrN was formed after heat treatment in vacuum and easily oxidized after heat treatment in air. The amount of ZrN is related to the Y2O3 content dissolved in ZrO2. After the heat treatment in air the toughness increased and the spalling due to the oxidation of ZrN in specimen surface was observed. As a result, it is suggested that the formation of ZrN phase in Si3N4-ZrO2 composite enhance the toughness of the composite in an oxidation conditon.

• 한국재료학회지
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• 제6권4호
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• pp.421-427
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• 1996

초미립 SiC 분말을 2차상으로 Si3N4에 첨가하여 SiC/Si3N4 나노 복합체를 핫프레스법과 가스압소결고 제조하였다. 2차상으로 첨가한 SiC의 입자 크기가 $\beta$-Si3N4 나노 복합체를 제조할 수 있었다. 사온에서 80$0^{\circ}C$까지는 강도의 100$0^{\circ}C$이상에서는 강도는 급격한 감소를 보였으며 이는 소결조제로 첨가한 AI2O3, Y2O3와 SiO2가 $\beta$-Si3N4의 입계에 유리상을 형성하였기 때문에 해석된다.

• E2M - 전기 전자와 첨단 소재
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• 제8권1호
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• pp.90-94
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• 1995

Reactive Ion Etching(RIE) of Si$_{3}$N$_{4}$ in a CF$_{4}$/O$_{2}$ gas plasma exhibits such good anisotropic etching properties that it is widely employed in current VLSI technology. However, the RIE process can cause serious damage to the silicon surface under the Si$_{3}$N$_{4}$ layer. When an atmospheric pressure chemical vapor deposited(APCVD) SiO$_{2}$ layer is used as a etch-stop material for Si$_{3}$N$_{4}$, it seems inevitable to get a good etch selectivity of Si$_{3}$N$_{4}$ with respect to SiO$_{2}$. Therefore, we have undertaken thorough study of the dependence of the etch rate of Si$_{3}$N$_{4}$ plasmas on $O_{2}$ dilution, RF power, and chamber pressure. The etch selectivity of Si$_{3}$N$_{4}$ with respect to SiO$_{2}$ has been obtained its value of 2.13 at the RF power of 150 W and the pressure of 110 mTorr in CF$_{4}$ gas plasma diluted with 25% $O_{2}$ by flow rate.

• 한국세라믹학회지
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• 제29권11호
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• pp.837-842
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• 1992

SiC and Si mixtures dispersed by 0.5~10.0 wt% of Al2O3 and reinforced by SiC whisker were sintered to Si3N4 bonded SiC bodies at 140$0^{\circ}C$ in a N2 gas atmosphere, and the nitridation and mechanical properties of sintered bodies were investigated. From these observation, it is concluded that relative density and bending strength increased with the rising of nitridation and the highest nitridation ratio was obtained for a specimen having 1.5 wt% Al2O3. On the other hand, the amount of $\beta$-Si3N4 in the specimens containing Al2O3 more than 5.0 wt% was increased abruptly and the best in fracture toughness was sintered for a composits having 30 wt% SiC whiskers.

• 대한기계학회논문집A
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• 제32권11호
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• pp.957-962
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• 2008

Crack-healing behavior of $Si_3N_4$ composite ceramics has been studied as functions of heat-treatment temperature and amount of additive $SiO_2$ colloidal. Results showed that optimum amount of additive $SiO_2$ colloidal and coating of $SiO_2$ colloidal on crack could significantly increase the bending strength. The heat-treatment temperature has a profound influence on the extent of crack healing and the degree of strength recovery. The optimum heat-treatment temperature depends on the amount of additive $SiO_2$ colloidal. Crack healing strength was far the better cracked specimen with $SiO_2$ colloidal coating on crack surface. After heat treatment at the temperature 1,273 K in air, the crack morphology almost entirely disappeared by scanning prob microscope. At optimum healing temperature 1,273 K, the bending strength with additive $SiO_2$ colloidal 0.0 wt.% without $SiO_2$ colloidal coating recovered to the value of the smooth specimens at room temperature for the investigated crack sizes $100\;{\mu}m$. But that with $SiO_2$ colloidal coating increase up to 140 %. The amount of optimum additive $SiO_2$ colloidal was 1.3 wt.% and crack healed bending strength with $SiO_2$ colloidal coating increase up to 160 % to smooth specimen of additive $SiO_2$ colloidal 0.0 wt.%. Crack closure and rebonding of the crack due to oxidation of cracked surfaces were suggested as a dominant healing mechanism operating in $Si_3N_4$ composite ceramics.

• 전자공학회논문지A
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• 제29A권9호
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• pp.20-28
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• 1992

Dielectric thin film of N/O ($Si_{3]N_{4}/SiO_{2}$) for high density stacked dynamic-RAM cell was formed by LPCVD and oxidation(dry & pyrogenic oxidation methods) of the top 7nm $Si_{3]N_{4}$ film. The thickness, structure and composition of this film were measured by ellipsometer, high resolution TEM, AES and SIMS. The insulating characteristics(I-V characteristics) were investigated by HP 4145, and the characteristics of TDDB (Time Dependent Dielectric Breakdown) were evaluated by using CCST(Current Constant Stress Time) method. In this experiment, The optimum oxidation condition for preparation of good insulating and TDDB characteristics of N/O film was pyrogenic oxidation at 85$0^{\circ}C$ for 30 minutes. The leakage current was reduced from 400pA to 7.5pA when SiO$_{2}$ film with thickness of 2nm was formed on the top of $Si_{3]N_{4}$ film by the pyrogenic oxidation method.