Effects of $N_2O$ /$SiH_4$ Flow Ratio and RF Power on Properties of $SiO_2$ Thick Films Deposited by Plasma Enhanced Chemical Vapor Deposition
(PECVD법에 의해 증착된 $SiO_2$ 후막 특성에서 $N_2O$ /$SiH_4$ Flow Ratio와 RF Power가 미치는 영향)
-
- Journal of the Korean Ceramic Society
- /
- v.38 no.11
- /
- pp.1037-1041
- /
- 2001