• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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• pp.220-223
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• 2001

Pb가 10% 과잉되고 Zr : Ti = 52 : 48 조성을 갖는 PZT sol이 Pt(3500Å)/Ti(400Å)/SiO₂(3000Å)Si(525㎛)기판 위에 스핀 코팅법으로 반복 코팅된 후, 450℃에서 10분, 650℃에서 2분간 반복 열처리되었다. 이와 같이 다양한 두께로 적층된 박막은 각 시편에 대해 최종적으로 650℃ 30분 동안 어닐링 처리되었다. 제조된 PZT 박막의 두께는 4100Å에서 1.75㎛사이의 4종이었다. 이어서 스퍼터링법으로 Pt전극이 PZT 막 위에 증착되었다. 제조된 PZT 박막의 결정 구조 조사를 위해 XRD, 그리고 미세 구조 및 전기적 특성을 알아보기 위해 FESEM과 P-E 이력 곡선이 각각 관찰되었다. 4100Å에서 1.75㎛까지 두께 증가에 따른 장비상의 포화 이력 한계로 잔류 분극(Pr)값이 25μC/㎠에서 다소 감소되었다. 측정된 X선 회절 결과에서 최초 4회 코팅시 perovskite 결정 구조로 성장한 결정립은 (111)배향이 우세하었으나, 두께가 증가됨에 따라 (111)/(110)값이 감소되었으며, 이를 통해 두께 증가에 따른 (111)배향성이 다소 감소됨을 알 수 있었다. 이상의 결과로부터 제조된 PZT 박막은 큰 힘과 높은 내전압 특성을 갖는 마이크로 압전 액츄에이터에 적용될 수 있을 것으로 생각되었다.

• 한국세라믹학회지
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• 제33권10호
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• pp.1101-1108
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• 1996

No-doped PZT thin films have been fabricated on Pt/Ti/SiO2/Si substrate using Sol-Gel technique. A fast annealing metho (three times of intermediate and final annealing) was used for the preparation of multi-coated 1800$\AA$ thick Nb-doped PZT thin films. As Nb doping percent was increased leakage current was lowered approximately 2 order but dielectic properties were degraded due to the appearance of pyrochlore phase and domain pinning. Futhermore the increase of the final annealing temperature up to 74$0^{\circ}C$lowered the pyrochlore phase content resulting in enhancing the dielectric properties of the Nb doped films. The 3%-Nb doped PZT thin films with 5% excess Pb showed a capacitance density of 24.04 fF/${\mu}{\textrm}{m}$2 a dielectric loss of 0.13 a switchable polarization of 15.84 $\mu$C/cm2 and a coercive field of 32.7 kV/cm respectively. The leakage current density of the film was as low as 1.47$\times$10-7 A/cm2 at the applied voltage of 1.5 V.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.174-174
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• 2003

Highly (111)-oriented PZT [Pb(Zrl-xTix)O3] thin films in the Zr-rich rhombohedral phase-field were successfully fabricated on Pt(111)/Ti/SiO2/Si substrates by combining PLD method with sol-gel process. These highly (111)-oriented films can be used as model systems for polarized Raman scattering study of PZT in the rhombohedral-Phase field because the (111)-direction is the principal off-center axis of the rhombohedral ferroelectricity. For this purpose, we have fabricated PZT films employing two distinctive compositions : one with Zr/Ti = 90/10 (abbreviated as PZT90/10) and the other with Zr/Ti= 60/40 (PZT60/40). The PZT90/10 film belongs to the octahedrally distorted FR(LT) phase with a cell-doubled structure, whereas the PZT60/40 is in the high-temperature FR(HT) phase-field at room temperature. To clearly separate E(TO) phonon modes from Al(TO) modes of the (111)-oriented rhombohedral film, we have suitably devised Z(X,Y)Z and Z(X,X)Z backscattering geometries for E(TO) and Al (TO), respectively. The polarized scattering experiment demonstrated that both types of (111)-oriented rhombohedral films closely followed the Raman selection rule.

• Journal of Information Display
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• 제13권4호
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• pp.151-157
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• 2012

A simple method of fabricating out-coupling structures was demonstrated via solution-processing to enhance light extraction from organic light-emitting diodes (OLEDs). Scattering layers were easily obtained by spin-coating an $SiO_2$ sol solution that contained $TiO_2$ particles. By introducing the scattering layer and the solution-processible corrugated structure as internal and external extraction layers, the OLEDs showed increased external quantum efficiency without a change in the electroluminescence spectrum compared to conventional devices. Using these solution-processible out-coupling structures, nearly all-solution-processed OLEDs with enhanced light extraction could be fabricated. The light extraction enhancement is attributed to the suppression by the out-coupling structures of the light-trapping that arose at the interface of the glass substrate and the air.

• Transactions on Electrical and Electronic Materials
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• 제12권5호
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• pp.222-225
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• 2011

Lead zirconate titanate (PZT) films were fabricated on Pt/Ti/$SiO_2$/Si substrate by the sol-gel method using a sol containing poly(N-vinylpyrrolidone) (PVP). PVP in alkoxide solutions can suppress the condensation reaction in gel films during heat treatment, and increase the viscosity of alkoxide solutions. Single-phase PZT films as thick as 1 ${\mu}m$ were deposited by repetitive coating with successive third-step heat treatments at 150$^{\circ}C$, 350$^{\circ}C$ and 650$^{\circ}C$. After heat treatment, the films were crack free, and optically transparent. As a result, we demonstrated a PZT film with a PVP molar ratio of 0.5, which has a permittivity of 734, a dielectric loss of 0.042, a $P_r$ of 40.5 ${\mu}C/cm^2$ and an $E_c$ of 156 kV/cm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.204-205
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• 2007

Self-seed 층을 이용한 PLZT(9/65/35), 강유전체 박막을 Sol-Gel 법을 이용해 Pt/Ti/$SiO_2$/Si 기판 위에 증착한 후, Self-seed 층에 의한 PLZT(9/65/35) 박막의 구조적, 전기적 특성을 고찰하였다. Seed 층을 도입하지 않은 PLZT 박막의 경우 다결정 상으로 형성되는 것을 알 수 있었으며, seed 층을 도입한 PLZT 박막은 (110) 방향으로 우선 배향됨을 알 수 있었다. 증착된 PLZT(9/65/35) 박막의 유전율 및 유전손살은 10kHz에서 유전율 205, 유전손살 0.029 이었으며, Self-seed layer를 도입한 PLZT 박막의 경우 seed layer를 도입하지 않은 PLZT 박막보다 낮은 온도에서 결정화 되는 것을 관찰 할 수 있었다. Self-seed layer가 도입된 PLZT(9/65/35) 박막의 경우 잔류분극 ($P_r$) 값은 $9.1{\mu}C/cm^2$, 항전계($E_c$)는 47 kV/cm을 나타내었다.

• 대한전자공학회논문지SD
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• 제40권9호
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• pp.631-637
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• 2003

Pt/TiO/sub x/SiO₂/Si 기판 위에 1,3-propanediol 을 이용해 sol-gel 법으로 제작한 PZT(30/70) 후막의 구조적 및 전기적, 강유전 특성에 대하여 조사하였다. 열처리 공정은 열 응력 (thermal stress) 를 줄이기 위해 RTA를 사용하였고, 최종적으로 650℃의 로(furnace)에서 어닐링하였다. SEM 분석 결과 1회 코팅에 330nm 의 두께를 얻었으며, 3회 코팅으로 약 1 μm 정도의 두께를 얻었다. C-D 측정결과, 1 kHz에서 비유전률과 유전손실은 각각 886 과 0.03 이었다. C-V 곡선은 좌우 대칭인 나비모양을 나타내었다. 누설전류밀도는 200kV/cm 에서 1.23×10/sup -5/A/cm²이었으며, 이력곡선으로부터 구한 잔류분극 (P/sub r/) 과 항전계(E/sub c/) 는 각각 33.8μC/cm²과 56.9kV/cm 이었다. 결론적으로 본 연구에서 제작된 PZT(30/70) 후막은 우수한 강유전 및 전기적 특성을 보였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.366-367
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• 2006

Different orientated SBN thin films were deposited by Ion Beam Sputtering, and electric properties were measured on each orientation. Ferroelectric $Sr_xBa_{1-x}Nb_2O_6$(SBN) has excellent electro-optic, photo-refractive, piezoelectric, pyroelectric properties. SBN thin film has been deposited by various method, of sol-gel, PLD, CVD, sputtering, etc.. To avoid lead pollution of Pb-system perovskite ferroelectric materials. SBN thin films were fabricated for pyroelectric IR sensor. Using the ceramic target of the same composition and Pt(100)/$TiO_2/SiO-2$/Si(100) substrate, crystallization and orientation behavior as well as electric properties of the films were examined. Seed layer and thin films thickness was controlled to observe the effect on preferred orientation. We measured I-V, C-V, P-E hysteresis to characterize electric-properties on each orientations.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.247-250
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• 1998

Ferroelectric PZT(10/90)PZT(90/10) heterolayered thin films were fabricated by spin-coating method on the Pt/Ti/SiO$^2$/Si substrate alternately using PZT(10/90) and PZT(90/10) metal alkoxide solutions. The coating and heating procedure was repeated six times to form PZT heterolayered films. The surface, cross-sectional microstructures and thickness of the films were observed using scanning electron microscope(SEM). The relative dielectric constant and dielectric loss of the 5-coated PZT heterolayered films were 1331 and 4.8% respectively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.