• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.171-171
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• 2003

공정기술의 향상으로 DRAM(dynamic random acess memory)의 고집적화가 이루어지고 있으며, 각 개별소자 및 셀 영역의 점유면적의 감소가 요구되어지고 있다. 따라서 기존에 사용하던 NO (Si$_3$N$_4$/SiO$_2$)박막보다 유전율이 높은 고유전물질에 대한 연구가 진행되고 있다. Ta$_2$O$_{5}$, $Y_2$O$_3$, HfO$_2$, ZrO$_2$,Nb$_2$O$_{5}$, BaTiO$_3$, SrTiO$_3$ 및 (BaSr)TiO등이 고유전물질로 연구되고 있는데 그 중 공정의 안정성, 누설전류의 우수성으로 인해 Ta$_2$O$_{5}$이 많이 연구되고 있다. 본 실험에서는 TiO$_2$가 8 mol%가 첨가된 Ta$_2$O$_{5}$의 열처리 온도에 따른 전기적, 유전특성을 살펴보려고 한다살펴보려고 한다

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.202-208
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• 2001

In Recent results suggested that doping $Ta_2O_5$ with a small amount of $TiO_2$ using standard ceramic processing techniques can increase the dielectric constant of $Ta_2O_5$ significantly. In this paper, this concept is studied using RTCVD (Rapid Thermal Chemical Vapor Deposition). Ti-doped $Ta_2O_5$ films are deposited using $TaC_{12}H_{30}O_5N$, $C_8H_{24}N_4Ti$, and $O_2$ on both Si and $NH_3$-nitrided Si substrates. An $NH_3$-based interface layer at the Si surface is used to prevent interfacial oxidation during the CVD process and post deposition annealing is performed in $H_2/O_2$ ambient to improve film quality and reduce leakage current. A sputtered TiN layer is used as a diffusion barrier between the Al gate electrode and the $TaTi_xO_y$ dielectric. XPS analyses confirm the formation of a ($Ta_2O_5)_{1-x}(TiO_2)_x$ composite oxide. A high quality $TaTi_xO_y$ gate stack with EOT (Equivalent Oxide Thickness) of $7{\AA}$ and leakage current $Jg=O.5A/textrm{cm}^2$ @ Vg=-1.0V has been achieved. We have also succeeded in forming a $TaTi_x/O_y$ composite oxide by rapid thermal oxidation of the as-deposited CVD TaTi films. The electrical properties and Jg-EOT characteristics of these composite oxides are remarkably similar to that of RTCVD $Ta_2O_5, suggesting that the dielectric constant of $Ta_2O_5$ is not affected by the addition of $TiO_2$.

• Journal of the Korean Society of Radiology
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• v.4 no.4
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• pp.5-10
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• 2010

The $Ca_2SiO_4$ phosphors doped by La with 0.1 wt%, 0.3 wt%, 0.5 wt%, and 1.0 wt% concentration were prepared by sintering at $1000^{\circ}C$ for 90 minutes in N2 atmosphere. The phosphors were ground in powdered form and were grouped in $100{\mu}m$ size, then the samples had been exposed to low energy X-ray and UV light. The TL glow curves were measured by heating the phosphors at $10^{\circ}C/s$ rate. There was no significantly meaningful correlation between the TL intensity and the doping level. The intensities of the TL peak measured from X-ray irradiated samples doped with 0.1 wt% were relatively strong. The activation energy and the frequency factor were 0.434 ~ 0.516 eV and 0.5 ~ 0.56, respectively. The intensities of the TL peak measured from UV irradiated samples doped with 0.3 wt% were relatively strong. The activation energy and frequency factor were 0.415 ~ 0.477 eV and 0.5 ~ 0.53, respectively. The TL process were found to be the 2nd order for both X-ray and UV irradiation. The TL intensity was increased linearly with the increase of the radiation dose. In summary, the $Ca_2SiO_4 phosphors developed in this study showed good TL characteristics at low energy X-ray and UV light. We believe they will be used as TLDs in near future for personal and environmental radiation detection dosimetry.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.371-374
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• 2004

In this paper, Ni Germane-silicide formed on undoped $Si_{0.8}Ge_{0.2}$ as well as source/drain dopants doped $Si_{0.8}Ge_{0.2}$ was characterized by the four-point probe for sheet resistance. x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FESEM). Low resistive NiSiGe is formed by one step RTP (Rapid thermal processing) with temperature range at $500{\~}700^{\circ}C$. To enhance the thermal stability of Ni Germane-silicide, Ni/Co/TiN structure with different Co concentration were studied in this work. Low sheet resistance was obtained by Ni/Co/TiN structure with high Co concentration using 2-step RTP and it almost keeps the same low sheet resistance even after furnace annealing at $650^{\circ}C$ for 30 min.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.114-114
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• 1999

Boron nitride (BN)는 매우 뛰어난 물리적, 화학적 성질을 가지고 있는 재료로 많은 연구가 진행되고 있다. hexagonal 형태의 hBN의 경우 큰 전기 저항과 열 전도도를 가지고 있고 열적 안정성을 가지고 있어 반도체 소자에서 절연층으로 쓰일 수 있다. 또한 X-ray와 가시광선을 투과시키기 때문에 X-ray와 가시광선을 투과시키기 때문에 X-ray lithography이 mask 기판으로 사용될 수 있다. Boron-carbon-nitrogen (BCN) 역시 뛰어난 기계적 성질과 투명성을 가지고 있어 보호 코팅이나 X-ray lithography에 이용될 수 있다. 또한 원자 조성이나 구성을 변화시켜 band gap을 조절할 수 있는 가능성을 가지고 있기 때문에 전기, 광소자의 재료로 이용될 수 있다. 본 연구에서는 여러 합성 조건 변화에 따른 hBN 막의 합성 거동을 관찰하고, 카본 농도변화에 따른 BCN 막의 기계적 성질과 구조의 변화, 그리고 실리콘 첨가에 의한 물성 변화를 관찰하였다. BN박막은 실리콘 (100) 기판 위에 r.f. plasma assisted CVD를 이용하여 합성하였다. 합성 압력 0.015 torr, 원료 가스로 BCl3 1.5 sccm, NH3 6sccm을 Ar 15 sccm을 사용하여 기판 bias (-300~-700V)와 합성온도 (상온~50$0^{\circ}C$)를 변화시켜 BN막을 합성하였다. BCN 박막은 상온에서 기판 bias를 -700V로 고정시킨 후 CH4 공급량과 Ar 가스의 첨가 유무를 변화시켜 합성하였다. 또한 SiH4 가스를 이용하여 실리콘을 함유하는 Si-BCN 막을 합성하였다. 합성된 BN 막의 경우, 기판 bias와 합성 온도가 증가할수록 증착속도는 감소하는 경향을 보여 주었다. 기판 bias와 합성온도에 따른 구조 변화를 SEM과 Xray로 분석하였다. 상온에서 합성한 경우는 표면형상이 비정질 형태를 나타내었고, X-ray peak이 거의 관찰되지 않았다. 합성온도가 증가하게 되면 hBN (100) peak이 나타나게 되고 이것은 합성된 막이 turbostratic BN (tBN) 형태를 가지고 있다는 것을 나타낸다. 50$0^{\circ}C$의 합성 온도에서 기판 bias가 -300V에서 hBN (002) peak이 관찰되었고, -500, -700 V에서는 hBN (100) peak만이 관찰되었다. 따라서 고온에서의 큰 ion bombardment는 합성되는 막의 결정성을 저해하는 요소로 작용한다는 것을 확인 할 수 있었다. 합성된 BN 막은 ball on disk type의 tribometer를 이용하여 마모 거동을 관찰한 결과 대부분 1이상의 매우 큰 friction coefficient를 나타내었고, nano-indenter로 측정한 BN막의 hardness는 매우 soft한 막에서부터 10 GPa 정도 까지의 값을 나타내었고, nano-indenter로 측정한 BN 막의 hardness는 매우 soft한 막에서부터 10GPa 정도 까지의 값을 가지며 변하였다. 합성된 BCN, Si-BCN 막은 FT-IR, Raman, S-ray, TEM 분석을 통하여 그 구조와 합성된 상에 관하여 분석하였다. FT-IR 분석을 통해 B-N 결합과 C-N 결합을 확인할 수 있었고, Raman 분석을 통하여 DLC의 특성을 분석하였다. 마모 거동에서는 BCN 막의 경우 0.6~0.8 정도의 friction coefficient를 나타내었고 Si-BCN 막은 0.3이하의 낮은 friction coefficient를 나타내었다. Hardness는 carbon의 함유량과 Ar 가스의 첨가 유무에 따라 각각을 측정하였고 이것은 BN 막 보다 향상된 값을 나타내었다.

• Korean Journal of Materials Research
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• v.7 no.9
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• pp.763-771
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• 1997

이규화몰리브덴 고온발열체의 제조공정을 개발하였다. 원료분말은 상용 MoSi$_{2}$분말이었으며 Bentonite, Si$_{3}$N$_{4}$, B, ThO$_{2}$를 각각 가소제와 첨가제로 사용하였다. 이들은 진공압출, 소결, 단자부 기계가공, U자형 성형, 용접 등의 과정을 거쳐 U자형 발열체로 제조되었다. 사용제품의 분석결과 최근 사용온도가 크게 증가된 것으로 알려진 190$0^{\circ}C$용 발열체는 다량(33wt%)의 W이 Mo을 치환하고 있는 것으로 나타났다. 발열체의 전기비저항은 겉보기 밀도가 증가함에 따라 급격하게 감소하는 경향을 보였으며 첨가물들의 영향은 미미하였다. 1400-1$600^{\circ}C$에서 용접한 경우 용접면에서의 전기비저항은 비용접부보다 낮았으며 용접온도가 증사함에 따라 감소하였다. 발열시험결과 제조된 발열체는 표면온도가 1$700^{\circ}C$이하에서는 문제가 없었으며 175$0^{\circ}C$ 이상의 온도에서는 원형의 융기가 표면에 발생하면서 급속하게 파괴되었다. 이 융기는 X-선 회절분석결과 SiO로 밝혀졌으며 따라서 발열체의 파괴는 MoSi$_{2}$/SiO$_{2}$계면에서의 Si(in MoSi$_{2}$) + SiO$_{2}$=2SiO(g)반응에 으해 일어나는 것으로 판단된다.

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.131-135
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• 2005

This paper describes the ohmic contact formation of single crystalline 3C-SiC thin films heteroepitaxially grown on Si(001) wafers. In this work, a TiW (Titanium-tungsten) film as a contact matieral was deposited by RF magnetron sputter and annealed with the vacuum and RTA (rapid thermal anneal) process respectively. Contact resistivities between the TiW film and the n-type 3C-SiC substrate were measured by the C-TLM (circular transmission line model) method. The contact phases and interface the TiW/3C-SiC were evaulated with XRD (X-ray diffraction), SEM (scanning electron microscope) and AES (Auger electron spectroscopy) depth-profiles, respectively. The TiW film annealed at $1000^{\circ}C$ for 45 sec with the RTA play am important role in formation of ohmic contact with the 3C-SiC substrate and the contact resistance is less than $4.62{\times}10^{-4}{\Omega}{\cdot}cm^{2}$. Moreover, the inter-diffusion at TiW/3C-SiC interface was not generated during before and after annealing, and kept stable state. Therefore, the ohmic contact formation technology of single crystalline 3C-SiC using the TiW film is very suitable for high temperature MEMS applications.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.11-15
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• 2017

Red phosphors, $Sr_2Si_5N_8:Eu^{2+}$, were synthesized as a single-phase crystal structure by optimizing carbon and $Eu^{2+}$ contents in a carbothermal reduction nitridation method. With increasing $Eu^{2+}$ contents, the photoluminescence spectra were red-shifted from 600 nm peak for 1 mol% for to 700 nm for 7 mol%. It was suggested that this red shift is attributed to the energy transfer from one low-energy sited $Eu^{2+}$ (1) to other high-energy sited $Eu^{2+}$ (2). Finally, the best red sample (620 nm emission peak and 80 nm half width for 3 mole% of $Eu^{2+}$) was packaged on a Blue LED together with two additional green and yellow phosphors, the fabricated White LED showed a high color-rendering index of 90 and white color coordinates of x= 0.321 and y = 0.305.

• Journal of the Korean Vacuum Society
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• v.13 no.1
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• pp.9-13
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• 2004

Perylene is an interesting material known to have P-type and N-type characteristics at the same time. We prepared perylene thin-films in ultrahigh vacuum with two different deposition rates of 0.1 $\AA$/s and 1.0 $\AA$/s in order to study the dependence of film characteristics on the growth condition. The smaller average grain size with larger surface coverage as well as the better crystallinity were observed on the perylene film prepared under 1.0 $\AA$/s deposition rate in x-ray diffraction (XRD) and atomic force microscopy (AFM) study. For studying electrical property of the film, perylene organic thin-film transistor (OTFT) with gold contacts was fabricated on $SiO_2$/Si surface in UHV condition. The prepared perylene OTFT device shows P-type characteristic. The obtained hole mobility in the current-voltage characteristic curve was$2.23\times10^{-5}\textrm{cm}^2$/Vs.

• Journal of Advanced Navigation Technology
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• v.24 no.6
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• pp.500-507
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• 2020

This paper presents a risk assessment methodology for standard flight procedures using recorded automatic dependent surveillance-broadcast (ADS-B) data. Utilizing the proposed methodology, the results of risk analyses in RKSI (incheon international airport) and RKSS (gimpo international airport) using trajectories that are regenerated based on 100 days of ADS-B data are presented. For the risk metric, detect and avoid well clear (DWC) is used. With this index, each procedure was evaluated for the sections with highest level of risk. Among the standard instrument departure (SID) of RKSI, the section between SI712 and RANOS of RNAV BOPTA 1L showed the highest level of risk. For the standard terminal arrival route (STAR) of RKSI, section between SI947 and DANAN of RNAV GUKDO 1N wasthe one with the highest level of risk. For RKSS, the segment between SS726 and SS727 of RNAV BULTI 1X and the segment between KAKSO and KALMA of RNAV OLMEN 1D showed the highest level of risk among the SIDs and STARs, respectivly.