• Title/Summary/Keyword: $InP(2{\times}4)$ 기판

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Electrical Conduction Mechanism of AZO Thin Film and Photo-Electric Conversion Efficiency of Film-Typed Dye Sensitized Solar Cell (AZO 박막의 전기전도특성 및 필름형 염료 태양전지의 광전 변환 특성)

  • Kwak, Dong-Joo
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.4
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    • pp.66-72
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    • 2010
  • In this paper, AZO thin film was deposited on polyethylene terephthalate(PET) substrate by r. f. magnetron sputtering method from a ZnO target mixed with 2[wt%] Al2O3. The flexible film-typed dye sensitized solar cell(F-DSC) was fabricated and photo-electric conversion efficiency was investigated. The results showed that the minimum resistivity and the maximum deposition rate of AZO conducting film were recorded as $1.8{\times}10^{-3}[{\Omega}{\cdot}cm]$ and 25.5[nm/min], respectively at r.f. power of 220[W]. From the analysis of XPS data an improvement of electrical resistivity or an increase in carrier concentration with increasing sputtering power may be related to the generation of lattice imperfections as a result of increasing component ratio of O1s/Zn2p, which generates donor carriers or active growth of crystalline grain. The photo-electric conversion efficiency of F-DSC with AZO conducting electrode was over 2.79[%], which was comparable as that with commercially available ITO electrode.

Cleanliness Test by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 분사형 세정제에 대한 청정도 평가)

  • Heo, Hyo Jung;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.47 no.6
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    • pp.688-694
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    • 2009
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.

Effect of Organic Solvent-Modification on the Electrical Characteristics of the PCBM Thin-Film Transistors on Plastic substrate (플라스틱 기판상에 제작된 PCBM 박막 트랜지스터의 전기적 특성에 대한 유기 용매 최적화의 효과에 대한 연구)

  • Hyung, Gun-Woo;Lee, Ho-Won;Koo, Ja-Ryong;Lee, Seok-Jae;Kim, Young-Kwan
    • Journal of the Korean Applied Science and Technology
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    • v.29 no.2
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    • pp.199-204
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    • 2012
  • Organic thin-film transistors (OTFTs) have received considerable attention because their potential applications for nano-scale thin-film structures have been widely researched for large-scale integration industries, such as semiconductors and displays. However, research in developing n-type materials and devices has been relatively shortage than developing p-type materials. Therefore, we report on the fabrication of top-contact [6,6]-phenyl-C61-butyricacidmethylester (PCBM) TFTs by using three different solvent, o-dichlorobenzene, toluene and chloroform. An appropriate choice of solvent shows that the electrical characteristics of PCBM TFTs can be improved. Moreover, our PCBM TFTs with the cross-linked Poly(4-vinylphenol) dielectric layer exhibits the most pronounced improvements in terms of the field-effect mobility (${\sim}0.034cm^2/Vs$) and the on/off current ratio (${\sim}1.3{\times}10^5$) for our results. From these results, it can be concluded that solvent-modification of an organic semiconductor in PCBM TFTs is useful and can be extended to further investigations on the PCBM TFTs having polymeric gate dielectrics. It is expected that process optimizations using solution-processing of organic semiconductor materials will allow the development of the n-type organic TFTs for low-cost electronics and various electronic applications.

The study of growth and characterization of CuGaSe$_2$ single crystal thin films by hot wall epitaxy (HWE(Hot wall epitaxy)에 의한 CuGaSe$_2$단결정 박막 성장과 특성에 관한 연구)

  • 홍광준;백형원
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.3
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    • pp.189-198
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    • 2000
  • The stochiometric mixture of evaporating materials for the $CuGaSe_2$single crystal thin films were prepared from horizontal furnace. Using extrapolation method of X-ray diffraction patterns for the polycrystal $CuGaSe_2$, it was found tetragonal structure whose lattice constant $a_0}$ and $c_0$ were 5.615 $\AA$ and 11.025 $\AA$, respectively. To obtains the single crystal thin films, $CuGaSe_2$mixed crystal was deposited on throughly etched GaAs(100) by the Hot Wall Epitaxy (HWE) system. The source and substrate temperature were $610^{\circ}C$ and $450^{\circ}C$ respectively, and the growth rate of the single crystal thin films was about 0.5$\mu\textrm{m}$/h. The crystalline structure of single crystal thin films was investigated by the double crystal X-ray diffraction (DCXD). Hall effect on this sample was measured by the method of van der Pauw and studied on carrier density and mobility depending on temperature. From Hall data, the mobility was likely to be decreased by pizoelectric scattering in the temperature range 30 K to 150 K and by polar optical scattering in the temperature range 150 K to 293 K. The optical energy gaps were found to be 1.68 eV for CuGaSe$_2$sing1e crystal thin films at room temperature. The temperature dependence of the photocurrent peak energy is well explained by the Varshni equation then the constants in the Varshni equation are given by $\alpha$ = $9.615{\times}10^{-4}$eV/K, and $\beta$ = 335 K. From the photocurrent spectra by illumination of polarized light of the $CuGaSe_2$single crystal thin films. We have found that values of spin orbit coupling $\Delta$So and crystal field splitting $\Delta$Cr was 0.0900 eV and 0.2498 eV, respectively. From the PL spectra at 20 K, the peaks corresponding to free bound excitons and D-A pair and a broad emission band due to SA is identified. The binding energy of the free excitons are determined to be 0.0626 eV and the dissipation energy of the acceptor-bound exciton and donor-bound exciton to be 0.0352 eV, 0.0932 eV, respectively.

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Study on the formation of Ta-silicides and the behavior of dopants implanted in the poly-Si substrates (Dopant가 주입된 poly-Si 기판에서 Ta-silicides의 형성 및 dopant 의 거동에 관한 연구)

  • Choi, Jin-Seok;Cho, Hyun-Choon;Hwang, Yu-Sang;Ko, Chul-Gi;Paek, Su-Hyon
    • Korean Journal of Materials Research
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    • v.1 no.2
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    • pp.99-104
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    • 1991
  • Trantalum thin films have been prepared by DC sputtering onto As, P, and $BF_2$-implanted ($5{\times}10^15cm^-2$) poly-silicon. The heat treatments by rapid thermal annealing(RTA) have been applied to these samples for the formation of silicides. We have studied the application possibility of Ta-silicide as gate electrode and bit line. The silicide formation and the dopant diffusion after the heat treatment were investigated by various methods, such as four-point probe, X-ray, SEM cross sectional views, ${\alpha}$-step, and SIMS, The tantalum disilicide($TaSi_2$) are formed in the temperature above $800^{\circ}C$, and grown in colummar structure. $TaSi_2$ has a good surface roughness, having range from $80{\AA}\;to\;120{\AA}$, and implanted dopants are incoporated into the $TaSi_2$ layer during the RTA temperature.

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Effect of Post Heat Treatment on the Microstructure and Mechanical Properties of BCuP-5 Filler Metal Coating Layers Fabricated by High Velocity Oxygen Fuel Thermal Spray Process on Ag Substrate (고속 화염 용사 공정으로 제조된 BCuP-5 필러 금속 코팅층/Ag 기판 클래드 소재의 후열처리에 따른 미세조직 및 기계적 특성 변화)

  • Park, So-Yeon;Youn, Seong-June;Park, Jae-Sung;Lee, Kee-Ahn
    • Journal of Powder Materials
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    • v.29 no.4
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    • pp.283-290
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    • 2022
  • A Cu-15Ag-5P filler metal (BCuP-5) is fabricated on a Ag substrate using a high-velocity oxygen fuel (HVOF) thermal spray process, followed by post-heat treatment (300℃ for 1 h and 400℃ for 1 h) of the HVOF coating layers to control its microstructure and mechanical properties. Additionally, the microstructure and mechanical properties are evaluated according to the post-heat treatment conditions. The porosity of the heat-treated coating layers are significantly reduced to less than half those of the as-sprayed coating layer, and the pore shape changes to a spherical shape. The constituent phases of the coating layers are Cu, Ag, and Cu-Ag-Cu3P eutectic, which is identical to the initial powder feedstock. A more uniform microstructure is obtained as the heat-treatment temperature increases. The hardness of the coating layer is 154.6 Hv (as-sprayed), 161.2 Hv (300℃ for 1 h), and 167.0 Hv (400℃ for 1 h), which increases with increasing heat-treatment temperature, and is 2.35 times higher than that of the conventional cast alloy. As a result of the pull-out test, loss or separation of the coating layer rarely occurs in the heat-treated coating layer.

Characteristics of $Pt/SrBi_2Ta_2O_9/ZrO_2/Si$ structures for NDRO ERAM (NDRO FRAM 소자를 위한 $Pt/SrBi_2Ta_2O_9/ZrO_2/Si$ 구조의 특성에 관한 연구)

  • 김은홍;최훈상;최인훈
    • Journal of the Korean Vacuum Society
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    • v.9 no.4
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    • pp.315-320
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    • 2000
  • We have investigated the crystal structure and electrical properties of Pt/SBT/$ZrO_2$/Si (MFIS) and Pt/SBT/Si (MFS) structures for the gate oxide of ferroelectric memory. XRD spectra and SEM showed that the SBT film of SBT/$ZrO_2$/Si structure had larger grain than that of SBT/Si structure. $ZrO_2$ film between SBT film and Si substrate is confirmed as a good candidate for a diffusion barrier by the analysis of AES. The remanent polarization decreased and coercive voltage increased in Pt/SBT/$ZrO_2$/Pt/$SiO_2$/Si structure. This effect may increase memory window of MFIS structure directly related to the coercive voltage. From the capacitance-volt-age characteristics, the memory windows of Pt/SBT (210 nm)/$ZrO_2$ (28 nm)/Si structure were in the range of 1~l.5 V at the applied voltage of 4~6 V. The current densities of Pt/SBT/ZrO$_2$/Si with as -deposited Pt electrode and annealed at $800^{\circ}C$ in $O_2$ambient were $8\times10^{-8} A/\textrm{cm}^2$ and $4\times10^{-8}A/\textrm{cm}^2$ , respectively.

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Dielectric properties of ${Ta_2}{O_5}$ thin film capacitor with $SnO_2$ thin film underlayer ($SnO_2$ 박막을 이용한 ${Ta_2}{O_5}$박막 커패시터의유전특성)

  • Kim, Jin-Seok;Jeong, Gang-Min;Lee, Mun-Hui
    • Korean Journal of Materials Research
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    • v.4 no.7
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    • pp.759-766
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    • 1994
  • Our investigation aimed to reduce the leakage current of $Ta_2O_5$ thin film capacitor by layering SnOz thin film layer under Ta thin film, thereby supplying extra oxygen ions from the $SnO_{2}$ underlayer to enhance the stoichiometry of $Ta_2O_5$ during the oxidation of Ta thin film. Tantalum was evaporated by e-beam or sputtered on p-Si wafers with various deposition temperatures and was oxidized by dry--oxygen at the temperatures between $500^{\circ}C$ and $900^{\circ}C$. Aluminum top and bottom electrodes were formed to make Al/$Ta_2O_5$/p-Si/Al or $Al/Ta_2O_5/SnO_2$p-Si/AI MIS type capacitors. LCR meter and pico-ammeter were used to measure the dielectric constants and leakage currents of the prepared thm film capacitors. XRD, AES and ESCA were employed to confirm the crystallization of the thin f~lm and the compositions of the films. Dielectric constant of $Ta_2O_5$ thin film capacitor with $SnO_{2}$ underlayer was found to be about 200, which is about 10 times higher than that of $Ta_2O_5$ thin film capacitor without $SnO_{2}$ underlayer. In addition, higher oxidation temperatures increased the dielectric constants and reduced the leakage current. Higher deposition temperature generally gave lower leakage current. $Ta_2O_5/SnO_2$ capacitor deposited at $200^{\circ}C$ and oxidized at $800^{\circ}C$ showed significantly lower leakage current, $10^{-7}A/\textrm{cm}^2$ at $4 \times 10^{5}$V/cm, compared to the one without $SnO_{2}$ underlayer. XRD showed that $Ta_2O_5$ thin film was crystallized above $700^{\circ}C$. AES and ESCA showed that initially the $SnO_{2}$, underlayer supplied oxygen ions to oxidize the Ta layer, however, Sn also diffused into the Ta thin film layer to form a new $Ta_xSn_YO_Z$ , ternary oxide layer after all.

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MOCVD를 이용한 자발성장 InAs 양자점의 적층 성장 시 발생하는 파장변화량 제어

  • Choe, Jang-Hui;An, Seong-Su;Yu, Su-Gyeong;Lee, Jong-Min;Park, Jae-Gyu;Lee, Dong-Han;Jo, Byeong-Gu;Han, Won-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.150-151
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    • 2011
  • 양자점 Laser Diode(LD)는 낮은 문턱전류, 높은 미분 이득을 갖으며 또한 온도변화에도 안정적이기 때문에 광통신분야에서 광원으로 양자점 LD를 사용하기 위한 연구가 계속되고 있다. 양자점은 fill factor가 낮기 때문에 양자점의 밀도를 높이거나 양자점을 적층 성장하여 fill factor를 높인다. 그러나 양자점을 적층 성장하면 각 층간의 응력, 수직적 결합, 전기적인 결합이 생기며 이는 양자점의 전기적, 광학적 특성에 영향을 미친다. 본 연구에서는 metal organic chemical vapor deposition (MOCVD)을 이용하여 InP기판 위에 자발성장 법으로 InAs 양자점을 다주기 성장하였으며 photoluminescence (PL)을 이용하여 광학적 특성을 분석하였다. precursor는 trimethylindium (TMI), trimethylgalium (TMGa), $PH_3$, $AsH_3$를 사용하였으며 carrier gas는 $H_2$를 사용하였다. InAs 양자점은 1100 nm의 파장을 갖는 InGaAsP barrier 위에 성장하였고, InAs와 InGaAsP의 성장온도는 $520^{\circ}C$이며 InAs 양자점 성장시 V/III 비는 3.66으로 일정하게 유지하였다. 그림 1은 양자점 성장시간을 0.11분으로 고정하여 3주기(A), 5주기(B), 8주기(C) 성장한 구조이며 그림 2는 양자점 성장시간을 3주기마다 0.01분씩 줄여가며 3주기는 0.11분${\times}$3(D), 6주기는 0.11분${\times}$3+0.10분${\times}$3(E), 9주기는 0.11분${\times}$3+0.10분${\times}$3+0.09분${\times}$3(F) 으로 성장한 성장구조이다. 각 성장한 시료는 PL을 이용하여 파장과 반치폭을 측정하였다. 그림 3은 양자점 성장시간을 고정한 시료 A, B, C의 PL파장과 PL반치폭 데이터이다. PL파장은 A, B, C 시료 각각 1504 nm, 1571 nm, 1702 nm이며 반치폭은 각각 140 meV, 140 meV, 150 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 67 nm, 0 meV 6주기에서 9주기로 증가할 때는 131 nm, 10 meV 증가하였다. 다음 그림4는 양자점 성장시간을 조절하여 성장한 양자점 시료 D, E, F의 PL파장과 PL반치폭 데이터이다. PL파장은 D, E, F 시료 각각 1509 nm, 1556 nm, 1535 nm이며 반치폭은 각각 137 meV, 138 meV, 144 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 47 nm, 1 meV 증가하였고, 6주기에서 9주기로 증가할 때는 21 nm 감소, 6 meV 증가하였다. 양자점 성장시간을 고정하여 다주기를 성장하였고 또 3주기마다 양자점 성장시간을 달리하여 다주기를 성장하였으며 PL을 이용해 광학적 특성을 연구하였다. 성장된 양자점의 PL 파장과 PL 반치폭 변화를 통해 적층구조에서 성장 주기가 늘어날수록 양자점의 크기가 증가하는 것을 확인하였고 또한 적층성장을 할 때 양자점 성장시간을 줄임으로써 양자점의 크기 변화를 제어 할 수 있었다.

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양자점 태양전지구조내 결함상태와 광전변환 특성인자와의 상관관계 분석

  • Lee, Gyeong-Su;Lee, Dong-Uk;Kim, Eun-Gyu;Choe, Won-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.329.2-329.2
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    • 2014
  • 지난 수년간 태양전지의 광전변환효율을 높이기 위해 자가 조립된 InAs 또는 GaSb와 같은 양자점을 GaAs 단일 p-n 접합에 적용하는 연구를 개발해 왔다. 그러나 양자점의 흡수 단면적에 의한 광 흡수도는 양자점층을 수십 층을 쌓으면 증가하지만 활성층에 결함을 생성시킨다. 생성된 결함은 운반자트랩으로 작용하여 태양전지의 광전변환효율을 감소시킨다. 본 실험에서는 양자점이 적용된 태양전지와 적용되지 않은 태양전지의 광전변환 효율을 비교하고, 깊은준위 과도용량 분광법을 이용하여 결함상태를 측정 및 비교함으로써, 활성층 내부에 생성된 결함이 광전변환 효율에 미치는 영향을 분석하였다. 소자구조는 분자선 증착 방법을 이용하여, 먼저 n+-형 GaAs기판위에 n+-형 GaAs를 250 nm 증착한 후, 도핑이 되지 않은 GaAs활성층을 $1{\mu}m$ 두께로 증착하였다. 마지막으로 n+ 와 p+-형 GaAs를 각각 50, 750 nm 증착함으로써 p-i-n구조를형성하였다. 여기서, n+-형 GaAs 과 p+-형 GaAs의 도핑농도는 동일하게 $5{\times}1018cm-3$로 하였다. 또한 양자점을 태양전지 활성층에 20층을 형성하였다. 이때 p-i-n 태양전지 와 양자점 태양전지의 광전변환 효율은 각각 5.54, 4.22 % 를 나타내었다. p-i-n 태양전지의 개방 전압과 단락전류는 847 mV, 8,81 mA이며 양자점 태양전지는 847 mV, 6.62mA로 확인되었다. 태양전지의 전기적 특성을 측정하기 위해 소자구조 위에 Au(300nm)/Pt(30nm)/Ti(30nm)의 전극을 전자빔증착장치로 증착하였으며, 메사에칭으로 직경 $300{\mu}m$의 태양전지 구조를 제작하였다. 정전용량-전압 특성 및 깊은준위 과도용량 분광법을 이용하여 태양전지의 결함분석 및 이에 따른 광전변환 특성인자와의 상관관계를 논의할 것이다.

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