• BMB Reports
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• v.28 no.3
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• pp.249-253
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• 1995

The nonenzymatic glycation of copper, zinc-superoxide dismutase (Cu,Zn-SOD) led to inactivation and fragmentation of the enzyme. The glycated Cu,zn-SOD was isolated by boronate affinity chromatography. The formation of 8-hydroxy-2'-deoxyguanosine (8-OH-dG) in calf thymus DNA and the generation of strand breaks in pBhiescript plasmid DNA by a metal-catalyzed oxidation (MCO) system composed of $Fe^{3+}$, $O_2$, and glutathione (GSH) as an electron donor was enhanced more effectively by the glycated CU,Zn-SOD than by the nonglycated enzyme. The capacity of glycated Cu,Zn-SOD to enhance damage to DNA was inhibited by diethylenetriaminepentaacetic acid (DETAPAC), azide, mannitol, and catalase. These results indicated that incubation of glycated CU,Zn-SOD with GSH-MCO may result in a release of $Cu^{2+}$ from the enzyme. The released $Cu^{2+}$ then likely participated in a Fenton-type reaction to produce hydroxyl radicals, which may cause the enhancement of DNA damage.

• Korean Journal of Materials Research
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• v.13 no.9
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• pp.555-560
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• 2003

Ag-coated Cu particles were prepared by dropping method of coating agent and were evaluated by scanning electron microscope and color difference meter. The shape of Cu particles having obvious crystal plan and edge was changed spherically according to the increase of Ag coating amount. When the Ag coating amount was 50 wt% to Cu particles, the whiteness of Ag-coated Cu particles was almost similar to that of pure Ag particles. Adding $NH_4$OH in reductant solution could increase effectively the whiteness of the Ag-coated particles. The Ag-coated particles having the highest whiteness was obtained when the content of hydrazine in reductant solution was 0.48 M.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.6
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• pp.284-289
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• 2020

Since the dissimilar bonded interface usually consists of intermetallic compounds (IMCs) layer and cracks, their mechanical and electrical properties can be influenced by microstructure at interface between two different metals. In this study, the friction welded Cu-Al busbar, which is widely used to connect a secondary battery and their component, is selected to analyze the influence of interfacial characteristic on their tensile strength and electric conductivity. Then, the electrical characteristics of Cu busbar and Cu-Al busbar were investigated by thermal flow analysis and temperature rise test. In addition, the relationship between the maximum saturation temperature and the electrical conductivity were discussed in terms of interfacial characteristics of the friction welded Cu-Al busbar.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.317-317
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• 2012

본 연구는 전착법으로 형성된 $Cu_2O$ 박막의 광특성 변화를 고찰한 것이다. 0.3M $CuSO_4$과 4M Lactic acid에 4M NaOH로 전해액의 pH를 조절하여 $Cu_2O$ 박막의 결정성 및 극성을 조절하였다. $Cu_2O$ 박막의 결정성 및 극성에 따른 광특성을 고찰한 결과, 무극성인 (111)면에서 광특성이 우수함을 확인하였다. 하지만, 측정시간의 증가에 따라 표면에 Cu 금속이 형성되어 광전류가 감소함을 확인 할 수 있었다.

• Applied Chemistry for Engineering
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• v.7 no.5
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• pp.849-860
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• 1996

Natural zeolites which were known to occur in sedimentary clinoptilolite, were treated by thermal and chemical methods, and their adsorption characteristics of Cu(II) were studied. Analyses by FT-IR, S. E. M, TGA/DSC, and XRD showed that the adsorption capacity of Cu(II) on the zeolite decreased gradually at the temperatures of above $400^{\circ}C$. The zeolites, which treated with NaOH and NaCl, show higher absorbility in acid solution. The adsorption rate of Cu(II) in the presence of surfactants(LAS, POE AE) on the thermally or chemically treated zeolites varied depending on pH, anion or nonion surfactants.

• Solar Energy
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• v.15 no.1
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• pp.73-84
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• 1995

The present paper is on the utilization of a thermal decomposition reaction $Ca(OH)_2=CaO+H_2O$, for thermal energy storage. One of the important problems in this case is how to heat up and decompose the particle of $Ca(OH)_2$ effectively where the thermal conduction is poor. In this study, the effects of Cu-plates which are placed in the $Ca(OH)_2$ packed bed as heat transfer fins are investigated experimentally. The results show that the Cu-plates are very effective for heat transfer and the thermal decomposition in the $Ca(OH)_2$ packed bed. The amount of time to dehydrate took less than a half than that without fins under the conditions of this study.

• Korean Journal of Environmental Agriculture
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• v.10 no.2
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• pp.119-127
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• 1991

In order to reveal the mechanism of heavy metal behavior in soils relating to factors such as soil pH, organic matter, C.E.C. and soil minerals influencing the activities of heavy metals, Cd, Cu and Zn were applied to soil columns filled with 8 different soils with adjusted soil pH to several levels between 3.0 to 11.0 and the amounts of adsorption and desorption of these heavy metals were measured. 1. At the adsorption maxima of three heavy metals(Cd, Cu and Zn) soil pH appeared to be near 6.0 regardless of properties of the 8 soils, and adsorption gradually decreased above and below pH 6.0. This phenomenon was the same in both heavy metal solutions and mixed solutions, and the mixed solution, containing three heavy metals, revealed slightly higher amounts of Cu adsorption and Cd adsorption. 2. It was also found that the adsorption of Cu and Zn by soils was positively correlated with C.E.C. and the organic matter of soils, respectively. However, the pH values showing maxima of heavy metal adsorption were negatively correlated with organic matter content by contrast with the correlation between the maxima and the C.E.C. values in soils. 3. The adsorption of Cu by soils markedly increased more with $Ca(OH)_2$ application than with NaOH application for soil pH adjusment. This was probably because of Ca effects in Cu precipitation in soils, in addition to the effect of the simple soil pH itself on Cu adsorption 4. It was also revealed that adsorbed Cu was hardly desorbed by $N-NH_4OAC$ solution from the Daejeong soil series compared to the Jeonbug and Yechun soil series. This was because the Daejeong soil series consisted of large amounts of expanding type Vermiculite minerals and also was high in C.E.C. and soil organic matter.

• Journal of Powder Materials
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• v.21 no.1
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• pp.34-38
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• 2014

Cu-Ni alloys with unidirectionally aligned pores were prepared by freeze-drying process of CuO-NiO/camphene slurry. Camphene slurries with dispersion stability by the addition of oligomeric polyester were frozen at $-25^{\circ}C$, and pores in the frozen specimens were generated by sublimation of the camphene during drying in air. The green bodies were hydrogen-reduced at $300^{\circ}C$ and sintered at $850^{\circ}C$ for 1 h. X-ray diffraction analysis revealed that CuO-NiO composite powders were completely converted to Cu-Ni alloy without any reaction phases by hydrogen reduction. The sintered samples showed large and aligned parallel pores to the camphene growth direction, and small pores in the internal wall of large pores. The pore size and porosity decreased with increase in CuO-NiO content from 5 to 10 vol%. The change of pore characteristics was explained by the degree of powder rearrangement in slurry and the accumulation behavior of powders in the interdendritic spaces of solidified camphene.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.65-71
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• 2007

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of the electroplating current density and the speed of a rotating disc electrode (RDE). Cu filling characteristics into trench vias were improved with increasing the RDE speed. There was a Nernst relationship between half width of trench vias of Cu filling ratio higher than 95% and the minimum RDE speed, and the half width of trenches with 95% Cu filling ratio was linearly proportional to the reciprocal of root of the minimum RED speed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.4
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.