• 한국대기환경학회지
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• 제20권4호
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• pp.515-521
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• 2004

The catalytic oxidation of volatile organic compounds (methanol. acetaldehyde) has been characterized using the copper phthalocyanine catalyst in a fixed bed flow reactor under atmospheric pressure. The catalytic activity for pretreatment conditions was examined by this reaction system. The catalytic activity was ordered as follows: metal free-PC＜Cu ($\alpha$)-PC＜Cu ($\beta$)-PC The formaldehyde, carbon monoxide as a partial oxidation product of methanol and acetaldehyde over Cu ($\alpha$)-PC catalyst were detected and the conversions of methanol and acetaldehyde were accomplished above 95% over Cu ($\alpha$) -PC, Cu ($\beta$) - PC catalyst at 35$0^{\circ}C$. The pretreated metal free -PC, Cu($\alpha$)-PC, Cu($\beta$)-PC catalysts have been characterised by TGA, EA and XRD analysis. The catalytic activity pretreated with air and $CH_3$OH mixture (P-4) or air only (P-5) was very excellent. XRD and EA results showed that Cu($\alpha$)-PC, Cu($\beta$)-PC were destroyed an(1 new metal oxide such as CuO were formed.

• Asian-Australasian Journal of Animal Sciences
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• 제27권7호
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• pp.965-973
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• 2014

Three studies were conducted to investigate whether a chelated Cu can replace $CuSO_4$ as a growth promoter in pigs. In Exp. 1, a total of 240 piglets (Large White${\times}$Landrace, $7.36{\pm}0.10kg$) were randomly allocated to 1 of 3 treatments with 8 replicates and 10 piglets per pen. Treatments included a NRC control ($CuSO_4$, 6 mg/kg), two Cu supplementations from either $CuSO_4$ or $Cu(HMTBa)_2$ at 170 mg/kg. Pigs fed $Cu(HMTBa)_2$ were 6.0% heavier than pigs fed either the NRC control or 170 mg/kg $CuSO_4$ (p = 0.03) at the end of the experiment. During the 42 days of experimental period, pigs fed $Cu(HMTBa)_2$ gained 9.0% more (p = 0.01), tended to eat more feed (p = 0.09), and had better feed efficiency (p = 0.06) than those fed $CuSO_4$. Compared with the 6 mg/kg $CuSO_4$ NRC control, liver Cu was increased 2.7 times with 170 mg/kg $CuSO_4$ supplementation, and was further increased with $Cu(HMTBa)_2$ (4.5 times, p<0.05). In Exp. 2, a total of 616 crossbred piglets (PIC, $5.01{\pm}0.25kg$) were randomly allocated to 1 of 4 treatments with 7 replicates and 22 piglets per pen. Treatments included a NRC control (from $CuSO_4$), and three pharmaceutical levels of Cu (150 mg/kg) supplemented either from C$CuSO_4$, tri-basic copper chloride ($Cu_2[OH]_3C1$), or $Cu(HMTBa)_2$. Pigs fed $CuSO_4$ or $Cu(HMTBa)_2$ had better feed efficiency (p = 0.01) and tended to gain more (p = 0.08) compared with those fed the NRC control. Pigs fed $Cu_2[OH]_2C1$ were intermediate. Pigs fed $Cu(HMTBa)_2$ had the highest liver Cu, which was significantly higher than those fed ($Cu_2[OH]_3C1$) or the negative control (p = 0.01). In Exp. 3, a total of 1,048 pigs (PIC, $32.36{\pm}0.29kg$) were allotted to 6 treatments with 8 replicates per treatment and 20 to 22 pigs per pen. The treatments included a NRC control with 4 mg/kg Cu from $CuSO_4$, a positive control with 160 mg/kg Cu from $CuSO_4$, and incremental levels of $Cu(HMTBa)_2$ at 20, 40, 80, and 160 mg/kg. During the overall experimental period of 100 days, no benefit from 160 mg/kg $CuSO_4$ was observed. Pigs fed $Cu(HMTBa)_2$ had increased ADG (linear and quadratic, $p{\leq}0.05$) and feed efficiency (linear and quadratic, $p{\leq}0.05$) up to 80 mg/kg and no further improvement was observed at 160 mg/kg for the whole experimental period. Pigs fed 80 mg/kg $Cu(HMTBa)_2$ weighed 1.8 kg more (p = 0.07) and were 2.3 kg heavier in carcass (p<0.01) compared with pigs fed 160 mg/kg $CuSO_4$. In addition, loin depth was increased with increased $Cu(HMTBa)_2$ supplementation with pigs fed 80 mg/kg $Cu(HMTBa)_2$ had the greatest loin depth (p<0.05). In summary, $Cu(HMTBa)_2$ can be used to replace high $CuSO_4$ as a growth promoter in nursery and grower-finisher pigs.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.183-183
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• 2013

본 연구는 전착법으로 형성된 $Cu_2O$ 박막의 광특성 변화를 고찰한 것이다. 0.3M $CuSO_4$과 4M Lactic acid에 4M NaOH로 전해액의 pH를 조절하여 $Cu_2O$ 박막의 결정성 및 극성을 조절하였다. $Cu_2O$ 박막의 결정성 및 극성에 따른 광특성을 고찰한 결과, 극성인 (111)면에서 광특성이 우수함을 확인하였다. 하지만, 측정시간의 증가에 따라 표면에 Cu 금속이 형성되어 광전류가 감소함을 확인 할 수 있었다. rGO는 페르미전위가 $Cu_2O$ 환원 전위보다 위쪽에 위치한다. 따라서 $Cu_2O$ 박막위에 rGO를 형성시켜 Cu 발생반응을 제한하고 광전류를 증가시키고자한다.

• 한국분말재료학회지
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• 제13권1호
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• pp.33-38
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• 2006

The effect of Cu content on microstructure and mechanical properties of nano-sized Cu dispersed $Al_2O_3(Al_2O_3/Cu)$ nanocomposites was investigated. The nanocomposites with Cu content of 2.5 to 10 vol% were prepared by reduction and hot-pressing of $Al_2O_3/CuO$ powder mixtures. The nanocomposites with Cu content of 2.5 and 5vol% exhibited the maximum fracture strength of 820MPa and enhanced toughness compared with monolithic $Al_2O_3$. The strengthening was mainly attributed to the refinement of $Al_2O_3$ matrix grains. The toughening mechanism was discussed by the observed microstructural feature based on crack bridging.

• 분석과학
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• 제10권4호
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• pp.291-299
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• 1997

톱밥의 주성분인 cellulose를 이용하여 cellulose-OH를 cellulose-Cl로 전환시킨 다음 킬레이트 시약인 2,2'-iminodibenzoic acid염을 반응시켜 킬레이트 흡착제인 2,2'-iminodibenzoic acid-cellulose를 합성하였다. 그리고 합성된 흡착제를 이용하여 Pb(II)와 Cu(II)의 흡착성을 연구하였다. 흡착 특성에 대한 실험 결과, pH가 증가할수록 금속 이온의 흡착량이 증가함을 알 수 있었다. 최적 흡착 반응시간은 약 1시간, 흡착능과 회수량은 Cu(II)보다 Pb(II)의 경우가 더 좋음을 알 수 있었다.

• 대한금속재료학회지
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• 제49권3호
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• pp.250-255
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• 2011

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating $60^{\circ}C/min$ (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices.

• 대한화학회지
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• 제62권2호
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• pp.79-86
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• 2018

This study reported the adsorption of Cu(II) ions onto activated carbon prepared from Myristica Fragrans shell (MFS AC) over independent variables of contact time, activating chemical (NaOH) concentration, initial adsorbate concentration, initial pH of adsorbate solution and adsorption temperature. The MFS AC structure, morphology and total surface area were characterized by FTIR, SEM and BET techniques, respectively. The Cu(II) ions adsorption on the MFS AC (activated using 0.5 M NaOH) fitted best to Freundlich adsorption isotherm (FAI), and the FAI constant obtained was 0.845 L/g at $30^{\circ}C$ and pH 4.5. It followed the pseudo first order of adsorption kinetic (PFOAK) model, and the PFOAK based adsorption capacity was 107.65 mg/g. Thermodynamic study confirmed the Cu(II) ions adsorption should be exothermic and non-spontaneous process, physical adsorption should be taken place. The total surface area and pore volume based on BET analysis was $99.85m^2/g$ and 0.086 cc/g, respectively.

• 대한금속재료학회지
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• 제48권6호
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• pp.557-564
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• 2010

Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.

• 대한화학회지
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• 제24권2호
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• pp.129-138
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• 1980

금속 Cd(II), Cu(II) 및 Pb(II)의 Trien-OH 계에서 ion강도 0.1, $25^{\circ}C{\pm}1$일때 혼합착물에 대한 안정도정수를 폴라그래프에 의해 구하였으며, 이들 혼합착물의 pH변화에 따른 분포상태를 컴퓨터로 계산하여 검토하였다. 또한 Cu(II)와 Cd(II)를 분리하기 위해 양ion 교환수지상에서의 조건분배계수이 이론식을 안정도정수를 이용하여 유도하였으며, pH변화에 따른 Cu(II)와 Cd(II)의 분리최적조건은 pH 9.0이상임을 알았다. EDTA를 가리움제로 하여 Cd(II)-Cu(II)-Trien-EDTA계에서 실험조건을 pH 11.0로 하고 Cu(II)를 Cd(II)로부터 분리한 결과는 만족할만 하였으며 이론치와 잘 일치하였다.

• 폴리머
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• 제25권2호
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• pp.302-310
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• 2001

무전해도금법을 이용하여 구리/PET 필름 복합재료를 제조하였으며 에칭방법과 촉매액의 조성 및 acceleration 방법을 달리하여 PET 필름과 무전해도금된 구리 피막간의 접착력을 향상시키고자 하였다. HCl 용액으로 에칭된 PET 필름은 NaOH에 의한 것보다 더욱 세밀하게 에칭되어져 구리와 PET 필름간의 접착력은 향상되었으나 전자파 차폐효과는 유사한 경향을 보였다. 촉매액의 조성변화에 따른 영향을 살펴본 결과 PdCl$_2$:SnCl$_2$의 몰비가 1:4에서 1:16으로 증가할수록 PET 필름 위에 적층된 Pd/Sn 콜로이드 입자들의 크기가 감소하며 고르게 분포되는 경향을 보였다. 따라서 이들의 몰비가 증가할수록 구리도금이 균일하고 조밀하게 이루어져 접착력 및 차폐효과가 증가하였다. 또한 NaOH보다 HCl로 acceleration한 경우 촉매 입자의 크기가 작고 더 균일하게 분포되어 우수한 접착력과 도금물성을 나타내었다.