• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.49-54
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• 2010

The n-type $Bi_2(Te,Se)_3$ powders were fabricated by melting/grinding method and were hot-pressed in order to compare thermoelectric properties of the hot-pressed specimens with those of the $Bi_2(Te,Se)_3$ ingot. Effects of mechanical milling treatment of the $Bi_2(Te,Se)_3$ powders on thermoelectric characteristics of a hot-pressed specimen were also examined. The hot-pressed $Bi_2(Te,Se)_3$ exhibited power factors of $27.3{\sim}32.3{\times}10^{-4}W/m-K^2$ which were superior to $24.2{\times}10^{-4}W/m-K^2$ of the ingot. The $Bi_2(Te,Se)_3$, hot-pressed after mechanical milling treatment of the powders, possessed a non-dimensional figure-of-merit of 1.02 at $100^{\circ}C$ and exhibited extrinsic-intrinsic transition at $130^{\circ}C$.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.349-354
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• 1999

The temperature dependences of the Hall coefficient, carrier mobility, electrical resistivity, Seebeck coefficient, thermal conductivity, and figure-of-merit of the undoped and $CdI_2$-doped 90% $Bi_2Te_3-10% Bi_2Se_3$, single crystals, grown by the Bridgman method, have been characterized at temperatures ranging from 77K to 600K. The saturated carrier concentration and degenerate temperature of the undoped 90% $Bi_2Te_3-10% Bi_2Se_3$ single crystal are $5.85\times10_{18}cm^{-3}$ and 127K, respectively. The scattering parameter of the 90% $Bi_2Te_3-10% Bi_2Se_3$ single crystal is determined to b -0.23, and the electron mobility to hole mobility ratio ($\mu_e/\mu_h)$ is 1.45. The bandgap energy at 0K of the 90% <$Bi_2Te_3-10% Bi_2Se_3$ single crystal is 0.200 eV. Adding $CdI_2$as a donor dopant, a maximum figure-of-merit of $3.2\times10^{-3}/K$$CdI_2$-doped specimen.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06b
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• pp.311-352
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• 1996

Peltier 효과를 이용한 열전소자는 열응담 감도가 좋고 선택적 냉각이 가능하며 무소음, 무진동 및 소형화의 장점으로 각종 전자부품의 국부냉각소자로 응용되고 있다. 또한 최근 냉매의 사용없이 냉각이 가능한 열전재료를 이용한 자동차나 가정용 에어컨 및 냉장고 등의 각종 냉방시스템의 개발도 크게 주목을 받고 있다. 기존의 Bi2Te3계 단결정 열전재료는 성능지수는 우수하나, 기계적 취약성에 기인하여 소자가공시 수율 저하가 가장 큰 문제점으로 지적되고 있다. 이와 같은 문제점을 해결하기 위해 최근 단결정에 비해 기계적 강도가 우수한 다결정 열전재료의 제조공정에 관한 연구가 활발히 이루어지고 있으며, 그 일환으로 기계적 합금화법을 이용한 열전재료의 제조공정이 연구되고 있다. 원료금속이 고 에너지 볼-밀 내에서의 연쇄적인 파괴와 압접에 의해 합금분말로 변화되는 기계적 합금화 공정은 상온공정으로 이를 사용하여 다결정 열전재료를 제조시 기존의 다결정 열전재료의 제조공정인 "용해 및 분쇄법'과 비교하여 제조단가를 낮출 수 있는 장점이 있다. 본 연구에서는 전자냉각소자용 열전재료로서 상온부근에서 성능지수가 가장 우수한 p형 (Bi,Sb)2Te3 및 n형 Bi2(Te,Se)3 합금분말을 기계적 합금화 공정으로 제조하여 분말 특성을 분석하였으며, 가압소결 후 열전특성의 변화거동을 연구하였다. 순도 99.99% 이상인 Bi, Sb, Te, Se granule을 (Bi1-xSbx)2Te3 및 Bi2(Te1-ySey)3 조성에 맞게 칭량하여 불과 분말의 무게비 5:1로 강구와 함께 공구강 vial에 장입 후, Spex mixer/mill을 이용하여 기계적 합금화 하였다. 기계적 합금화 공정으로 제조한 분말에 대한 X-선 회절분석과 시차 열분석으로 합금화 정도를 분석하였다. (Bi1-xSbx)2Te3 및 Bi2(Te1-ySey)3 합금분말을 10-5 torr의 진공중에서 300℃∼550℃의 온도로 30분간 가압소결하였다. 가압소결체의 파단면에서의 미세구조를 주사전자현미경으로 관찰하였으며, 상온에서 가압소결체의 열전특성을 측정하였다. (Bi1-xSbx)2Te3의 기계적 합금화에 요구되는 공정시간은 Sb2Te3 함량에 따라 증가하여 x=0.5 조성에서는 4 시간 45분, x=0.75 조성에서는 5 시간, x=1 조성에서는 6 시간 45분의 vibro 밀링이 요구되었다. n형 Bi2(Te1-ySey)3 합금분말의 제조에 요구되는 밀링시간 역시 Bi2Se3 함량 증가에 따라 증가하였으며 Bi2(Te0.95Se0.05)3 합금분말의 제조에는 2시간, Bi2(Te0.9Se0.1)3 및 Bi2(Te0.85Se0.15)3 합금분말의 형성에는 3시간의 bivro 밀링이 요구되었다. 기계적 합금화로 제조한 p형 (Bi0.2Sb0.8)2Te3 및 n형 Bi2(Te0.9Se0.1)3 가압 소결체는 각기 2.9x10-3/K 및 2.1x10-3/K 의 우수한 성능지수를 나타내었다.

• Korean Journal of Materials Research
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• v.8 no.5
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• pp.408-412
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• 1998

Thermoelectric properties of Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$(0.05$\leq$x$\leq$0.25) prepared by mechanical alloying and hot pressing, were investigated. Contrary to the p-type behavior of single crystals, the hot-pressed Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$ exhibited ntype conduction without addition of donor dopant. When $Bi_2(Te_{0.85}Se_{0.15})_3$powders were annealed in (50% $H_2$ + 50% Ar) atmosphere, the hot-pressed specimen exhibited a positive Seebeck coefficient due to the reduction of the electron concentration by removal of the oxide layer on the powder surface and annealing-out of the excess Te vacancies. Among the Bi$_{2}$(Te$_{1-x}$Se$_{ x}$)$_{3}$fabricated by mechanical alloying and hot pressing, $Bi_2(Te_{0.85}Se_{0.15})_3$ exhibited a maximum figure-of-merit of 1.92 $\times$ $lO^{-3}$/K.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.4
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• pp.135-139
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• 2015

$Bi_2Te_3-Bi_2Se_3$ alloy which is typical n-type thermoelectric material were grown by traveling heater method (THM) technique. We investigate the effect of the composition of $100-x(Bi_2Te_3)-x(Bi_2Se_3)$ and doping of n-type dopants such as $SbI_3$ and $CdCl_2$. Maximum figure of merit of $Bi_2Te_3-Bi_2Se_3$ alloy was observed with $CdCl_2$ 0.1 wt% (Z: $2.73{\times}10^{-3}/K$) and $SbI_3$ 0.05 wt% (Z: $2.29{\times}10^{-3}/K$). Deviation along the length of $Bi_2Te_3-Bi_2Se_3$ ingot grown by THM method is low, which indicates that the ingot is very homogenized. Also we observed the close relationship of between anisotropy ratio and dopant in the $90(Bi_2Te_3)-10(Bi_2Se_3)$ alloys. And we confirmed the fact that anisotropy ratio exerts thermoelectric performance in $Bi_2Te_3$ based n-type thermoelectric material.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1223-1224
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• 2006

The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})$Te functional gradient material (FGM) was fabricated by hot-pressing the mechanically alloyed $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ powders. Also, the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM was processed by hot-pressing the mechanically alloyed $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe powders. With ${\Delta}T$ larger than $300^{\circ}C$, the p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})Te$ FGM exhibited larger thermoelectric output power than those of the $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ alloys. For the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM, the thermoelectric output power superior to those of the $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe was predicted at ${\Delta}T$ larger than $300^{\circ}C$.

• Korean Journal of Materials Research
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• v.7 no.1
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• pp.40-49
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• 1997

$Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ thermoelectric matcrials havc 11et:n fahricxted hy mechanical alloying and hot pressing methods. Microstructure and thermoelectric properties of the hot 11resseii $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ have been investigated Lvith variations of hot pressing temperature and dopmt atltiition Formation of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ alloy powders was completed by mechanical alloying of the as-mixed Ri. Te, arid Sc grmules of ~3.6mm size for 3 hours at ball-to-material weight ratio of 5 : 1. Figure of merit of $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ was markedly incrcwieti hy hot pressing at temperatures above $450^{\circ}C$, and value of $1.9{\times}10^{-3}/K$ was obtained for the specimen hot pressed at $550^{\circ}C$. With addition of 0.015 wt% Ri as acceptor dopant, figure of merit ol $Bi_{2}(Te_{0.9}Se_{0.1})_{3}$ hot pressed $550^{\circ}C$$2.1{\times}10^{-3}/K$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.363-369
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• 1994

Bimuth telluride base thermoelectrics are prepared by AC current applied hot pressing method. It is possible to minimize the defects arising from the vaporization of Te, thanks to the very short processing time compared to the single crystal growing method. The optimum conditions for the AC applied hot pressing of 95 mol% $Bi_2Te_3-5 mol% Bi_2Se_3$ thermoelectrics are sintering at $400^{\circ}C$, for 2 minutes, under 1500 kgf/$\textrm{cm}^2$, with the particle size of $125 to 250 {\mu}m$, range of powder. The resultant Z value (figure of merit) was $2.2{\times}10^{-3}/K$.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.02a
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• pp.67-67
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• 1995