• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.76-82
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• 2003

The robust stack storage node and sufficient cell capacitance for high performance is indispensable for 90 nm DRAM capacitor. For the first time, we successfully demonstrated MIS capacitor process integration for 90 nm DRAM technology. Novel cell layout and integration technology of 90 nm DRAM capacitor is proposed and developed, and it can be extended to the next generation DRAM. Diamond-shaped OCS with 1.8 um stack height is newly developed for large capacitor area with better stability. Furthermore, the novel $Al_2O_3/HfO_2$ dielectric material with equivalent oxide thickness (EOT) of 25 ${\AA}$ is adopted for obtaining sufficient cell capacitance. The reliable cell capacitance and leakage current of MIS capacitor is obtained with ~26 fF/cell and < 1 fA/ceil by $Al_2O_3/HfO_2$ dielectric material, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.193-193
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• 2013

실리콘 박막 태양전지는 광 흡수층에서 형성된 정공과 전자를 효과적으로 분리하기 위해 p형과 n형으로 도핑된 층을 형성하는 p-i-n구조를 갖게 된다. 이러한 도핑 층을 형성하기 위해 B2H6와 PH3와 같은 독성 가스를 사용하기 때문에, 공정 안정성과 환경적인 이슈가 대두된다. 또한 도핑은 추가적으로 실리콘 박막 태양전지의 안정화 효율을 지속적으로 저하시키는 요인이 된다. 이러한 문제점을 개선하기 위하여, 창층으로 MoO3, V2O5, WO3 등과 같이 높은 일함수를 갖는 전이금속 산화물을 사용하고, 광 흡수층으로 i-Si:H을, 후면 전극으로 낮은 일함수를 나타내는 LiF/Al을 사용하였다. 전이금속 산화물과 LiF/Al의 큰 일함수 차이에 의해서 흡수층인 i-Si:H 에서 생성된 캐리어들은 효과적으로 분리되고 수집이 된다. 금속 산화물은 스퍼터링 공정에 의하여 이루어졌으며, 스퍼터링 공정조건에 따라 산화도가 조절되며, 이러한 산화도에 따라 태양전지의 셀 특성이 결정된다. 도핑 층이 없는 새로운 형태의 실리콘 박막 태양전지는 기존 비정질 실리콘 박막 태양전지에 비해 높은 안정화 효율을 나타내며, 이는 도핑 층이 없기 때문에 기존 실리콘 박막 태양전지의 열화현상에 따른 효율저하가 발생하지 않는 장점을 지내고 있다.

• Journal of applied mathematics & informatics
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• v.10 no.1_2
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• pp.27-40
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• 2002

For two integers m, n with m $\leq$ n, an [m,n]-factor F in a graph G is a spanning subgraph of G with m $\leq$ d$\_$F/(v) $\leq$ n for all v ∈ V(F). In 1996, H. Enomoto et al. proved that every 3-connected Planar graph G with d$\_$G/(v) $\geq$ 4 for all v ∈ V(G) contains a [2,3]-factor. In this paper. we extend their result to all 3-connected locally finite infinite planar graphs containing no unbounded faces.

• Journal of the Korean Ceramic Society
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• v.43 no.7 s.290
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• pp.445-450
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• 2006

The preparation of AlN powder by SHS in the system of $Al-AlN-NH_4Cl$ was investigated in this study. In the preparation of AlN powder, the effect of gas pressure and the composition such as Al, AlF, and additive in mixture on the reactivity were investigated. At 60 atm of the initial inert gas pressure in reactor, the optimum composition for the preparation of pure AlN was 35 wt%Al+5 wt% $NH_4Cl+60wt%$AlN. The AlN powder synthesized in this condition was a single phase AlN with a whisker morphology.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.234-235
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• 2006

In this study, the plasma sprayed $Al_2O_3$ and $Y_2O_3$ coatings have been investigated for applications of microelectronic components. The plasma sprayed coatings had a well-defined splatted lamellae microstructure, intersplat pores and a higher amount of microcracks within the splats. The plasma sprayed $Y_2O_3$ coating had a relatively lower hardness of 300-400Hv, compared to 650-800Hv for $Al_2O_3$ coating, and would be readily damaged by mechanical attacks such as erosion, wear and friction. For a reactive ion etching against F-containing plasmas, however, the $Y_2O_3$ coating had a much higher resistance than the $Al_2O_3$ coating because of the reduced erosion rate of by-products.

• Current Research on Agriculture and Life Sciences
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• v.18
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• pp.9-17
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• 2000

In an effort to breed lines resistant to both bacterial wilt and Phytophthora blight, F5 and BC1F4, and F6 and BC1F5 generations of the crosses between the lines previously bred for resistance to Phytophthora blight ((16-2-2-3-2 = Phytophthora-resistant 'Kalmi', 19-1-3-7-1-1, 19-2-4-5-3-2 = Phytophthora-resistant 'Subi', Kim et al., 1996) and sources of resistance to bacterial wilt (KC350 = MC-4 or KC353 = PBC631, Kim et al., 1998) were evaluated for resistance to both bacterial wilt and to Phytophthora blight in 1999 and in 2000, respectively. Plants which were highly resistant to both bacterial wilt and Phytophthora blight were selected for development of the next generations.

• Journal of Powder Materials
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• v.2 no.2
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• pp.165-170
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• 1995

Alloying behavior of nanocrystalline Al-Ti-(Si) composite powders via mechanical alloying (MA) has been investigated, and the effect of Si on the microstructural changes during MA was discussed. The microstructures of both MA powders and extruded compacts were examined. In Al-Ti system, the solid solutionized nanocrystalline powders could be obtained by MA. On the contrary, fine Si particles were embedded as an elemental state in the matrix of Al-Ti-Si system because of the brittleness and the negligible solid solubility of Si in Al. After hot extrusion, $Al3Ti$ phase was finely precipitated in Al-10fSTi alloy, and Si particles were dissolved to form $(Al, Si)_3Ti$ phase in Al-10%Ti-2%Si alloy.

• Korean Journal of Food Science and Technology
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• v.30 no.3
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• pp.697-701
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• 1998

Two major flavonoid compounds having inhibition activity of xanthine oxidase from onion skin were separated, isolated and identified by ODS chromatography, Sephadex LH-20 chromatography, UV/visible absorption spectroscopy and FAB Mass. Spectral analyses indicated that $F_1$ was a flavonol having 3,5,7,3'-OH and 4'-glucoside (quercetin 4'-glucoside), and $F_2$ was a flavonol having 3(5),7,3',4'-OH (quercetin). FAB-Mass of fraction $F_1\;and\;F_2$ in positive-ion-mode produced a spectra containing main ions at m/z 465, corresponding to the $(M＋H)^+$ ion of quercetin 4'-glucoside, and m/z 303, corresponding to the $(M＋H)^+$ ion of quercetin. The inhibition mechanisms of $F_1\;and\;F_2$ were a mixture of the uncompetative and non-competative modes, with respect to xanthine as a substrate.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.457-457
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• 2014

오존발생방법은 다양한 방식으로 구현이 가능하나 대용량 장치를 만들기 위해서는 DBD (Dielectric barrier discharge) 구조의 형태의 가지고 있다. 이러한, DBD는 반도체의 MOS (Metal On Semiconductor)의 반대 구조를 가진 SOM (Semiconductor On Metal)의 형태를 가지고 있으며 대부분이 Oxidation 산화물을 가지고 구현한다. 오존발생기는 반도체 공정, 환경 및 정화 등 다양한 분야에 사용이 되고 있는 상황으로 성능개선을 위한 연구가 필요한 상황이다. 대표적으로 사용되는 물질인 $SiO_2$를 가지고 있는 상황이며 Silicon은 에너지 Bandgap이 1.1 eV로 금속위에 증착되어 통상적으로 사용되는 문턱전압은 0.7 V에 해당이 된다. 현재 점차적으로 연구가 진행되고 있는 $Al_2O_3$는 8.8 eV의 bandgap을 가지고 있으며 유전 상수가 9로 $SiO_2$인 3.9보다 높은 유전률 특징을 가지고 있다. 따라서, 본 연구는 오존 발생장치에 사용되는 방전관을 기존의 $SiO_2$에서 $Al_2O_3$ 방식으로 대체하므로써 실제적인 유전율의 값의 차이와 오존 발생시 오존변화율 증대에 관하여 연구하였다. $SiO_2$ 방전관은 Fe 메탈위에 약 3 mm정도의 두께를 binding시켜 N4L사의 PSM1700 모델 LCR meter를 사용하여 1.3 kHz시 7.2 pF의 유전율 확인 할 수 있으며 동일한 조건의 금속 메탈위에 $Al_2O_3$를 binding 시켜 측정한 결과 1.07 kHz시 10.7 pF의 유전율을 가지게 되어 40% 이상 높은 유전율을 가지게 되는 것을 확인 할 수 있다. 오존발생을 위하여 가변 주파수형 트랜스 드라이버를 통한 공진 주파수를 생성하여 방전 증폭을 위한 Amplifier를 통하여 변환률을 높이는 방식을 적용하여 MIDAC사의 I1801모델 적외선 분광기(FT-IR)를 통한 오존발생량을 측정하여 기존의 $SiO_2$의 방전관은 시간당 54 g의 오존 발생률 가지게 된다. $Al_2O_3$는 시간당 70 g 정도의 오존 발생률 가지므로 기존의 $SiO_2$ 보다 발생률 높은 것을 확인 할 수 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.1148-1151
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• 2002

Dielectric ceramics with nominal composition of $(Ba_{0.93}Sr_{0.07}O)-0.5Sm_2O_3-4.5TiO_2$ was prepared using the conventional mixed oxide process-derived powder. Effect of $SiO_2$, $MnO_2$ and $Al_2O_3$ impurity addition on the microwave properties was examined in some detail. Measured relative permittivity $(\varepsilon_r)$ values were in the range of 53 to 59 and showed little dependence on impurity addition. In contrast, quality factor $(Q{\cdot}f)$ and temperature coefficient of resonant frequency $(\tau_f)$ values were greatly influenced by the type and the amount of impurities. It was found that 0.1~0.2wt% addition of $Al_2O_3$ was most effective for improving the properties, where ${\varepsilon}_r$, $Q{\cdot}f$ and $\tau_f$ values were 57.7, 10000, and +7ppm/$^{\circ}C$, respectively.