Microstructural Characterization and Plasma Etching Resistance of Thermally Sprayed $Al_2O_3$ and $Y_2O_3$ Coatings

In this study, the plasma sprayed $Al_2O_3$ and $Y_2O_3$ coatings have been investigated for applications of microelectronic components. The plasma sprayed coatings had a well-defined splatted lamellae microstructure, intersplat pores and a higher amount of microcracks within the splats. The plasma sprayed $Y_2O_3$ coating had a relatively lower hardness of 300-400Hv, compared to 650-800Hv for $Al_2O_3$ coating, and would be readily damaged by mechanical attacks such as erosion, wear and friction. For a reactive ion etching against F-containing plasmas, however, the $Y_2O_3$ coating had a much higher resistance than the $Al_2O_3$ coating because of the reduced erosion rate of by-products.