• 제목/요약/키워드: $\varepsilon$-Cu

검색결과 110건 처리시간 0.023초

FeN/Co/Cu/Co계 spin-valve형 다층악의 자기저항 특성 (Magnetoresistance characteristics of EeN/Co/Cu/Co system spin-valve type multilayer)

  • 이한춘;송민석;윤성호;김택기
    • 한국자기학회지
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    • 제10권5호
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    • pp.210-219
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    • 2000
  • 질화철(FeN)막을 이용한 FeN/Co/Cu/Co와 FeN/Co/Cu/Co/Cu/Co/FeN 다층막의 자기저항효과를 조사하였다. 질소유량이 0.4 sccm 이상인 조건에서 제작한 FeN막의 결정구조는 $\alpha$-Fe와 $\varepsilon$-Fe$_3$N상의 혼합상이며 침상구조인 $\varepsilon$-Fe$_3$N상에 의해 유도되는 형상자기이방성 때문에 자기저항효과가 관찰된다. 자기저항효과는 FeN막의 질소 유량과 두께에 따라서 달라지며 이는 FeN막의 $\varepsilon$-Fe$_3$N상에 의해 유도되는 형상자기이방성이 자유층과 고착층에 미치는 범위가 질소유량과 두께에 따라 달라지기 때문이다. 자유층인 Co막의 두께가 70 $\AA$인 조건에서 가장 우수한 자기저항비와 자기저항감도를 나타내며 자기저항비는 질소유량이 0.5 sccm이고 두께가 250 $\AA$인 조건에서 제작된 FeN/Co/Cu/Co/Cu/Co/FeN 다층막에서 3.2 %로 최대값을 나타낸다. 이 다층막의 3개의 자성층은 각기 다른 보자력을 갖고 있으므로 자기저항곡선상에 각각의 보자력 차이에 의한 step을 형성하며 MRAM 등으로 응용시 4개의 신호를 동시에 구현할 수 있을 것으로 기대된다.

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등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구 (Growth Kinetics of Intermetallic Compound on Sn-3.5Ag/Cu, Ni Pad Solder Joint with Isothermal Aging)

  • 이인영;이창배;정승부;서창제
    • Journal of Welding and Joining
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    • 제20권1호
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    • pp.97-102
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    • 2002
  • The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

고감도 비은염 화상재료 개발연구 ( II ) - Copper Phthalocyanine/PVK 전자사진감광체의 CGL의 수성 coating mechanism과 세정효과에 관한 연구 - (A Study of the High Sensitive Nonsilver Halide Imaging Material( II ) - Study of the aqueous coating mechanism and washing effect of the CGL in the $\varepsilon$-CuPc/PVK double-layered organic photoconductor -)

  • 이상남
    • 한국인쇄학회지
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    • 제9권1호
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    • pp.27-44
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    • 1991
  • In this research, double-layered photoconductor consist of the carrier generation layer(CGL) of ${\varepsilon}$ type copper phthalocyanine thin film by an aqueous coating method and the carrier transport layer(CGL) of polyvinyl carbazol(PVK) by spin coating. We inverstigated effect of the surfactant solution and cathod electrolysis to the crystal type of ${\varepsilon}$-CuPc in CGL with TEM, SEM and X-ray diffraction spectroscopy and studied the mechanism of an aqueous coating for the preparation of CGL. The effect of the washing of CGL about the electrophotographic characteristics of the ${\varepsilon}$-CUPC/PVK double-layered photoconductors is studied also.

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저탄소강의 열간 연성 거동에 미치는 Cu의 영향 (Effect of Cu on Hot Ductility Behavior of Low Carbon Steel)

  • 손광석;박태은;박병호;김동규
    • 대한금속재료학회지
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    • 제47권4호
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    • pp.217-222
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    • 2009
  • Cu as a tramp element has been reported to encourage transverse cracking upon straightening operation during continuous casting or mini-mill processing. Therefore, the hot workability of steels containing Cu should be investigated. The purpose of the present study was to examine the effect of Cu contents on the hot ductility of low carbon steels by using hot compression test. Hot compression test was carried out using a Gleeble. The specimens were heated to $1300^{\circ}C$ for solution treatment and then held for 300s before cooling at a rate of $1^{\circ}C/s$ to test temperatures in the range of $650{\sim}1150^{\circ}C$ ($50^{\circ}C$ intervals) with strain rate of $5{\times}10^{-3}/s$. In Cu containing steels, the hot ductility was decreased with increasing Cu content at high temperature region which is to be attributed to copper enriched phase formed at scale/steel interface, and low hot ductility with increasing Cu content at low temperature region is attributable to the strengthening of matrix by the formation of ${\varepsilon}-Cu$. The width of ductility trough region was decreased with increasing Cu content.

Bi-Sr-Ca-Cu-O계열 초전도체의 초구조 (SUPERSTRUCTURES OF Bi-Sr-Ca-Cu-O SUPERCONDUTORS)

  • 남궁찬;이상윤
    • 한국재료학회지
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    • 제4권3호
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    • pp.268-279
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    • 1994
  • 단일상을 갖는 $Bi_2S_2CaCu_2O_{8+x}$ (2212)의 x-ray 분말 pattern을 a=5.408, c=30.83 $\AA$의 격자상수 및 역격자 벡터 $q^*=0.211b^*-c^*$을 갖는 pseudo tetragonal subcell을 이용하여 모두 index하였다. 임계온도 110K를 갖는 $Bi_2S_2CaCu_2O_{10+x}$ 상은 incommensurate supercell에 속하는 매우 많은 x-ray분말선들을 가지고 있다. Indixing guide로 전자회절사진(electron diffraction photographs)을 이용 x-ray분말 pattern에 대한 지수결정방법을 얻었다.$Bi_2S_2CaCu_2O_{10+x}$(2223)의 단위세표(unit cell)는 기하학적으로 격자상수 a=5.411, b=5.420, c=37.29(2) A을 갖는 orthorhombic subcell이다. Supercell반사 지수들은 subcell의 파 벡터 $\pm q^*=0.211b^*-0.78c^*$을 갖는 k,1지수로부터 영향을 받은 것이다. b 방향으로의 inconnensurate성분 $\delta$는 두 상에 대해 다 같으나, 2212에서 2223 상으로의 변환에 따라 c 방향으로의 초격자성분(superlattic component)은 connensurate($\varepsilon$=1)로부터 incommensurate($\varepsilon$=0.78)로 변한다.

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$PbWO_{4}-TiO_{2}-CuO-B_{2}O_{3}$ 세라믹의 고주파 유전특성 (Microwave Dielectric Properties of $PbWO_{4}-TiO_{2}-CuO-B_{2}O_{3}$ Ceramics)

  • 이경호;최병훈
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.143-148
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    • 2001
  • PbWO$_4$ can be densified at 85$0^{\circ}C$ and it shows fairy good microwave dielectric properties; dielectric constant($\varepsilon$$_{r}$) of 21.5, quality factor(Q $\times$f$_{0}$) of 37,224 GHz, and temperature coefficient of resonant frequency($\tau$/suf f/) of -31ppm/$^{\circ}C$. Due to its low sintering temperature, PbWO$_4$ can be used as a multilayered chip component at microwave frequency with high electrical performance by using high conductive electrode metals such as Ag and Cu. However, in order to use this material for microwave communication devices, the $\tau$$_{f}$ of PbWO$_4$ must be stabilized to near zero with high Q$\times$f$_{0}$. In present study, PbWO$_4$ was modified by adding TiO$_2$, B$_2$O$_3$, and CuO in order to improve the microwave dielectric properties without increasing the sintering temperature. The addition of TiO$_2$ increased the $\tau$$_{f}$ and $\varepsilon$$_{r}$, due to its high rr(200ppm/$^{\circ}C$) and $\varepsilon$$_{r}$(100). However, the addition of TiO$_2$ reduced the Q$\times$f$_{0}$ value. When the mot ratio of PbWO$_4$ and TiO$_2$ was 0.913:7.087, near zero $\tau$$_{f}$(0.2ppm/$^{\circ}C$) was obtaibed with $\varepsilon$$_{r}$=22.3, and Q$\times$f/$_{0}$=21,443GHz. With this composition, various amount of B$_2$O$_3$ and CuO were added in order to improve the quality factor. The addition, of B$_2$O$_3$ decreased the $\varepsilon$$_{r}$. However, increased Q$\times$f$_{0}$ and $\tau$$_{f}$. When 2.5 wt% of B$_2$O$_3$ was added to the 0.913PbWO$_4$-0.087TiO$_2$ ceramic, $\tau$$_{f}$ =8.2, $\varepsilon$$_{r}$=20.3, Q$\times$f$_{0}$=54784 GHz. When CuO added to the 0.913PbWO$_4$-0.087TiO$_2$ ceramic, $\tau$$_{f}$ was continuously decreased. And $\varepsilon$$_{r}$ . and Q$\times$f$_{0}$ were increased up to 1.0 wt% then decreased. At 0.1 wt% of CuO addition, the 0.913PbWO$_4$-7.087Ti0$_2$ Ceramic Showed $\varepsilon$$_{r}$=23.5, $\tau$$_{f}$=4.4ppm/$^{\circ}C$, and Q$\times$f$_{0}$=32,932 GHz.> 0/=32,932 GHz.X>=32,932 GHz.> 0/=32,932 GHz.

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CuO ${B_2}{O_3}$첨가에 따른 $PbWO_4$-$TiO_2$세라믹스의 마이크로파 유전특성 (Effects of CuO and ${B_2}{O_3}$Additions on Microwave Dielectric Properties of $PbWO_4$-$TiO_2$Ceramic)

  • 최병훈;이경호
    • 한국세라믹학회지
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    • 제38권11호
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    • pp.1046-1054
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    • 2001
  • 적층일체형 RF 수동소자 모듈 구현을 위한 저온소결 유전체로의 사용을 위해 B$_2$O$_3$ 및 CuO의 첨가가 PbWO$_4$-TiO$_2$계 세라믹의 고주파 유전특성에 미치는 영향을 조사하였다. 본 연구자는 PbWO$_4$가 8$50^{\circ}C$에서 소결이 가능하고 우수한 유전특성($\varepsilon$$_{r}$=21.5, Q$\times$f$_{0}$=37200 GHz, $ au$$_{f}$ =-31 ppm/$^{\circ}C$)을 보여 LTCC 재료로의 응용가능성이 있다고 판단하였다. 이에 PbWO$_4$$\tau$$_{f}$ 조절을 위해 TiO$_2$를 첨가하여 8$50^{\circ}C$에서 소결한 결과 TiO$_2$의 함량이 8.7 mol%일 때 $\tau$$_{f}$ 를 +0.2ppm/$^{\circ}C$로 조절할 수 있었고, 이때 $\varepsilon$$_{r}$ 및 Q$\times$f$_{0}$ 값은 각각 22.3과 21400GHz이었다. TiO$_2$첨가량 증가에 따른 Q$\times$F$_{0}$ 값의 감소는 결정립 크기 감소에 의한 것이었다. Q$\times$f$_{0}$ 값의 개선을 위해 다양한 량의 CuO 및 B$_2$O$_3$를 첨가한 결과, 최적의 유전특성을 얻기 위해서는 적정량의 첨가량이 필요함을 알 수 있었다. CuO 첨가의 경우 유전특성 개선을 위한 최적의 첨가량은 0.05 wt%이었고 이 조성을 8$50^{\circ}C$에서 소결한 결과, 얻어진 유전특성은 $\varepsilon$$_{r}$=23.5, Q$\times$f$_{0}$=32900 GHz, $\tau$$_{f}$ =-2.2 ppm/$^{\circ}C$이었다. B$_2$O$_3$첨가의 경우 최적의 첨가량은 1.0~2.5 wt%이었으며 8$50^{\circ}C$에서 소결한 경우 얻어진 유전특성은 $\varepsilon$$_{r}$20.3~22.1, Q$\times$f$_{0}$=48700~54700 GHz, $\tau$$_{f}$ =+2.4~+8.2ppm/$^{\circ}C$이었다.

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치과용 아말감합금 및 아말감의 마세구조에 관한 연구 (A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS)

  • 연상흠;이정식;이명종;엄정문
    • Restorative Dentistry and Endodontics
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    • 제21권1호
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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Cu첨가형 열연강판의 최적 Cu 및 Mn 첨가량 규명 (Determination of Optimum Cu and Mn Contents in Cu-bearing Hot Rolled Steel Sheets)

  • 윤일성;윤인택;조열래;김인배
    • 한국재료학회지
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    • 제8권3호
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    • pp.274-279
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    • 1998
  • 0.05wt%C-Cu첨가열연강판에서 590MPa급을 가지며 10% pre-strain을 가한 후 780MPa급 이상을 가지는 Cu첨가형 열연강판의 최적 Cu 및 Mn첨가량 규명을 위해 경도 및 인장시험과 투과 전자현미경으로 조사하였다. Cu 첨가형 열연강판에서 고용강화와 시효경화를 고려한 적정 Cu 첨가량은 1.2wt% 전후였으며, Mn첨가량은 0.75-0.85wt%범위였다. 0.05%C-1.2%Cu-0.75%Mn-0.04%Nb첨가 강판에서 과시효조건에서 관찰되는 조대한 석출물은 면심입방정 구조인 $\varepsilon$-Cu인 것으로 확인되었으며, 열연상태에서는 590MPa급을 가지며, 10% pre-strain을 부여한 후 $550^{\circ}C$에서 30분 열처리할 경우 780MPa급의 인장강도를 가지는 Cu첨가형 열연강판의 제조가 가능하였다.

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Sn-Ag-Cu 무연합금의 미세구조 분석 (Microstructure of Sn-Ag-Cu Pb-free solder)

  • 이정일;이호준;윤요한;이주연;조현수;조현;류정호
    • 한국결정성장학회지
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    • 제27권2호
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    • pp.94-98
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    • 2017
  • 최근 수년 동안 Sn-3.0Ag-0.5Cu(weight%) 조성의 합금은 주요 전자 제조업체들의 대표 무연솔더 조성으로 다양한 전자제품의 제작에 적용되어 왔다. 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu 조성의 무연솔더를 주석, 은 및 구리 금속분말의 용융을 이용하여 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu 샘플에 대한 결정구조 및 미세구조를 XRD, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 검토하였다. 분석결과, 제조된 Sn-3.0Ag-0.5Cu 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었다.