Journal of Power Electronics

The Korean Institute of Power Electronics (전력전자학회)
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Analysis of perforated pin design use in automotive SiC power module heatsink

  • Sunghyun Pyun (Department of Automotive Engineering, Hanyang University) ;
  • Seongmoo Cho (Department of Automotive Engineering, Hanyang University) ;
  • Sang Won Yoon (Department of Electrical and Computer Engineering, Seoul National University)
  • Received : 2023.09.03
  • Accepted : 2023.09.23
  • Published : 2023.12.20
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Abstract

This paper proposes the use of a perforated pin for a SiC power module heatsink in automotive applications. Both simulations and experiments demonstrate how the proposed new pin design can enhance cooling performance. We extensively investigate the shapes and locations of pin-fin structures, commonly used for power module cooling. However, due to limitations in geometrical optimization for improving cooling performance, we introduce a novel concept: the perforated pin. Ansys Fluent is utilized to conduct a preliminary analysis of the new pin design prior to prototyping and testing with a specially designed apparatus. Our proposed design is compared with three conventional alternatives: a standard cuboidal pin-fin (reference), a cuboidal pin-fin after geometric optimization, and cylindrical pin-fin cooling structures. The results reveal that the proposed design reduces the maximum device temperature while slightly increasing pressure loss. Notably, the pressure loss increment of our design is only 36.6% compared to the geometrically optimized cuboidal pin-fin, which exhibits a 151% increase in pressure loss alongside improved cooling performance.

Keywords

Acknowledgement

This work was supported by the National Research Foundation of Korea(NRF) grant funded by the Korea government(MSIT) (No. 2023R1A2C2006661 and No. RS-2023-00207865).

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