Wafer Packing Box 안정화 설계

Design Alterations of a Packing Box for the Semiconductor Wafer to Improve Stability

  • 윤재훈 (금오공과대학교 기계공학과) ;
  • 허장욱 (금오공과대학교 기계공학과) ;
  • 이일환 ((주)램시스템)
  • Yoon, Jae-Hoon (Department of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Hur, Jang-Wook (Department of Mechanical Engineering, Kumoh National Institute of Technology) ;
  • Yi, Il-Hwan (Ramsystem CO., LTD)
  • 투고 : 2022.02.21
  • 심사 : 2022.03.25
  • 발행 : 2022.03.31

초록

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

키워드

참고문헌

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