• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.62-66
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• 2022

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.51-56
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• 2022

Recently, the demand for semiconductors is expanded to various industries, and the use of high-quality and high-performance chips is increasing. With the trend, the diameter magnification and high integration of the semiconductor wafers are mandatory. As a result, there is a growing demand for the productivity improvement and the surface precision. There have been many studies on the stabilization of the wafer manufacturing processes in order to satisfy those specifications. Many complaints have been appealed by the wafer buyers that there are many unacceptable wafers with surface defects and foreign material adhesion which are caused by the vibrations during transportation. This study intends to derive the material improvement of the packing box of the wafers to suppress the vibrations of the box, and eventually to reduce the surface defects and the foreign material adhesion. The result shows that optimal material can substantially decrease the vibration of the packing box.