Journal of IKEEE (전기전자학회논문지)

Institute of Korean Electrical and Electronics Engineers (한국전기전자학회)
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Design Aspects and Parasitic Effects on Complementary FETs (CFETs) for 3nm Standard Cells and Beyond

3 나노미터와 미래공정을 위한 상호보완 FET 표준셀의 설계와 기생성분에 관한 연구

  • Song, Taigon (School of Electronics Engineering, Kyungpook National University)
  • Received : 2020.08.28
  • Accepted : 2020.09.28
  • Published : 2020.09.30
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Abstract

Developing standard cells for 3nm and beyond requires significant advances in the device and interconnect technology. Thus, it is very important to quantify the impact of the new technology in various aspects. In this paper, we perform a through analysis on the impact of Buried Power Rail (BPR) and Complementary FET (CFET) in the perspective of cell area and parasitics such as capacitance. We emphasize that CFET is a technology that realizes 4T and beyond for standard cell designs, but significant capacitance increases (+18.0%), compared to its counterpart technology (FinFET) cell, due to the increase of cell height in the Z-direction.

3 나노미터 아래의 미래공정에서는 작은 면적의 표준셀(Standard Cell)을 구현하는 데에 많은 기술적인 개선을 요구한다. 따라서 어떠한 기술을 통해 얼마나 작은 면적의 표준셀을 구현할 수 있는지, 그리고 그 영향이 어떠한지 알아보는 것은 매우 중요하다. 본 논문에서는 3 나노미터와 이하의 미래공정에서 표준셀 설계를 위해 묻힌 전력망(Buried Power Rail, BPR)과 상호보완 FET(Complementary FET, CFET)이 면적 감소에 얼마나 기여하는지 살펴보며 그 영향을 기생 캐패시턴스 관점에서 분석한다. 본 논문을 통해 상호보완 FET은 4T 이하의 표준셀을 구현할 수 있는 기술이지만, Z-축으로 증가하는 높이만큼 상당한(+18.0% 이상) 기생 Cap의 영향을 받는다는 점을 밝힌다.

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