• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.7
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• pp.17-24
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• 1998

We proposed a novel bondwire inductor buried in plastic package for low cost MMIC and characaterized the electrical perofmrance in a wide frequency range using the full-wave analysis of finite element method(FEM), and then we fabricated and measured the scale-up model in order to prove the characteristics. Th ebondwire inductor has higher quality factor and higher cutoff frequency than the conventional spiral inductor designed n the same area as the bondwire inductor. Since the air-bridge process is not requried for the bondwire inductor, it is very suitable for low cost plastic-packaged MMIC production. The bondwire inductor has the field distribution localized around the bondwire inductor and hence is more compatible to the crosstalk problems.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.12
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• pp.553-558
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• 2002

In this paper, an integrated balun using bondwire transformer is fabricated and measured. The bondwire transformer has 1ow conductor and substrate loss and kas high resonance frequency. So it is available to implement low loss broadband balun. From the measured results, 0.7 dB amplitude imbalance and about 2.5 $^{\circ}$ phase imbalance was achieved from 8.15 to 16.18 GHz. It is expected that the proposed balun can improve the performance of mixers, amplifiers and matching networks of antennas. It can also be integrated with other components due to its easier fabrication and smaller size than spiral transformer balun.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.12
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• pp.559-565
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• 2002

Today, because a quality factor of the inductor fabricated on silicon substrate for RFIC is under 12, the realization of inductor haying high-Q is essential. In this paper, two inductors having improved Q-factor are proposed and fabricated using a bondwire on silicon substrate. Also for the PGS is applied to the same inductors, four inductors are fabricated finally The bondwire Inductors have the relatively low conductor loss due to wide cross-section area and they can reduce the parastic capacitance very much because they are located in the air. Simulation and measurement results show that the proposed inductors have much more improved Q-factor, 15, than a conventional spiral inductor at 1.5 GHz. Because of the use of an automatic bonding machine, we can fabricate the high - Q inductors very easily, repeatedly.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.2
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• pp.81-91
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• 2002

In this paper, a high-quality integrated transformer using bondwires is proposed and fabricated. The bondwire transformer inherently has low conductor loss due to wide cross-section and small parasitic capacitance because the vertical placement of the bondwire loop separates from substrate and effectively reduces the substrate effects. It can be fabricated easily by used of the modern automatic wirebonding technology. The electrical characteristics of the fabricated transformers are compared with those of the spiral transformer It is expected that the bondwire transformer can improve the performance for RFIC and MMIC applied to a variety of application, for example, Mixer, Balanced Amplifier, VCO, and LNA.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.7
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• pp.71-78
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• 1997

In this paper, we analyzed the crosstalk characteristics of LD array modules for WDM and improved the crosstalk levels using a screening line between access lines. From the calculation resutls, we have found that inductive crosstalk of access lines is dominant for the low impedance LD arrays with short bondwire interconnections. The proposed array interconnecton with the screening line and ouble bondwires, rduces the crosstalk level about 10dB compared to conventional interconnections using simple access lines and a single bondwire. This proposed structure also can be easily imlemented with transmission reliability.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.6
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• pp.231-237
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• 2016

This paper presents a multiband low phase noise CMOS VCO with wide frequency tunability using switched bondwire inductor bank. The combination of bondwire inductor and CMOS switch transistor enhances frequency tunability and improves phase noise characteristics. The proposed multiband VCO operates from 2.3GHz to 6.3GHz with phase noise of -136dBc/Hz and -122dBc/Hz at 1 MHz offset frequency, respectively. Switched bondwire inductor bank shows high quality factor(Q) at each frequency band, which allows better tradeoff between phase noise and power consumption. The proposed VCO is designed in TSMC 0.18um CMOS process and consumes 7.2 mW power resulting in figure of merit(FOM) of -189.3dBc/Hz at 1 MHz offset from 6GHz carrier frequency.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.21-26
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• 1997

The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.9
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• pp.28-35
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• 1997

A novel high-Q vertical jinductor for MMICs is proposed and characterized in a wide range of frequencies (DC~10 GHz) using the numerical methods such as the PeEC(partial equivalent element circuit), the FDM (finite difference method) and the MoM (method of moments). Electrical superiority of the vertical inductor to the horizontal is observed in terms of the magnetic flux linkage and the ground screening effect. The veritcal bondwire inductor is designed in consideration of the wire bonding feasibility and the optimum electrical peformance. This structure is also analyzed using the equivalent circuit and compared with the conventional spiral inductors From the calculated results, high Q-factor, inductance, and cut-off frequency are observed to be inherent characteristics of the veritcal bondwire inductor.

• International journal of advanced smart convergence
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• v.9 no.1
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• pp.172-176
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• 2020

The implementation of a low phase noise voltage controlled oscillator (VCO) is important for the signal integrity of wireless communication terminal. A low phase noise wideband VCO for a wireless local area network (WLAN) application is presented in this paper. A 6-bit coarse tune capacitor bank (capbank) and a fine tune varactor are used in the VCO to cover the target band. The simulated oscillation frequency tuning range is from 8.6 to 11.6 GHz. The proposed VCO is desgned using 65 nm CMOS technology with a high quality (Q) factor bondwire inductor. The VCO is biased with 1.8 V VDD and shows 9.7 mA current consumption. The VCO exhibits a phase noise of -122.77 and -111.14 dBc/Hz at 1 MHz offset from 8.6 and 11.6 GHz carrier frequency, respectively. The calculated figure of merit(FOM) is -189 dBC/Hz at 1 MHz offset from 8.6 GHz carrier. The simulated results show that the proposed VCO performance satisfies the required specification of WLAN standard.