Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of Solder Printing Conditions and External Factors on Printing Efficiency

솔더 인쇄조건 및 외적요소가 인쇄효율에 미치는 영향

  • Ha, Chung-Soo (Department of Nanobiotronics, Graduate School of Hoseo University) ;
  • Kwon, Hyuk-Ku (Department of Nanobiotronics, Graduate School of Hoseo University)
  • 하충수 (호서대학교 나노바이오트로닉스학과) ;
  • 권혁구 (호서대학교 나노바이오트로닉스학과)
  • Received : 2018.02.22
  • Accepted : 2018.03.20
  • Published : 2018.03.31
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Abstract

Under the 4th Industrial Revolution, implementation of Smart Factory in the field of surface mounting is an emerging issue. In the field of surface mounting, many researches are going on in line with these changes. Among them, we analyzed the method of optimizing the solder printing process which is a core process and the influence of the external factors affecting the printing efficiency. In this analysis, the Big Data provided by the SPI Machine was used to approach the statistical method, and the possibility of predicting the result through simulation with reliable results was confirmed. I hope this study contributes a little to the Smart Factory implementation.

최근 4차 산업혁명의 조류 하에 표면 실장 분야에서도 Smart Factory 구현을 위한 노력이 활발히 이루어지고 있다. 표면 실장 분야에서도 이러한 변화와 발 맞추어 많은 연구가 진행되고 있으며, 그중 핵심 공정이라 할 수 있는 솔더 인쇄 공정의 최적화에 대한 방법과 인쇄 효율에 영향을 미치는 인쇄 외적 요소에 대한 영향도를 분석하였다. 이 분석에는 설비에서 제공하는 Big Data를 활용하여 통계적 방법으로 접근하였고, 신뢰성 높은 결과와 함께 시뮬레이션을 통해 결과을 예측할 수 있는 가능성을 확인하였다. 이 연구가 실장 분야의 Smart Factory 구현에 조금이나마 기여가 되었으면 하는 바람이다.

Keywords

References

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