• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.23-28
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• 2018

Under the 4th Industrial Revolution, implementation of Smart Factory in the field of surface mounting is an emerging issue. In the field of surface mounting, many researches are going on in line with these changes. Among them, we analyzed the method of optimizing the solder printing process which is a core process and the influence of the external factors affecting the printing efficiency. In this analysis, the Big Data provided by the SPI Machine was used to approach the statistical method, and the possibility of predicting the result through simulation with reliable results was confirmed. I hope this study contributes a little to the Smart Factory implementation.