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A Study on the Quality Improvment of PCB by Improving Power Consumption for Radar

레이더장비에 적용되는 통신 IC 소비전력 개선을 통한 회로카드조립체 품질 향상에 관한 연구

  • Jo, Hee-Jin (The 3rd Team of Ammunition Center, Defense Agency for Technology and Quality) ;
  • Gwak, Hye-Rim (The 4th Team of Ammunition Center, Defense Agency for Technology and Quality)
  • 조희진 (국방기술품질원 탄약3팀) ;
  • 곽혜림 (국방기술품질원 탄약4팀)
  • Received : 2018.09.20
  • Accepted : 2018.12.07
  • Published : 2018.12.31

Abstract

This study examined the quality improvement of printed circuit boards (PCBs) in relation to the power consumption for radar. The radar examined is currently in production and being used by the military. The PCB converts 28 V DC to 5 V DC but frequently malfunctions. Therefore, cause analysis was carried out. As a result, the power consumed by a certain communication IC was very high, and the heat generated by the high power consumption caused damage to the surrounding parts. Accordingly, it was changed to an improved communication IC that meets all the radar system specifications. System tests were carried out for the changed communication IC to check the impact on the system, and environmental tests were performed, which proved that the performance required by the radar system is satisfactory. As a result of this improvement, there has been no history of failure in this PCB so far. Therefore, the quality of this PCB has been improved.

본 논문은 레이더 장비에 적용되는 통신 IC 소비 전력 개선을 통한 회로카드조립체 품질 향상에 관한 연구이다. 본 논문에서 언급하는 레이더는 현재 양산이 진행중이며, 군에서 사용중인 장비이다. 군에서 레이더 운용중 DC 28V를 입력으로 받아 DC 5V로 변환시키는 회로카드조립체에서 유독 반복적 고장이 지속적으로 발생했다. 따라서 해당 회로카드조립체 고장에 대한 원인분석을 수행하였다. 그 결과 특정 통신 IC에서 소비되는 전력이 매우 높음을 발견하였으며, 그에 따라 발생된 열에 의해 주위 부품이 소손됨을 알 수 있었다. 따라서 레이더 체계 규격을 모두 만족하는 개선된 부품으로 변경하였다. 변경된 부품에 대하여 체계 영향성 확인을 위한 체계 부착시험을 수행하여 검증하였으며, 환경시험(고온저장 및 운용시험, 저온저장 및 운용시험, 습도시험, 진동시험, EMI 시험)을 통해 레이더 체계에서 요구하는 성능요구조건을 모두 만족함을 확인하였다. 이번 개선을 통해 현재까지 절연 회로카드조립체에서 발생한 고장은 없으므로 해당 회로카드조립체의 품질이 향상됨을 확인하였다.

Keywords

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Fig. 1. The figuration and composition of Radar Control Unit(inside)

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Fig. 2. The figuration and composition of Radar Control Unit(outside)

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Fig. 3. The flowchart of the role on PCB

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Fig. 4. The circuit of PCB

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Fig. 5. The figuration of PCB(front side)

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Fig. 6. The figuration of PCB(back side)

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Fig. 7. The datasheet of DS75176BTM

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Fig. 8. The datasheet of MAX1487EESA

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Fig. 9. The temperature of R17(a), ambient temperature(b)and consumption current(c) on DS75176BTM

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Fig. 10. The temperature of R17(a), ambienttemperature(b) and consumption current(c) on MAX1487EESA

Table 1. The Comparison Table of Performance

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Table 2. The Temperature and consumption current before and after change

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References

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  2. Datasheet, "DS7517B/DS7517BT Multipoint RS-485/ RS-422 Transceivers", Texas Instruments
  3. Datasheet, "${\pm}$15kV ESD-Protected, Slew-Rate-Limited, Low-Power, RS-485/RS-422 Transceivers", Maxim Integrated
  4. Jong. Soo. Choi., and Chang. Woo. Lee., "A Study on ESS Process Modeling and Application for improving Reliability of Electronic Equipments", J. of the Korean society for quality management, Vol. 40, No. 3 pp. 286-294. 2012. DOI: https://dx.doi.org/10.7469/jksqm.2012.40.3.286
  5. Hee. Jin. Jo,, Min. Woo. Kim., Hye. Rim. Gwak., "A Study on the Life-time Prediction for the Rubber O-ring applied to decoy through the Accelerated Life Test", Journal of the Korea Academia-Industrial cooperation Society, Vol. 17, No. 10 pp. 182-188, 2016. DOI: https://dx.doi.org/10.5762/kais.2016.17.10.182