한국재료학회지 (Korean Journal of Materials Research)

  • 제26권8호
  • /
  • Pages.427-429
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  • 2016
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  • 1225-0562(pISSN)
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  • 2287-7258(eISSN)
한국재료학회 (Materials Research Society of Korea)
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Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

  • Lee, Woojin (Process Development Team, Semiconductor R&D Center, Samsung Electronics Co., LTD.) ;
  • Kim, Tae Hyung (Department of Fusion Chemical Engineering, Hanyang University) ;
  • Choa, Yong-Ho (Department of Fusion Chemical Engineering, Hanyang University)
  • 투고 : 2016.07.01
  • 심사 : 2016.07.04
  • 발행 : 2016.08.27
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초록

A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.

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참고문헌

  1. M. Borhr and Y. A. Elmansy, IEEE Trans. Electron Devices, 45, 620 (1998). https://doi.org/10.1109/16.661223
  2. The International Technology Roadmap for Semiconductors. 2004 Update.
  3. Z. C. Wu, Z. W. Shiung, C. C. Chiang, W. H. Wu, M. C. Chen, S. M. Jeng, W. Chang, P. F. Chou, S. M. Jang, C. H. Yu and M. S. Liang, J. Electrochem. Soc., 148, F115 (2001). https://doi.org/10.1149/1.1368108
  4. G. Y. Lee, D. C. Edelstein, R. Conti, W. Cote, K. S. Low, D. Dobuzinsky, G. Feng, K. Dev, P. Wrschka, P. Shafer, R. Ramachandran, A. Simpson, E. Liniger, E. Simonyi, T. Dalton, T. Spooner, C. Jahnes, E. Kaltalioglu and A. Grill, Advanced Metallization Conference, SanDiego, CA, 3-5 (2000).
  5. A. Grill and V. Patel, Mater. Res. Soc. Symp. Proc., 612, D2.9.1. (2000).
  6. K. C. Shin, H. B. Lee, O. K. Kwon, H. S. Park, W. Koh and S. W. Kang, J. Electrochem. Soc., 149, G109 (2002). https://doi.org/10.1149/1.1430230