참고문헌
- Wikipedia, Wikipedia Foundation Inc. Dec. (2013) from http://en.wikipedia.org/wiki/IPhone_(first_generation)
- J. Y. Choi and T. S. Oh, "Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging", J. Microelectron. Packag. Soc., 20(4) 17 (2013). https://doi.org/10.6117/kmeps.2013.20.4.017
- M. Gonzalez, B. Vandervelde, W. Chistianens, Y.-Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis and P.H.M. Timmermans, "Thermo-Mechanical Analysis of Flexible and Stretchable Systems", 11th International Conference of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Berlin, 1, Institute of Electrical and Electronics Engineers (2010).
- J. H. Ahn, H. Lee and S. H. Choa, "Technology of Flexible Semiconductor/Memory Device", J. Microelectron. Packag. Soc., 20(2), 1 (2013). https://doi.org/10.6117/kmeps.2013.20.2.001
- J. Xiao, A. Carlson, Z. J. Liu, Y. Huang, H. Jiang and J. A. Rogers, "Stretchable and Compressible Thin Films of Stiff Materials on Compliant Wavy Substrates", App. Phys. Lett., 93, 013109 (2008). https://doi.org/10.1063/1.2955829
- T. Lher, D. Manessis, R. Heinrich, B. Schmied, J. Vanfleteren, J. DeBaets, A. Ostmann and H. Reichl, "Stretchable Electronic Systems", Proc. 59th Electronic Components and Technology Conference (ECTC), San Diego, 893, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2009).
- T. Sekitani, Y. Noguchi, K. Hata, T. Fukushima, T. Aida and T. Someya, "A Rubberlike Stretchable Active Matrix Using Elastic Conductors", Science, 321, 1468 (2008). https://doi.org/10.1126/science.1160309
- D. H. Kim, J. H. Ahn, W. M. Choi, H. S. Kim, T. H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu and J. A. Rogers, "Stretchable and Foldable Silicon Integrated Circuits", Science, 320, 507 (2008). https://doi.org/10.1126/science.1154367
- M. Gonzalez, F. Axisa, M. V. Bulcke, D. Brosteaux, B. Vandevelde and J. Vanfleteren, "Design of Metal Interconnects for Stretchable Electronic Circuits", Microelectron. Reliab., 48, 825 (2008). https://doi.org/10.1016/j.microrel.2008.03.025
- T. Sekitani, H. Nakajima, H. Maeda, T. Fukushima, T. Aida, K. Hata, and T. Someya, "Stretchable Active-Matrix Organic Light-Emitting Diode Display Using Printable Elastic Conductors", Nature Mater., 8, 494 (2009). https://doi.org/10.1038/nmat2459
- J. H. Ahn and J. H. Je, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys., 45, 102001 (2012).
- D. H. Kim and J. A. Rogers, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater., 20, 4887 (2008). https://doi.org/10.1002/adma.200801788
- J. Y. Choi, D. H. Park and T. S. Oh, "Chip Interconnection Process for Smart Fabrics Using Flip-Chip Bonding of SnBi Solder", J. Microelectron. Packag. Soc., 19(3), 71 (2012). https://doi.org/10.6117/kmeps.2012.19.3.071
- S. P. Lacoura, S. Wagner, Z. Huang and Z. Suo, "Stretchable Gold Conductors on Elastomeric Substrates", Appl. Phys. Lett., 82, 2404 (2003). https://doi.org/10.1063/1.1565683
- Y. K. Son, J. E. Kim and I. Y. Cho, "Trends on Wearable Computer Technology and Market", Electronics and Telecommunications Trends, 23, 79 (2008).
- J. E. Kim, H. T. Jeong and I. Y. Cho, "Trend in Digital Clothing Technology", Electronics and Telecommunications Trends, 24, 20 (2009).
- T. Linz, R. Vieroth, C. Dils, M. Koch, T. Braun, K. F. Becker, C. Kallmayer and S. M. Hong, "Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications", Adv. Sci. Technol., 60, 85 (2008). https://doi.org/10.4028/www.scientific.net/AST.60.85
- A. Befahy, P. Lipnik, T. Pardoen, C. Nascimento, B. Patris, P. Bertrand and S. Yunus, "Thickness and Elastic Modulus of Plasma Treated PDMS Silica-like Surface Layer", Langmuir, 26(5), 3372 (2010). https://doi.org/10.1021/la903154y
- I. D. Johnston, D. K. McCluskey, C. K. L. Tan and M. C. Tracey, "Mechanical Characterization of Bulk Sylgard 184 for Microfluidics and Microengineering", J. Micromech. Microeng., 24, 035017 (2014). https://doi.org/10.1088/0960-1317/24/3/035017
- J. C. Lotters, W. Olthuis, P. H. Veltink and P. Bergveld, "The Mechanical Properties of the Rubber Elastic Polymer Polydimethylsilicone for Sensor Applications", J. Micromech. Microeng., 7, 145 (1997). https://doi.org/10.1088/0960-1317/7/3/017
- I. Wong and C. M. Ho, "Surface Molecular Property Modifications for Poly(dimethylsilicone) (PDMS) Based Microfluidic Devices", Microfluid Nanofluid, 7, 291 (2009). https://doi.org/10.1007/s10404-009-0443-4
- T. K. Kim, J. K. Kim and O. C. Jeong, "Measurement of Nonlinear Mechanical Properties of PDMS Elastomer", Microelectron. Eng., 88, 1982 (2011). https://doi.org/10.1016/j.mee.2010.12.108
- F. Schneider, T. Fellner, J. Wilde and U. Wallrabe, "Mechanical Properties of Silicones for MEMS", J. Micromech. Microeng., 18, 065008 (2008). https://doi.org/10.1088/0960-1317/18/6/065008
- E. Gutierrez and A. Groisman, "Measurement of Elastic Moduli of Silicone Gel Substrates with a Microfluidic Device", Plos One, 6(9), e25534 (2011). https://doi.org/10.1371/journal.pone.0025534
- A. Mata, A. J. Fleischman and S. Roy, "Characterization of Polydimethylsilicone (PDMS) Properties for Biomedical Micro/Nanosystems", Biomedical Microdevices, 7(4), 281 (2005). https://doi.org/10.1007/s10544-005-6070-2
- E. A. Wilder, S. Guo, S. Lin-Gibson, M. J. Fasolka and C. M. Stafford, "Measuring the Modulus of Soft Polymer Network via a Buckling-Based Metrology", Macromolecules, 39, 4138 (2009).
- Z. Wang, A. A. Volinsky and N. D. Gallant, "Crosslinking Effect on Polydimethylsiloxane Elastic Modulus Measured by Custom-Built Compression Instrument", J. Appl. Polym. Sci., 131(22) (2014).
- R. N. Palchesko, L. Zang, Y. Sun and A. W. Feinberg, "Development of Polydimethylsiloxane Substrates with Tunable Elastic Modulus to Study Cell Mechanobiology in Muscle and Nerve", Plos One, 7(12), e51499 (2012). https://doi.org/10.1371/journal.pone.0051499
-
"Information about Dow Corning
${(R)}$ brand Silicone Encapsulants", Dow Corning Corp., Midland (2005). - G. E. Dieter, "Mechanical Metallurgy", SI Metric Edition, pp.37-58, McGraw-Hill Book Co., London (1988).
- K. Khanafer, A. Duprey, M. Schlicht and R. Berguer, "Effects of Strain Rate, Mixing Ratio, and Stress-Strain Definition on the Mechanical Behavior of the Polydimethylsiloxane (PDMS) Materials as Related to Its Biological Applications", Biomed Microdevices, 11, 503 (2009). https://doi.org/10.1007/s10544-008-9256-6
- J. H. Seo, K. Sakai and N. Yui, "Adsorption State of Fibronectin on Poly(dimethylsiloxane) Surfaces with Varied Stiffness Can Dominate Adhesion Density of Fibroblasts", Acta Biomater., 9, 5493 (2013). https://doi.org/10.1016/j.actbio.2012.10.015
- V. Studer, G. Hang, A. Pandolfi, M. Ortiz, W. CF. Anderson and S. R. Quake, "Scaling Properties of a Low-actuation Pressure Microfluidic Valve", J. Appl. Phys., 95, 393 (2004). https://doi.org/10.1063/1.1629781
- P. Du, I.-K. Lin, H. Lu and X. Zhang, "Extension of the Beam Theory for Polymer Bio-Transducers with Low Aspect Ratios and Viscoelastic Characteristics", J. Micromech. Microeng., 20, 095916 (2010).
- D. W. Inglis, "A Method of Reducing Pressure-Induced Deformation in Silicone Microfluidics", Biomicrofluidics, 4, 026504 (2010). https://doi.org/10.1063/1.3431715
피인용 문헌
- Study of Standardization and Test Certification for Wearable Smart Devices vol.23, pp.4, 2016, https://doi.org/10.6117/kmeps.2016.23.4.011
- Stretchable Characteristics of Thin Au Film on Polydimethylsiloxane Substrate with Parylene Intermediate Layer for Stretchable Electronic Packaging vol.47, pp.1, 2018, https://doi.org/10.1007/s11664-017-5722-3
- Deformation Behavior of Locally Stiffness-variant Stretchable Substrates Consisting of the Island Structure vol.22, pp.4, 2015, https://doi.org/10.6117/kmeps.2015.22.4.117
- Elastic Modulus of Locally Stiffness-variant Polydimethylsiloxane Substrates for Stretchable Electronic Packaging Applications vol.22, pp.4, 2015, https://doi.org/10.6117/kmeps.2015.22.4.091
- Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates vol.58, pp.8, 2017, https://doi.org/10.2320/matertrans.M2017066
- 신축 전자패키지 배선용 금속박막의 신축변형-저항 특성 II. Au, Pt 및 Cu 박막의 특성 비교 vol.24, pp.3, 2014, https://doi.org/10.6117/kmeps.2017.24.3.019
- 신축 전자패키지 배선용 금속박막의 신축변형-저항 특성 I. Parylene F 중간층 및 PDMS 기판의 Swelling에 의한 영향 vol.24, pp.3, 2014, https://doi.org/10.6117/kmeps.2017.24.3.027
- 비틀림 변형 중 ITO 필름의 시편 형태에 따른 기계적 전기적 파괴 연구 vol.24, pp.4, 2014, https://doi.org/10.6117/kmeps.2017.24.4.053
- 신축성 전자패키지용 강성도 국부변환 신축기판의 계면접착력 향상공정 vol.25, pp.4, 2014, https://doi.org/10.6117/kmeps.2018.25.4.111
- PDMS-Ecoflex 하이브리드 소재를 이용한 투명 신축성 기판의 기계적 및 광학적 특성 vol.25, pp.4, 2014, https://doi.org/10.6117/kmeps.2018.25.4.129
- Island-Bridge 구조의 강성도 경사형 신축 전자패키지의 유효 탄성계수 및 변형거동 분석 vol.26, pp.4, 2019, https://doi.org/10.6117/kmeps.2019.26.4.039
- PDMS 기반 강성도 경사형 신축 전자패키지의 신축변형-저항 특성 vol.26, pp.4, 2014, https://doi.org/10.6117/kmeps.2019.26.4.047
- 강성도 경사형 신축 전자패키지의 탄성특성 및 반복변형 신뢰성 vol.26, pp.4, 2014, https://doi.org/10.6117/kmeps.2019.26.4.055
- 나노 잔류응력 측정을 위한 비등방 압입자의 깊이별 응력환산계수 분석 vol.26, pp.4, 2019, https://doi.org/10.6117/kmeps.2019.26.4.095
- PDMS로 충진된 신축열전모듈의 신축특성과 발전특성 vol.26, pp.4, 2014, https://doi.org/10.6117/kmeps.2019.26.4.149
- 칩-섬유 배선을 위한 본딩 기술 vol.27, pp.4, 2020, https://doi.org/10.6117/kmeps.2020.27.4.001