DOI QR코드

DOI QR Code

A Channel Model of Scaled RC-dominant Wires for High-Speed Wireline Transceiver Design

  • Choi, Minsoo (Department of Electrical Engineering, Pohang University of Science and Technology) ;
  • Sim, Jae-Yoon (Department of Electrical Engineering, Pohang University of Science and Technology) ;
  • Park, Hong-June (Division of IT Convergence Engineering, Pohang University of Science and Technology) ;
  • Kim, Byungsub (Department of Creative IT Engineering, Pohang University of Science and Technology)
  • Received : 2013.05.26
  • Accepted : 2013.07.12
  • Published : 2013.10.31

Abstract

This paper explains modeling and analysis of RC-dominant wires for high-speed wireline transceiver design. A closed form formula derived from telegrapher's equation accurately describes a frequency response of an RC-dominant wire, yet it is simple and intuitive for designers to easily understand design trade-offs without a complex numerical equation solver. This paper explains how the model is derived and how it can help designers in example transceiver designs.

Keywords

References

  1. T. Kuroda, "CMOS design challenges to power wall," IEEE Int. Microprocesses and Nanotechnology Conf., 2001, pp. 6-7.
  2. B. Kim, "Equalized On-Chip Interconnect: Modeling Analysis and Design," Ph.D. dissertation, Dept. EECS, MIT, Cambridge, MA, 2010.
  3. B. Kim and V. Stojanović, "Characterization of Equalized and Repeated Interconnects for NoC Applications," IEEE J. Design and Test of Computers, vol. 25, no. 5, pp. 430-439, Oct. 2008. https://doi.org/10.1109/MDT.2008.137
  4. B. Kim and V. Stojanović, "Equalized Interconnect for On-Chip Network: Modeling and Optimization Framework," IEEE/ACM Int. Computer- Aided Design Conf., Nov. 2007, pp.552-559.
  5. S. Kwak, Y. Jo, J. Jo, and S. Kim, "Power Integrity and Shielding Effectiveness Modeling of Grid Structured Interconnects on PCBs," Journal of Semiconductor Technology and Science, vol. 12, no. 3, pp. 320-330, Sep. 2013.
  6. J. U. Knickerbocker et al., "Development of nextgeneration system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection," IBM J. Research and Development, vol. 49, no. 4/5 July/September 2005.
  7. B. Kim et al., "A 10-Gb/s Compact Low-Power Serial I/O with DFE-IIR Equalization in 65-nm CMOS," IEEE J. Solid-State Circuits, vol. 44, no. 12, pp. 3526-3538, Dec. 2011.
  8. Y. Liu et al., "A 10Gb/s Compact Low-Power Serial I/O with DFE-IIR Equalization in 65nm CMOS," IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers, Feb. 2009, pp. 182-183.
  9. U. Kang et al., "8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology," IEEE J. Solid- State Circuits, vol. 45, no. 1, pp. 111-119, Jan. 2010. https://doi.org/10.1109/JSSC.2009.2034408
  10. S. Vangal et al., "An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS," IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers, Feb. 2007, pp. 98-99, 589.
  11. B. Kim and V. Stojanović, "An Energy-Efficient Equalized Transceiver for RC-Dominant Channels," IEEE J. Solid-State Circuits, vol. 45, no. 6, pp. 1186-1197, June 2010. https://doi.org/10.1109/JSSC.2010.2047458
  12. B. Kim and V. Stojanović, "A 4Gb/s/ch 356fJ/b 10mm Equalized On-chip Interconnect with Nonlinear Charge-Injecting Transmit Filter and Trans- impedance Receiver in 90nm CMOS," IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers, Feb. 2009, vol. 978, pp. 66-67, 978.
  13. A. Joshi, B. Kim, and V. Stojanović, "Designing Energy-Efficient Low-Diameter On-chip Networks with Equalized Interconnects," IEEE Symp. High- Performance Interconnects, Aug. 2009, pp. 3-12.
  14. M. N. O. Sadiku and L. C. Agba, "A simple introduction to the transmission-line modeling," IEEE Trans. Circuits Syst. II, Analog Digit. Signal Process., vol. 37, no. 8, pp. 991-999, Aug. 1990.
  15. W. C. Elmore, "The Transient Response of Damped Linear Networks with Particular Regard to Wideband Amplifiers", J. Applied Physics, pp. 55-63, Jan. 1948.
  16. T. Kim, Y. Song, and Y. Eo, "Timing Analysis of Discontinuous RC Interconnect Lines," Journal of Semiconductor Technology and Science, vol. 9, no. 1, pp. 8-13, Mar. 2009. https://doi.org/10.5573/JSTS.2009.9.1.008
  17. E. N. Protonotarios, "Optimal transfer-function synthesis of RC ladders-lumped and distributed," IEEE Trans. Circuits Systems, vol. CAS-21, pp. 49- 56, Jan. 1974.
  18. B. Kim, "An Analytical Model of Scaled RCdominant Wires for High-Speed Wireline Transceiver Design," IEEE Int. Midwest Symp. Circuits and Systems, Aug. 2011, pp. 1-4.

Cited by

  1. Verilog Modeling of Transmission Line for USB 2.0 High-Speed PHY Interface vol.14, pp.4, 2014, https://doi.org/10.5573/JSTS.2014.14.4.463
  2. An Approximate Closed-Form Channel Model for Diverse Interconnect Applications vol.61, pp.10, 2014, https://doi.org/10.1109/TCSI.2014.2327275
  3. A 40-mV-Swing Single-Ended Transceiver for TSV with a Switched-Diode RX Termination vol.61, pp.12, 2014, https://doi.org/10.1109/TCSII.2014.2362660
  4. An Approximate Closed-Form Transfer Function Model for Diverse Differential Interconnects vol.62, pp.5, 2015, https://doi.org/10.1109/TCSI.2015.2407435