A Study on Pb/63Sn Solder Bumps Formation using a Solder Droplet Jetting Method (Solder Droplet Jetting 방법을 이용한 Pb/63Sn 솔더 범프의 형성에 관한 연구)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2003.11a
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- pp.122-127
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- 2003