Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Effects of Ball Milling Condition on Sintering of Cu, Zn, Sn and Se Mixed Powders

Cu, Zn, Sn, Se 혼합 분말의 소결특성에 미치는 볼밀링 영향

  • Ahn, Jong-Heon (School of Materials Engineering, Yeungnam University Gyongsan) ;
  • Jung, Woon-Hwa (School of Materials Engineering, Yeungnam University Gyongsan) ;
  • Jang, Yun-Jung (School of Materials Engineering, Yeungnam University Gyongsan) ;
  • Lee, Seong-Heon (School of Materials Engineering, Yeungnam University Gyongsan) ;
  • Kim, Kyoo-Ho (School of Materials Engineering, Yeungnam University Gyongsan)
  • 안종헌 (영남대학교 신소재공학부) ;
  • 정운화 (영남대학교 신소재공학부) ;
  • 장윤정 (영남대학교 신소재공학부) ;
  • 이성헌 (영남대학교 신소재공학부) ;
  • 김규호 (영남대학교 신소재공학부)
  • Received : 2011.02.08
  • Accepted : 2011.05.06
  • Published : 2011.06.28
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Abstract

In order to make a $Cu_2ZnSnSe_4$ (CZTSe) sputtering target sintered for solar cell application, synthesis of CZTSe compound by solid state reaction of Cu, Zn, Sn and Se mixed powders and effects of ball milling condition on sinterability such as ball size, combination of ball size, ball milling time and sintering temperature, was investigated. As a result of this research, sintering at $500^{\circ}C$ after ball milling using mixed balls of 1 mm and 3 mm for 72 hours was the optimum condition to synthesis near stoichiometric composition of $Cu_2ZnSnSe_4$ and to prepare sintered pellet with high density relatively.

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References

  1. S. Ishizuka, A. Yamada, K. Matsubara, P. Fons, K. Sakurai and S. Niki: Curr. Appl. Phys., 10 Supplement (2010) S154. https://doi.org/10.1016/j.cap.2009.11.024
  2. T. Wada, Y. Hashimoto, S. Nishiwaki, T. Satoh, S. Hayashi, T. Negami and H. Miyake: Sol. Energ. Mater. Sol. Cells, 67 (2001) 305. https://doi.org/10.1016/S0927-0248(00)00296-8
  3. T. Negami, T. Satoh, Y. Hashimoto, S. Shimakawa, S. Hayashi, M. Muro, H. Inoue and M. Kitagawa: Thin. Solid. Films, 403 (2002) 197. https://doi.org/10.1016/S0040-6090(01)01524-3
  4. H. Katagiri, K. Jimbo, W. S. Maw, K. Oishi, M. Yamazaki, H. Araki and A. Takeuchi: Thin. Solid. Films, 517 (2009) 2455. https://doi.org/10.1016/j.tsf.2008.11.002
  5. T. Tanaka, A. Yoshida, D. Saiki, K. Saito, Q. Guo, M. Nishio and T. Yamaguchi: Thin. Solid. Films, 518 Supplement 1 (2010) S29. https://doi.org/10.1016/j.tsf.2010.03.026
  6. J. S. Seol, S. Y. Lee, J. C. Lee, H. D. Nam and K. H. Kim: Sol. Energ. Mater. Sol. Cells, 75 (2003) 155. https://doi.org/10.1016/S0927-0248(02)00127-7
  7. G. S. Babu, Y. B. Kumar, P. D. Bhaskar and S. R. Vanjari: Sol. Energ. Mater. Sol. Cells, 94 (2010) 221. https://doi.org/10.1016/j.solmat.2009.09.005
  8. P. M. P. Salom, P. A. Fernandes and A. F. da Cunha: Thin. Solid. Films, 517 (2009) 2531. https://doi.org/10.1016/j.tsf.2008.11.034
  9. H. Araki, A. Mikaduki, Y. Kubo, T. Sato, K. Jimbo, W. S. Maw, H. Katagiri, M. Yamazaki, K. Oishi and A. Takeuchi: Thin. Solid. Films, 517 (2008) 1457 https://doi.org/10.1016/j.tsf.2008.09.058
  10. O. Volobujeva, J. Raudoja, E. Mellikov, M. Grossberg, S. Bereznev and R. Traksmaa: J. Phys. Chem, Solids, 70 (2009) 567. https://doi.org/10.1016/j.jpcs.2008.12.010
  11. R. A. Wibowo, W. S. Kim, E. S. Lee, B. Munir and K. H. Kim: J. Phy. Chem. Solids, 68 (2007) 1908. https://doi.org/10.1016/j.jpcs.2007.05.022
  12. R. A. Wibowo, W. H. Jung and K. H. Kim: J. Phys. Chem. Solids, 71 (2010) 1702. https://doi.org/10.1016/j.jpcs.2010.08.012
  13. H. Matsushita, T. Maeda, A. Katsui and T. Takizawa: J. Cryst. Growth, 208 (2000) 416. https://doi.org/10.1016/S0022-0248(99)00468-6
  14. R. A. Wibowo, W. H. Jung, M. H. Al-Faruqi, I. Amal and K. H. Kim: Mater. Chem. Phys., 124 (2010) 1006. https://doi.org/10.1016/j.matchemphys.2010.08.020
  15. C. Suryanarayana: Prog, Mater. Sci., 46 (2001) 1. https://doi.org/10.1016/S0079-6425(99)00010-9
  16. M. Azimi and G. H. Akbari: J. Alloy. Comp., 509 (2011) 27. https://doi.org/10.1016/j.jallcom.2010.08.071
  17. A. Savitskii: Metal. Powder Report, 54 (1999) 42.
  18. Z. Zhang, R. Sandstrm and L. Wang: J. Mater. Process. Tech., 152 (2004) 131. https://doi.org/10.1016/j.jmatprotec.2004.03.025
  19. K. Utsumi, O. Matsunaga and T. Takahata: Thin. Solid. Films, 334 (1998) 30. https://doi.org/10.1016/S0040-6090(98)01111-0
  20. C. C. Koch and J. D. Whittenberger: Intermetallics, 4 (1996) 339. https://doi.org/10.1016/0966-9795(96)00001-5